KR102286993B1 - 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 - Google Patents

반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 Download PDF

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KR102286993B1
KR102286993B1 KR1020187000081A KR20187000081A KR102286993B1 KR 102286993 B1 KR102286993 B1 KR 102286993B1 KR 1020187000081 A KR1020187000081 A KR 1020187000081A KR 20187000081 A KR20187000081 A KR 20187000081A KR 102286993 B1 KR102286993 B1 KR 102286993B1
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mirror
semiconductor device
camera
mirrors
motor
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KR20180015220A (ko
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칼 트루옌스
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
KR1020187000081A 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 Active KR102286993B1 (ko)

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Application Number Priority Date Filing Date Title
KR1020217024180A KR102740720B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05
PCT/US2015/042194 WO2016195726A1 (en) 2015-06-05 2015-07-27 Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Related Child Applications (1)

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KR1020217024180A Division KR102740720B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

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KR20180015220A KR20180015220A (ko) 2018-02-12
KR102286993B1 true KR102286993B1 (ko) 2021-08-10

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KR1020187000081A Active KR102286993B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020217024180A Active KR102740720B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

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Country Link
US (1) US10190994B2 (enExample)
EP (1) EP3281219B1 (enExample)
JP (4) JP2018516371A (enExample)
KR (2) KR102286993B1 (enExample)
CN (2) CN107743583B (enExample)
TW (2) TWI713533B (enExample)
WO (1) WO2016195726A1 (enExample)

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JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
KR102780715B1 (ko) * 2022-02-15 2025-03-12 가부시키가이샤 신가와 검사 장치, 실장 장치, 검사 방법, 및 기억 매체
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
JPWO2024194923A1 (enExample) * 2023-03-17 2024-09-26

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JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置

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JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
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KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
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JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
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JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品

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JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置

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KR20210099172A (ko) 2021-08-11
US20170003231A1 (en) 2017-01-05
TWI746289B (zh) 2021-11-11
TW201721132A (zh) 2017-06-16
KR20180015220A (ko) 2018-02-12
EP3281219B1 (en) 2021-09-29
KR102740720B1 (ko) 2024-12-10
EP3281219A1 (en) 2018-02-14
JP6968221B2 (ja) 2021-11-17
JP2020091300A (ja) 2020-06-11
JP2022009508A (ja) 2022-01-14
CN107743583B (zh) 2023-12-01
TWI713533B (zh) 2020-12-21
WO2016195726A1 (en) 2016-12-08
US10190994B2 (en) 2019-01-29
EP3281219A4 (en) 2018-12-19
JP2023090913A (ja) 2023-06-29
JP7462095B2 (ja) 2024-04-04
JP2018516371A (ja) 2018-06-21
CN107743583A (zh) 2018-02-27
TW202111313A (zh) 2021-03-16
CN117577551A (zh) 2024-02-20

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