JP2018516371A - 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 - Google Patents

半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 Download PDF

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Publication number
JP2018516371A
JP2018516371A JP2017562982A JP2017562982A JP2018516371A JP 2018516371 A JP2018516371 A JP 2018516371A JP 2017562982 A JP2017562982 A JP 2017562982A JP 2017562982 A JP2017562982 A JP 2017562982A JP 2018516371 A JP2018516371 A JP 2018516371A
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mirror
semiconductor device
camera
block
motor
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JP2018516371A5 (enExample
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カール トルエンス
カール トルエンス
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KLA Corp
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KLA Corp
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Publication of JP2018516371A publication Critical patent/JP2018516371A/ja
Publication of JP2018516371A5 publication Critical patent/JP2018516371A5/ja
Priority to JP2020043121A priority Critical patent/JP6968221B2/ja
Priority to JP2021174648A priority patent/JP2022009508A/ja
Priority to JP2023077635A priority patent/JP7462095B2/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
JP2017562982A 2015-06-05 2015-07-27 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 Pending JP2018516371A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020043121A JP6968221B2 (ja) 2015-06-05 2020-03-12 半導体デバイスの側面の検査装置
JP2021174648A JP2022009508A (ja) 2015-06-05 2021-10-26 半導体デバイスの側面の検査装置
JP2023077635A JP7462095B2 (ja) 2015-06-05 2023-05-10 半導体デバイスの側面の検査装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05
PCT/US2015/042194 WO2016195726A1 (en) 2015-06-05 2015-07-27 Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020043121A Division JP6968221B2 (ja) 2015-06-05 2020-03-12 半導体デバイスの側面の検査装置

Publications (2)

Publication Number Publication Date
JP2018516371A true JP2018516371A (ja) 2018-06-21
JP2018516371A5 JP2018516371A5 (enExample) 2018-08-16

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2017562982A Pending JP2018516371A (ja) 2015-06-05 2015-07-27 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
JP2020043121A Active JP6968221B2 (ja) 2015-06-05 2020-03-12 半導体デバイスの側面の検査装置
JP2021174648A Pending JP2022009508A (ja) 2015-06-05 2021-10-26 半導体デバイスの側面の検査装置
JP2023077635A Active JP7462095B2 (ja) 2015-06-05 2023-05-10 半導体デバイスの側面の検査装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2020043121A Active JP6968221B2 (ja) 2015-06-05 2020-03-12 半導体デバイスの側面の検査装置
JP2021174648A Pending JP2022009508A (ja) 2015-06-05 2021-10-26 半導体デバイスの側面の検査装置
JP2023077635A Active JP7462095B2 (ja) 2015-06-05 2023-05-10 半導体デバイスの側面の検査装置

Country Status (7)

Country Link
US (1) US10190994B2 (enExample)
EP (1) EP3281219B1 (enExample)
JP (4) JP2018516371A (enExample)
KR (2) KR102286993B1 (enExample)
CN (2) CN107743583B (enExample)
TW (2) TWI713533B (enExample)
WO (1) WO2016195726A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022009508A (ja) * 2015-06-05 2022-01-14 ケーエルエー コーポレイション 半導体デバイスの側面の検査装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
KR102780715B1 (ko) * 2022-02-15 2025-03-12 가부시키가이샤 신가와 검사 장치, 실장 장치, 검사 방법, 및 기억 매체
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
JPWO2024194923A1 (enExample) * 2023-03-17 2024-09-26

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JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
US20050185181A1 (en) * 2003-03-07 2005-08-25 Ismeca Semiconductor Holding Sa Optical device and inspection module
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置

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JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
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US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
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CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
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TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
CN106062509B (zh) * 2013-11-20 2019-03-08 联达科技设备私人有限公司 用于选择性地检验部件侧壁的装置和方法
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
US20050185181A1 (en) * 2003-03-07 2005-08-25 Ismeca Semiconductor Holding Sa Optical device and inspection module
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022009508A (ja) * 2015-06-05 2022-01-14 ケーエルエー コーポレイション 半導体デバイスの側面の検査装置

Also Published As

Publication number Publication date
KR20210099172A (ko) 2021-08-11
US20170003231A1 (en) 2017-01-05
TWI746289B (zh) 2021-11-11
TW201721132A (zh) 2017-06-16
KR20180015220A (ko) 2018-02-12
EP3281219B1 (en) 2021-09-29
KR102740720B1 (ko) 2024-12-10
EP3281219A1 (en) 2018-02-14
JP6968221B2 (ja) 2021-11-17
JP2020091300A (ja) 2020-06-11
JP2022009508A (ja) 2022-01-14
CN107743583B (zh) 2023-12-01
TWI713533B (zh) 2020-12-21
WO2016195726A1 (en) 2016-12-08
KR102286993B1 (ko) 2021-08-10
US10190994B2 (en) 2019-01-29
EP3281219A4 (en) 2018-12-19
JP2023090913A (ja) 2023-06-29
JP7462095B2 (ja) 2024-04-04
CN107743583A (zh) 2018-02-27
TW202111313A (zh) 2021-03-16
CN117577551A (zh) 2024-02-20

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