CN107743583B - 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 - Google Patents

用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 Download PDF

Info

Publication number
CN107743583B
CN107743583B CN201580080747.5A CN201580080747A CN107743583B CN 107743583 B CN107743583 B CN 107743583B CN 201580080747 A CN201580080747 A CN 201580080747A CN 107743583 B CN107743583 B CN 107743583B
Authority
CN
China
Prior art keywords
mirror
semiconductor device
camera
mirrors
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580080747.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN107743583A (zh
Inventor
卡尔·特鲁叶恩斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Priority to CN202311535411.6A priority Critical patent/CN117577551A/zh
Publication of CN107743583A publication Critical patent/CN107743583A/zh
Application granted granted Critical
Publication of CN107743583B publication Critical patent/CN107743583B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
CN201580080747.5A 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 Active CN107743583B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311535411.6A CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05
PCT/US2015/042194 WO2016195726A1 (en) 2015-06-05 2015-07-27 Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202311535411.6A Division CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Publications (2)

Publication Number Publication Date
CN107743583A CN107743583A (zh) 2018-02-27
CN107743583B true CN107743583B (zh) 2023-12-01

Family

ID=57441508

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580080747.5A Active CN107743583B (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
CN202311535411.6A Pending CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202311535411.6A Pending CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Country Status (7)

Country Link
US (1) US10190994B2 (enExample)
EP (1) EP3281219B1 (enExample)
JP (4) JP2018516371A (enExample)
KR (2) KR102286993B1 (enExample)
CN (2) CN107743583B (enExample)
TW (2) TWI713533B (enExample)
WO (1) WO2016195726A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
KR102780715B1 (ko) * 2022-02-15 2025-03-12 가부시키가이샤 신가와 검사 장치, 실장 장치, 검사 방법, 및 기억 매체
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
JPWO2024194923A1 (enExample) * 2023-03-17 2024-09-26

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
CN100383593C (zh) * 2003-03-07 2008-04-23 伊斯梅卡半导体控股公司 光学装置和检查模件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
US7715595B2 (en) * 2002-01-16 2010-05-11 Iritech, Inc. System and method for iris identification using stereoscopic face recognition
US20050084137A1 (en) * 2002-01-16 2005-04-21 Kim Dae-Hoon System and method for iris identification using stereoscopic face recognition
JP2006093588A (ja) * 2004-09-27 2006-04-06 Nec Electronics Corp 表面に突起部を有する半導体装置および半導体パッケージの識別方法。
CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
US9022586B2 (en) * 2006-03-28 2015-05-05 Rosco, Inc. Vehicular mirror having a camera for enhanced vision
US7812971B2 (en) * 2007-06-28 2010-10-12 Quality Vision International, Inc. Multi color autofocus apparatus and method
JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
JP5240771B2 (ja) * 2008-04-14 2013-07-17 上野精機株式会社 外観検査装置
KR101429723B1 (ko) * 2008-12-08 2014-09-24 삼성전자주식회사 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치
SG163442A1 (en) * 2009-01-13 2010-08-30 Semiconductor Technologies & Instruments System and method for inspecting a wafer
JP2012171628A (ja) * 2011-02-17 2012-09-10 Hitachi High-Tech Instruments Co Ltd テーピング装置及びテーピング方法
PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
CN106062509B (zh) * 2013-11-20 2019-03-08 联达科技设备私人有限公司 用于选择性地检验部件侧壁的装置和方法
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
CN100383593C (zh) * 2003-03-07 2008-04-23 伊斯梅卡半导体控股公司 光学装置和检查模件
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置

Also Published As

Publication number Publication date
KR20210099172A (ko) 2021-08-11
US20170003231A1 (en) 2017-01-05
TWI746289B (zh) 2021-11-11
TW201721132A (zh) 2017-06-16
KR20180015220A (ko) 2018-02-12
EP3281219B1 (en) 2021-09-29
KR102740720B1 (ko) 2024-12-10
EP3281219A1 (en) 2018-02-14
JP6968221B2 (ja) 2021-11-17
JP2020091300A (ja) 2020-06-11
JP2022009508A (ja) 2022-01-14
TWI713533B (zh) 2020-12-21
WO2016195726A1 (en) 2016-12-08
KR102286993B1 (ko) 2021-08-10
US10190994B2 (en) 2019-01-29
EP3281219A4 (en) 2018-12-19
JP2023090913A (ja) 2023-06-29
JP7462095B2 (ja) 2024-04-04
JP2018516371A (ja) 2018-06-21
CN107743583A (zh) 2018-02-27
TW202111313A (zh) 2021-03-16
CN117577551A (zh) 2024-02-20

Similar Documents

Publication Publication Date Title
CN107743583B (zh) 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
CN108627964B (zh) 一种全自动显微扫描仪
KR100954360B1 (ko) 자동 외관검사장치
KR101808388B1 (ko) 프로브 장치 및 프로브 방법
KR101442792B1 (ko) 사파이어 웨이퍼의 검사 방법
CN209982634U (zh) 摄像模组对焦组装系统、镜头组件和感光组件参数获取装置
JP2018516371A5 (enExample)
US8817089B2 (en) Inspection system
CN115372375A (zh) 晶圆检测装置及检测方法
CN102944561B (zh) 一种矩阵式小器件的外观检测方法及装置
CN115575406A (zh) 表面缺陷检测装置及其检测方法
KR102472876B1 (ko) 불량 pcb 모듈의 리뷰 장치
CN114166754A (zh) 用于线扫瞄自动光学检测系统的自动对焦装置
WO2020121977A1 (ja) 検査システム、及び検査用の画像取得方法
JP2016205985A (ja) 測定装置
KR100312081B1 (ko) 프로그램가능한 영역 스캔 비전 검사 시스템
CN1720435A (zh) 固体摄像元件的测试装置
KR20200052027A (ko) 프로브 스테이션
KR100363707B1 (ko) 반도체 소자의 검사방법
KR100318227B1 (ko) 반도체소자의 검사시스템에 이용되는 자동 줌 장치
KR20230094089A (ko) 반도체 패키지 검사 장치 및 반도체 패키지 검사 방법
JP2006308484A (ja) 自動外観検査装置及び自動外観検査方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant