JP2018182346A5 - - Google Patents
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- Publication number
- JP2018182346A5 JP2018182346A5 JP2018149518A JP2018149518A JP2018182346A5 JP 2018182346 A5 JP2018182346 A5 JP 2018182346A5 JP 2018149518 A JP2018149518 A JP 2018149518A JP 2018149518 A JP2018149518 A JP 2018149518A JP 2018182346 A5 JP2018182346 A5 JP 2018182346A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- conductive layer
- semiconductor device
- layer
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 42
- 238000004519 manufacturing process Methods 0.000 claims 14
- 238000000034 method Methods 0.000 claims 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 5
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 229910052715 tantalum Inorganic materials 0.000 claims 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 5
- 239000010936 titanium Substances 0.000 claims 5
- 229910052719 titanium Inorganic materials 0.000 claims 5
- 239000012212 insulator Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 3
- 238000005304 joining Methods 0.000 claims 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 3
- 229910052721 tungsten Inorganic materials 0.000 claims 3
- 239000010937 tungsten Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 150000003482 tantalum compounds Chemical class 0.000 claims 2
- 150000003609 titanium compounds Chemical class 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018149518A JP6632670B2 (ja) | 2018-08-08 | 2018-08-08 | 半導体装置およびその製造方法 |
| JP2019223945A JP6905040B2 (ja) | 2018-08-08 | 2019-12-11 | 半導体デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018149518A JP6632670B2 (ja) | 2018-08-08 | 2018-08-08 | 半導体装置およびその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017087520A Division JP6385515B2 (ja) | 2017-04-26 | 2017-04-26 | 半導体装置およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019223945A Division JP6905040B2 (ja) | 2018-08-08 | 2019-12-11 | 半導体デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018182346A JP2018182346A (ja) | 2018-11-15 |
| JP2018182346A5 true JP2018182346A5 (enExample) | 2019-01-31 |
| JP6632670B2 JP6632670B2 (ja) | 2020-01-22 |
Family
ID=64277084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018149518A Active JP6632670B2 (ja) | 2018-08-08 | 2018-08-08 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6632670B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4318591A4 (en) | 2021-03-30 | 2024-12-18 | Sony Semiconductor Solutions Corporation | Light detection device and electronic apparatus |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091423A (ja) * | 1998-09-16 | 2000-03-31 | Nec Corp | 多層配線半導体装置及びその製造方法 |
| JP2002252338A (ja) * | 2000-12-18 | 2002-09-06 | Canon Inc | 撮像装置及び撮像システム |
| JP2003142576A (ja) * | 2001-10-31 | 2003-05-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2003258230A (ja) * | 2002-02-28 | 2003-09-12 | Canon Inc | 半導体装置及び半導体撮像装置 |
| US7485968B2 (en) * | 2005-08-11 | 2009-02-03 | Ziptronix, Inc. | 3D IC method and device |
| US7528494B2 (en) * | 2005-11-03 | 2009-05-05 | International Business Machines Corporation | Accessible chip stack and process of manufacturing thereof |
| JP4812512B2 (ja) * | 2006-05-19 | 2011-11-09 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
| US8536629B2 (en) * | 2009-02-24 | 2013-09-17 | Nec Corporation | Semiconductor device and method for manufacturing the same |
| JP5637751B2 (ja) * | 2009-08-28 | 2014-12-10 | 富士フイルム株式会社 | 固体撮像装置，固体撮像装置の製造方法 |
| KR101648200B1 (ko) * | 2009-10-22 | 2016-08-12 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
-
2018
- 2018-08-08 JP JP2018149518A patent/JP6632670B2/ja active Active
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