JP2018182274A - 積層型キャパシタ - Google Patents

積層型キャパシタ Download PDF

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Publication number
JP2018182274A
JP2018182274A JP2017144018A JP2017144018A JP2018182274A JP 2018182274 A JP2018182274 A JP 2018182274A JP 2017144018 A JP2017144018 A JP 2017144018A JP 2017144018 A JP2017144018 A JP 2017144018A JP 2018182274 A JP2018182274 A JP 2018182274A
Authority
JP
Japan
Prior art keywords
multilayer capacitor
capacitor according
connection portion
tin
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017144018A
Other languages
English (en)
Japanese (ja)
Inventor
ミン キム、ジュン
Jung Min Kim
ミン キム、ジュン
セオク クー、ボン
Bon Seok Koo
セオク クー、ボン
ハク チョイ、チャン
Chang Hak Choi
ハク チョイ、チャン
ソル カン、ハエ
Hae Sol Kang
ソル カン、ハエ
ヒ ハン、ジ
Ji Hye Han
ヒ ハン、ジ
ウ カン、ビョン
Byung Woo Kang
ウ カン、ビョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2018182274A publication Critical patent/JP2018182274A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2017144018A 2017-04-04 2017-07-25 積層型キャパシタ Pending JP2018182274A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2017-0043494 2017-04-04
KR20170043494 2017-04-04
KR10-2017-0053082 2017-04-25
KR1020170053082A KR101922879B1 (ko) 2017-04-04 2017-04-25 적층형 커패시터

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019051275A Division JP7176814B2 (ja) 2017-04-04 2019-03-19 積層型キャパシタ

Publications (1)

Publication Number Publication Date
JP2018182274A true JP2018182274A (ja) 2018-11-15

Family

ID=63876580

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017144018A Pending JP2018182274A (ja) 2017-04-04 2017-07-25 積層型キャパシタ
JP2019051275A Active JP7176814B2 (ja) 2017-04-04 2019-03-19 積層型キャパシタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019051275A Active JP7176814B2 (ja) 2017-04-04 2019-03-19 積層型キャパシタ

Country Status (3)

Country Link
JP (2) JP2018182274A (enExample)
KR (2) KR101922879B1 (enExample)
CN (1) CN108695067B (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020126896A (ja) * 2019-02-01 2020-08-20 Tdk株式会社 セラミック電子部品
CN111599599A (zh) * 2019-02-21 2020-08-28 三星电机株式会社 多层电容器
JP2020136656A (ja) * 2019-02-21 2020-08-31 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型キャパシタ
CN112420387A (zh) * 2019-08-23 2021-02-26 三星电机株式会社 多层电容器和其上安装有该多层电容器的板
CN112447403A (zh) * 2019-08-28 2021-03-05 三星电机株式会社 多层电子组件
JP2021136323A (ja) * 2020-02-27 2021-09-13 株式会社村田製作所 積層セラミック電子部品
JP2022514414A (ja) * 2018-12-24 2022-02-10 アイ テン 電子又は電気化学デバイスのための接触ユニット
JP2022104860A (ja) * 2020-12-30 2022-07-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型キャパシタ及びその実装基板
JP2023099415A (ja) * 2021-12-31 2023-07-13 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7053095B2 (ja) * 2018-11-29 2022-04-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層セラミックキャパシタ
JP7509514B2 (ja) * 2018-12-27 2024-07-02 Tdk株式会社 電子部品
JP7088134B2 (ja) 2019-07-17 2022-06-21 株式会社村田製作所 電子部品
JP7226161B2 (ja) 2019-07-17 2023-02-21 株式会社村田製作所 電子部品
KR102867849B1 (ko) 2019-09-20 2025-10-01 삼성전기주식회사 적층형 전자 부품
JP7314884B2 (ja) 2020-08-31 2023-07-26 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR20220060286A (ko) * 2020-11-04 2022-05-11 삼성전기주식회사 적층형 커패시터
JP7396251B2 (ja) * 2020-11-11 2023-12-12 株式会社村田製作所 積層セラミックコンデンサ
KR102900297B1 (ko) * 2020-12-31 2025-12-12 삼성전기주식회사 적층 세라믹 전자부품
WO2022210626A1 (ja) 2021-03-31 2022-10-06 株式会社村田製作所 積層セラミックコンデンサ
KR102881004B1 (ko) * 2021-11-11 2025-11-04 삼성전기주식회사 복합　전자부품
JP2023118628A (ja) * 2022-02-15 2023-08-25 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法

Citations (4)

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JP2001044069A (ja) * 1999-07-30 2001-02-16 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法及び積層セラミック電子部品
US20030099084A1 (en) * 2001-11-26 2003-05-29 Duva Frank A. Surface flashover resistant capacitors and method for producing same
WO2004053901A1 (ja) * 2002-12-09 2004-06-24 Matsushita Electric Industrial Co., Ltd. 外部電極を備えた電子部品
WO2016121575A1 (ja) * 2015-01-30 2016-08-04 株式会社村田製作所 電子部品の製造方法および電子部品

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EP0777242A3 (en) * 1995-11-29 1999-12-01 Matsushita Electric Industrial Co., Ltd A ceramic electronic component and its manufacturing method
JPH09260199A (ja) * 1996-03-25 1997-10-03 Taiyo Yuden Co Ltd 積層コンデンサ
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JP2009283597A (ja) * 2008-05-21 2009-12-03 Murata Mfg Co Ltd 積層電子部品およびその製造方法
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KR101018240B1 (ko) * 2008-08-12 2011-03-03 삼성전기주식회사 적층 세라믹 캐패시터 및 그 제조방법
JP5439944B2 (ja) * 2009-05-18 2014-03-12 株式会社村田製作所 積層型電子部品およびその製造方法
KR20130049296A (ko) * 2011-11-04 2013-05-14 삼성전기주식회사 적층 세라믹 전자부품의 제조방법
CN104093888B (zh) * 2012-01-23 2016-08-24 株式会社村田制作所 电子部件及其制造方法
JP2015026815A (ja) * 2013-06-19 2015-02-05 株式会社村田製作所 セラミック電子部品およびその製造方法
KR20150089276A (ko) * 2014-01-27 2015-08-05 삼성전기주식회사 적층 세라믹 전자부품 및 외부전극용 도전성 페이스트
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JP2001044069A (ja) * 1999-07-30 2001-02-16 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法及び積層セラミック電子部品
US20030099084A1 (en) * 2001-11-26 2003-05-29 Duva Frank A. Surface flashover resistant capacitors and method for producing same
WO2004053901A1 (ja) * 2002-12-09 2004-06-24 Matsushita Electric Industrial Co., Ltd. 外部電極を備えた電子部品
WO2016121575A1 (ja) * 2015-01-30 2016-08-04 株式会社村田製作所 電子部品の製造方法および電子部品

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022514414A (ja) * 2018-12-24 2022-02-10 アイ テン 電子又は電気化学デバイスのための接触ユニット
JP7276646B2 (ja) 2019-02-01 2023-05-18 Tdk株式会社 セラミック電子部品
JP2020126896A (ja) * 2019-02-01 2020-08-20 Tdk株式会社 セラミック電子部品
CN111599599A (zh) * 2019-02-21 2020-08-28 三星电机株式会社 多层电容器
JP2020136656A (ja) * 2019-02-21 2020-08-31 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型キャパシタ
CN111599599B (zh) * 2019-02-21 2023-06-30 三星电机株式会社 多层电容器
US11562859B2 (en) 2019-02-21 2023-01-24 Samsung Electro-Mechanics Co., Ltd. MLCC module and method of manufacturing the same
JP7255946B2 (ja) 2019-02-21 2023-04-11 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型キャパシタ
CN112420387A (zh) * 2019-08-23 2021-02-26 三星电机株式会社 多层电容器和其上安装有该多层电容器的板
US12148574B2 (en) 2019-08-23 2024-11-19 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor and board having the same mounted thereon
US11784005B2 (en) 2019-08-23 2023-10-10 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor and board having the same mounted thereon
CN112420387B (zh) * 2019-08-23 2023-03-10 三星电机株式会社 多层电容器和其上安装有该多层电容器的板
CN112447403A (zh) * 2019-08-28 2021-03-05 三星电机株式会社 多层电子组件
CN112447403B (zh) * 2019-08-28 2023-09-01 三星电机株式会社 多层电子组件
US11538634B2 (en) 2020-02-27 2022-12-27 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component including an insulating layer
JP2021136323A (ja) * 2020-02-27 2021-09-13 株式会社村田製作所 積層セラミック電子部品
JP2022104860A (ja) * 2020-12-30 2022-07-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型キャパシタ及びその実装基板
JP2023099415A (ja) * 2021-12-31 2023-07-13 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品

Also Published As

Publication number Publication date
KR20180112732A (ko) 2018-10-12
CN108695067A (zh) 2018-10-23
JP7176814B2 (ja) 2022-11-22
KR102212642B1 (ko) 2021-02-08
KR101922879B1 (ko) 2018-11-29
KR20180112643A (ko) 2018-10-12
JP2019117942A (ja) 2019-07-18
CN108695067B (zh) 2022-01-07

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