CN108695067B - 多层电容器及制造多层电容器的方法 - Google Patents

多层电容器及制造多层电容器的方法 Download PDF

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Publication number
CN108695067B
CN108695067B CN201710821519.XA CN201710821519A CN108695067B CN 108695067 B CN108695067 B CN 108695067B CN 201710821519 A CN201710821519 A CN 201710821519A CN 108695067 B CN108695067 B CN 108695067B
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Prior art keywords
multilayer capacitor
electrode
layer
intermetallic compound
metal particles
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Chinese (zh)
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CN108695067A (zh
Inventor
金政民
具本锡
崔畅学
康谐率
韩知惠
姜炳宇
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN201710821519.XA 2017-04-04 2017-09-13 多层电容器及制造多层电容器的方法 Active CN108695067B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2017-0043494 2017-04-04
KR20170043494 2017-04-04
KR10-2017-0053082 2017-04-25
KR1020170053082A KR101922879B1 (ko) 2017-04-04 2017-04-25 적층형 커패시터

Publications (2)

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CN108695067A CN108695067A (zh) 2018-10-23
CN108695067B true CN108695067B (zh) 2022-01-07

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JP (2) JP2018182274A (enExample)
KR (2) KR101922879B1 (enExample)
CN (1) CN108695067B (enExample)

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JP7053095B2 (ja) * 2018-11-29 2022-04-12 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層セラミックキャパシタ
FR3091040B1 (fr) * 2018-12-24 2022-12-09 I Ten Organe de contact d’un dispositif electronique ou electrochimique
JP7509514B2 (ja) * 2018-12-27 2024-07-02 Tdk株式会社 電子部品
JP7276646B2 (ja) * 2019-02-01 2023-05-18 Tdk株式会社 セラミック電子部品
US11183331B2 (en) * 2019-02-21 2021-11-23 Samsung Electro-Mechanics Co., Ltd. MLCC module and method of manufacturing the same
KR102211744B1 (ko) * 2019-02-21 2021-02-04 삼성전기주식회사 적층형 커패시터
JP7088134B2 (ja) 2019-07-17 2022-06-21 株式会社村田製作所 電子部品
JP7226161B2 (ja) 2019-07-17 2023-02-21 株式会社村田製作所 電子部品
KR102270303B1 (ko) * 2019-08-23 2021-06-30 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102276514B1 (ko) * 2019-08-28 2021-07-14 삼성전기주식회사 적층형 전자 부품
KR102867849B1 (ko) 2019-09-20 2025-10-01 삼성전기주식회사 적층형 전자 부품
JP2021136323A (ja) 2020-02-27 2021-09-13 株式会社村田製作所 積層セラミック電子部品
JP7314884B2 (ja) 2020-08-31 2023-07-26 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR20220060286A (ko) 2020-11-04 2022-05-11 삼성전기주식회사 적층형 커패시터
JP7396251B2 (ja) * 2020-11-11 2023-12-12 株式会社村田製作所 積層セラミックコンデンサ
KR102899065B1 (ko) * 2020-12-30 2025-12-12 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102900297B1 (ko) * 2020-12-31 2025-12-12 삼성전기주식회사 적층 세라믹 전자부품
JPWO2022210626A1 (enExample) 2021-03-31 2022-10-06
KR102881004B1 (ko) * 2021-11-11 2025-11-04 삼성전기주식회사 복합　전자부품
KR20230104447A (ko) * 2021-12-31 2023-07-10 삼성전기주식회사 적층형 전자 부품
JP2023118628A (ja) * 2022-02-15 2023-08-25 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法

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CN1723514A (zh) * 2002-12-09 2006-01-18 松下电器产业株式会社 具有外部电极的电子部件
CN201196910Y (zh) * 2008-05-29 2009-02-18 成都宏明电子股份有限公司 用于片式多层陶瓷电容器和片式多层压敏电阻器的包封体
CN101587774A (zh) * 2008-05-21 2009-11-25 株式会社村田制作所 层叠电子部件及其制造方法

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JP2015026815A (ja) * 2013-06-19 2015-02-05 株式会社村田製作所 セラミック電子部品およびその製造方法
KR20150089276A (ko) * 2014-01-27 2015-08-05 삼성전기주식회사 적층 세라믹 전자부품 및 외부전극용 도전성 페이스트
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JPH09260199A (ja) * 1996-03-25 1997-10-03 Taiyo Yuden Co Ltd 積層コンデンサ
CN1723514A (zh) * 2002-12-09 2006-01-18 松下电器产业株式会社 具有外部电极的电子部件
CN101587774A (zh) * 2008-05-21 2009-11-25 株式会社村田制作所 层叠电子部件及其制造方法
CN201196910Y (zh) * 2008-05-29 2009-02-18 成都宏明电子股份有限公司 用于片式多层陶瓷电容器和片式多层压敏电阻器的包封体

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KR102212642B1 (ko) 2021-02-08
JP7176814B2 (ja) 2022-11-22
JP2018182274A (ja) 2018-11-15
JP2019117942A (ja) 2019-07-18
CN108695067A (zh) 2018-10-23
KR20180112643A (ko) 2018-10-12
KR20180112732A (ko) 2018-10-12
KR101922879B1 (ko) 2018-11-29

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