JP2020136656A - 積層型キャパシタ - Google Patents
積層型キャパシタ Download PDFInfo
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- JP2020136656A JP2020136656A JP2019143512A JP2019143512A JP2020136656A JP 2020136656 A JP2020136656 A JP 2020136656A JP 2019143512 A JP2019143512 A JP 2019143512A JP 2019143512 A JP2019143512 A JP 2019143512A JP 2020136656 A JP2020136656 A JP 2020136656A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 110
- 238000003475 lamination Methods 0.000 title abstract 3
- 230000035939 shock Effects 0.000 claims abstract description 68
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910000765 intermetallic Inorganic materials 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
図4は積層型キャパシタの曲げ試験(Bending test)方法を説明するための正面図であり、図5は図4の試験方法による曲げ試験の結果を示すグラフである。
110 キャパシタ本体
111 誘電体層
121、122 第1及び第2内部電極
130、140、130'、140' 第1及び第2外部電極
131、141 第1及び第2導電層
132、142 第1及び第2衝撃吸収層
133、143 第1及び第2導電性樹脂層
134、144 第1及び第2ニッケルめっき層
135、145 第1及び第2錫めっき層
Claims (13)
- 誘電体層及び前記誘電体層を挟んで交互に配置される第1及び第2内部電極を含み、互いに対向する第1及び第2面、第1及び第2面と連結され、互いに対向する第3及び第4面、第1及び第2面と連結され、且つ第3及び第4面と連結され、互いに対向する第5及び第6面を含み、前記第1及び第2内部電極の一端が第3及び第4面を介してそれぞれ露出するキャパシタ本体と、
第3及び第4面を連結する第1方向に前記キャパシタ本体の両端部にそれぞれ配置され、前記第1及び第2内部電極とそれぞれ接続される第1及び第2外部電極と、を含み、
前記第1及び第2外部電極は、前記キャパシタ本体の第1及び第2面に配置される第1及び第2導電性樹脂層と、前記キャパシタ本体の第1及び第2面と前記第1導電性樹脂層との間に配置される第1衝撃吸収層と、前記キャパシタ本体の第1及び第2面と前記第2導電性樹脂層との間に配置される第2衝撃吸収層と、を含み、前記第1及び第2衝撃吸収層の長さが、前記第1及び第2導電性樹脂層の長さよりもそれぞれ長く形成される、積層型キャパシタ。 - 前記第1外部電極は、前記キャパシタ本体の第3面に配置される第1導電層と、前記キャパシタ本体の第1、第2、第5、第6面に配置される前記第1衝撃吸収層と、前記第1導電層をカバーし、前記第1衝撃吸収層の一部をカバーするように前記キャパシタ本体の第1、第2、第5、第6面の一部まで延長される前記第1導電性樹脂層と、を含み、
前記第2外部電極は、前記キャパシタ本体の第4面に配置される第2導電層と、前記第1衝撃吸収層と第1方向に互いに離隔するように前記キャパシタ本体の第1、第2、第5、第6面に配置される前記第2衝撃吸収層と、前記第2導電層をカバーし、前記第2衝撃吸収層の一部をカバーするように前記キャパシタ本体の第1、第2、第5、第6面の一部まで延長される前記第2導電性樹脂層と、を含む、請求項1に記載の積層型キャパシタ。 - 前記第1及び第2導電層は銅(Cu)を含む、請求項2に記載の積層型キャパシタ。
- 前記第1及び第2導電性樹脂層は導電性金属とエポキシを含む、請求項1から3のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2導電性樹脂層は金属間化合物とエポキシを含む、請求項1から4のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2衝撃吸収層は絶縁材料からなる、請求項1から5のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2衝撃吸収層はエポキシを含む、請求項6に記載の積層型キャパシタ。
- 前記第1及び第2衝撃吸収層は金属及びフィラー(filler)を含む、請求項1から7のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2衝撃吸収層において、総重量に対する金属の含有量が50重量%以下であり、前記フィラーは、シリカ(silica)、ガラス及び二酸化ジルコニウム(ZrO2)を含む、請求項8に記載の積層型キャパシタ。
- 第1方向における前記第1及び第2衝撃吸収層の長さの和が、前記キャパシタ本体の長さに対して90%以下である、請求項1から9のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2衝撃吸収層のそれぞれの厚さは10μm以上である、請求項1から10のいずれか一項に記載の積層型キャパシタ。
- 前記第1及び第2導電性樹脂層をそれぞれカバーするめっき層をさらに含む、請求項1から11のいずれか一項に記載の積層型キャパシタ。
- 前記めっき層は、前記第1及び第2導電性樹脂層をそれぞれカバーする第1及び第2ニッケル(Ni)めっき層と、前記第1及び第2ニッケルめっき層をそれぞれカバーする第1及び第2錫(Sn)めっき層と、を含む、請求項12に記載の積層型キャパシタ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0020596 | 2019-02-21 | ||
KR20190020596 | 2019-02-21 | ||
KR1020190044182A KR102211744B1 (ko) | 2019-02-21 | 2019-04-16 | 적층형 커패시터 |
KR10-2019-0044182 | 2019-04-16 |
Publications (2)
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JP2020136656A true JP2020136656A (ja) | 2020-08-31 |
JP7255946B2 JP7255946B2 (ja) | 2023-04-11 |
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US (1) | US11562859B2 (ja) |
JP (1) | JP7255946B2 (ja) |
KR (1) | KR102211744B1 (ja) |
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JP7405014B2 (ja) * | 2020-06-22 | 2023-12-26 | Tdk株式会社 | 電子部品及び電子部品の製造方法 |
KR20220081258A (ko) | 2020-12-08 | 2022-06-15 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR20220084603A (ko) | 2020-12-14 | 2022-06-21 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR20220163610A (ko) | 2021-06-03 | 2022-12-12 | 삼성전기주식회사 | 적층형 커패시터 |
WO2024048932A1 (ko) * | 2022-08-30 | 2024-03-07 | 삼성전자주식회사 | 다층 세라믹 캐패시터 및 이를 포함하는 전자 장치 |
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US20220037087A1 (en) | 2022-02-03 |
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