JP2018178261A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018178261A5 JP2018178261A5 JP2018079698A JP2018079698A JP2018178261A5 JP 2018178261 A5 JP2018178261 A5 JP 2018178261A5 JP 2018079698 A JP2018079698 A JP 2018079698A JP 2018079698 A JP2018079698 A JP 2018079698A JP 2018178261 A5 JP2018178261 A5 JP 2018178261A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- electrolytic copper
- roughened side
- kgf
- curl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 13
- 239000011889 copper foil Substances 0.000 claims 13
- 238000003475 lamination Methods 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 1
- 238000001887 electron backscatter diffraction Methods 0.000 claims 1
- 238000002161 passivation Methods 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 230000003449 preventive effect Effects 0.000 claims 1
- 150000003852 triazoles Chemical class 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/490,608 US10190225B2 (en) | 2017-04-18 | 2017-04-18 | Electrodeposited copper foil with low repulsive force |
| US15/490,608 | 2017-04-18 | ||
| US15/626,877 US10081875B1 (en) | 2017-04-18 | 2017-06-19 | Electrodeposited copper foil with low repulsive force |
| US15/626,877 | 2017-06-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018178261A JP2018178261A (ja) | 2018-11-15 |
| JP2018178261A5 true JP2018178261A5 (https=) | 2019-01-10 |
| JP6554203B2 JP6554203B2 (ja) | 2019-07-31 |
Family
ID=63556755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018079698A Active JP6554203B2 (ja) | 2017-04-18 | 2018-04-18 | 低反発力を有する電解銅箔、当該電解銅箔を含むフレキシブルプリント回路板、当該フレキシブルプリント回路板を含む電子部品及び当該電子部品を含む電子デバイス |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10190225B2 (https=) |
| JP (1) | JP6554203B2 (https=) |
| KR (1) | KR102028365B1 (https=) |
| CN (1) | CN108728874B (https=) |
| TW (1) | TWI663269B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646227B (zh) * | 2017-12-08 | 2019-01-01 | 南亞塑膠工業股份有限公司 | 應用於信號傳輸的銅箔以及線路板組件的製造方法 |
| US11753735B2 (en) * | 2018-09-06 | 2023-09-12 | Proterial, Ltd. | Nickel-coated copper foil and method for manufacturing the same |
| US11365486B2 (en) | 2018-10-16 | 2022-06-21 | Chang Chun Petrochemical Co., Ltd. | Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same |
| US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| TWI700393B (zh) * | 2019-08-27 | 2020-08-01 | 長春石油化學股份有限公司 | 電解銅箔以及包含其之電極與鋰離子電池 |
| CN110724979A (zh) * | 2019-12-02 | 2020-01-24 | 东强(连州)铜箔有限公司 | 一种电解铜箔用添加剂、超低峰值hvlp铜箔及其制备方法 |
| JP7656554B2 (ja) | 2020-01-30 | 2025-04-03 | 三井金属鉱業株式会社 | 電解銅箔 |
| PL245191B1 (pl) | 2020-01-30 | 2024-05-27 | Mitsui Mining & Smelting Co Ltd | Elektrolityczna folia miedziana |
| CN111590454B (zh) * | 2020-05-28 | 2020-12-08 | 广东嘉元科技股份有限公司 | 一种改进型的防擦伤阴极辊的生箔机及其应用 |
| TWI749818B (zh) * | 2020-10-22 | 2021-12-11 | 元智大學 | 金屬導線結構改質方法 |
| CN112501660A (zh) * | 2020-11-26 | 2021-03-16 | 江西省江铜耶兹铜箔有限公司 | 一种高粗化电解铜箔的制备方法 |
| CN113402044A (zh) * | 2021-07-06 | 2021-09-17 | 江西鑫铂瑞科技有限公司 | 一种可节约水资源的洗箔水使用方法 |
| CN114543745B (zh) * | 2022-03-07 | 2022-09-27 | 广东嘉元科技股份有限公司 | 一种动力电池用电解铜箔翘曲连续化测试方法及设备 |
| CN116960266A (zh) * | 2023-09-21 | 2023-10-27 | 河南锂动电源有限公司 | 一种极片补锂装置、极片补锂系统及极片补锂方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100975491B1 (ko) * | 2005-03-31 | 2010-08-11 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 전해 동박 및 전해 동박의 제조 방법 |
| KR20070044774A (ko) * | 2005-10-25 | 2007-04-30 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법 |
| JP4470917B2 (ja) * | 2006-06-29 | 2010-06-02 | ソニー株式会社 | 電極集電体、電池用電極及び二次電池 |
| WO2008149772A1 (ja) * | 2007-06-08 | 2008-12-11 | Mitsui Mining & Smelting Co., Ltd. | 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 |
| JP5391366B2 (ja) | 2011-06-28 | 2014-01-15 | 古河電気工業株式会社 | 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板 |
| JP5177268B2 (ja) | 2011-09-01 | 2013-04-03 | 日立電線株式会社 | 圧延銅箔 |
| EP2568063A1 (en) | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
| JP5706026B1 (ja) * | 2013-07-30 | 2015-04-22 | 古河電気工業株式会社 | 配線板用銅箔及び配線板 |
| WO2015016271A1 (ja) * | 2013-08-01 | 2015-02-05 | 古河電気工業株式会社 | プリント配線基板用銅箔 |
| KR101449342B1 (ko) * | 2013-11-08 | 2014-10-13 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지 |
| JP6039540B2 (ja) * | 2013-12-13 | 2016-12-07 | 三井金属鉱業株式会社 | 電解銅箔及びその製造方法 |
| KR101500566B1 (ko) * | 2014-03-20 | 2015-03-12 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지 |
| JP5859078B1 (ja) * | 2014-08-29 | 2016-02-10 | Jx日鉱日石金属株式会社 | キャリア付銅箔の製造方法、銅張積層板の製造方法、プリント配線板の製造方法、及び、電子機器の製造方法 |
| JP5916904B1 (ja) * | 2015-01-07 | 2016-05-11 | 古河電気工業株式会社 | 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池並びにリジッドプリント配線板及びフレキシブルプリント配線板 |
| JP6014186B2 (ja) * | 2015-03-03 | 2016-10-25 | イルジン マテリアルズ カンパニー リミテッドIljin Materials Co., Ltd. | 電解銅箔、これを含む電気部品および電池 |
-
2017
- 2017-04-18 US US15/490,608 patent/US10190225B2/en active Active
- 2017-06-19 US US15/626,877 patent/US10081875B1/en active Active
-
2018
- 2018-04-16 TW TW107112886A patent/TWI663269B/zh active
- 2018-04-17 CN CN201810345340.6A patent/CN108728874B/zh active Active
- 2018-04-18 KR KR1020180045043A patent/KR102028365B1/ko active Active
- 2018-04-18 JP JP2018079698A patent/JP6554203B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018178261A5 (https=) | ||
| JP2017005214A5 (https=) | ||
| PH12017502362B1 (en) | Roughened copper foil, copper-clad laminate and printed wiring board | |
| JP2017203219A5 (https=) | ||
| TWI734930B (zh) | 電磁波屏蔽膜 | |
| US10178816B2 (en) | Copper foil composite, copper foil used for the same, formed product and method of producing the same | |
| MY169155A (en) | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | |
| TWI563888B (zh) | 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法 | |
| JP6392268B2 (ja) | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 | |
| TW202102103A (zh) | 電磁波遮蔽膜的製造方法 | |
| JP6578142B2 (ja) | 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板 | |
| TWI633195B (zh) | 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器 | |
| MY152161A (en) | Surface-treated copper foil, method for producing surface-treated copper foil, and surface-treated copper foil coated with extremely thin primer resin layer | |
| EP2578613B8 (en) | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition | |
| WO2013105266A1 (ja) | 銅箔複合体、並びに成形体及びその製造方法 | |
| MY190542A (en) | Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device | |
| CN104010810B (zh) | 铜箔复合体、以及成形体及其制造方法 | |
| JP2020147759A (ja) | 導電性接着シート | |
| JP6978994B2 (ja) | 転写フィルム | |
| IL277655A (en) | Thermoset resin composition, resin-impregnated reinforced fabric, resin-coated, laminated metal foil, printed wiring board, and semiconductor package | |
| JP6663712B2 (ja) | 圧延銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 | |
| JP2015175005A (ja) | 圧延銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器 | |
| EP3868837A4 (en) | COMPOSITION OF THERMOSETTING RESIN, PRE-IMPREGNATED, RESIN SHEET, LAMINATE SHEET CLAD WITH METAL SHEET, AND PRINTED CIRCUIT BOARD | |
| CN109385556A (zh) | 柔韧印刷基板用铜箔、使用了该铜箔的覆铜层叠体、柔韧印刷基板和电子设备 | |
| PH12020551281A1 (en) | Surface treated copper foil and copper clad laminate |