CN108728874B - 具有低反弹力的电解铜箔、其制造方法及其应用 - Google Patents

具有低反弹力的电解铜箔、其制造方法及其应用 Download PDF

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Publication number
CN108728874B
CN108728874B CN201810345340.6A CN201810345340A CN108728874B CN 108728874 B CN108728874 B CN 108728874B CN 201810345340 A CN201810345340 A CN 201810345340A CN 108728874 B CN108728874 B CN 108728874B
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copper foil
electrolytic copper
tensile strength
warpage
measured
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Chinese (zh)
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CN108728874A (zh
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赖耀生
郑桂森
黄建铭
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Chang Chun Petrochemical Co Ltd
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Chang Chun Petrochemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/045—Electrochemical coating; Electrochemical impregnation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/0469—Electroforming a self-supporting electrode; Electroforming of powdered electrode material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
CN201810345340.6A 2017-04-18 2018-04-17 具有低反弹力的电解铜箔、其制造方法及其应用 Active CN108728874B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/490,608 US10190225B2 (en) 2017-04-18 2017-04-18 Electrodeposited copper foil with low repulsive force
US15/490608 2017-04-18
US15/626,877 US10081875B1 (en) 2017-04-18 2017-06-19 Electrodeposited copper foil with low repulsive force
US15/626877 2017-06-19

Publications (2)

Publication Number Publication Date
CN108728874A CN108728874A (zh) 2018-11-02
CN108728874B true CN108728874B (zh) 2020-08-04

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CN201810345340.6A Active CN108728874B (zh) 2017-04-18 2018-04-17 具有低反弹力的电解铜箔、其制造方法及其应用

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Country Link
US (2) US10190225B2 (https=)
JP (1) JP6554203B2 (https=)
KR (1) KR102028365B1 (https=)
CN (1) CN108728874B (https=)
TW (1) TWI663269B (https=)

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TWI646227B (zh) * 2017-12-08 2019-01-01 南亞塑膠工業股份有限公司 應用於信號傳輸的銅箔以及線路板組件的製造方法
US11753735B2 (en) * 2018-09-06 2023-09-12 Proterial, Ltd. Nickel-coated copper foil and method for manufacturing the same
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI700393B (zh) * 2019-08-27 2020-08-01 長春石油化學股份有限公司 電解銅箔以及包含其之電極與鋰離子電池
CN110724979A (zh) * 2019-12-02 2020-01-24 东强（连州）铜箔有限公司 一种电解铜箔用添加剂、超低峰值hvlp铜箔及其制备方法
JP7656554B2 (ja) 2020-01-30 2025-04-03 三井金属鉱業株式会社 電解銅箔
PL245191B1 (pl) 2020-01-30 2024-05-27 Mitsui Mining & Smelting Co Ltd Elektrolityczna folia miedziana
CN111590454B (zh) * 2020-05-28 2020-12-08 广东嘉元科技股份有限公司 一种改进型的防擦伤阴极辊的生箔机及其应用
TWI749818B (zh) * 2020-10-22 2021-12-11 元智大學 金屬導線結構改質方法
CN112501660A (zh) * 2020-11-26 2021-03-16 江西省江铜耶兹铜箔有限公司 一种高粗化电解铜箔的制备方法
CN113402044A (zh) * 2021-07-06 2021-09-17 江西鑫铂瑞科技有限公司 一种可节约水资源的洗箔水使用方法
CN114543745B (zh) * 2022-03-07 2022-09-27 广东嘉元科技股份有限公司 一种动力电池用电解铜箔翘曲连续化测试方法及设备
CN116960266A (zh) * 2023-09-21 2023-10-27 河南锂动电源有限公司 一种极片补锂装置、极片补锂系统及极片补锂方法

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CN101106196A (zh) * 2006-06-29 2008-01-16 索尼株式会社 电极集流体及其检查方法、电池电极及其制备方法以及二次电池及其制备方法
CN101146933A (zh) * 2005-03-31 2008-03-19 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
CN104349582A (zh) * 2013-07-30 2015-02-11 古河电气工业株式会社 线路板用铜箔及线路板
CN105705329A (zh) * 2013-11-08 2016-06-22 日进材料股份有限公司 电沉积铜、包括其的电部件和电池
CN106104876A (zh) * 2014-03-20 2016-11-09 日进材料股份有限公司 电解铜箔、包含该电解铜箔的集电体、阴极以及锂电池

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KR20070044774A (ko) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법
WO2008149772A1 (ja) * 2007-06-08 2008-12-11 Mitsui Mining & Smelting Co., Ltd. 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置
JP5391366B2 (ja) 2011-06-28 2014-01-15 古河電気工業株式会社 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板
JP5177268B2 (ja) 2011-09-01 2013-04-03 日立電線株式会社 圧延銅箔
EP2568063A1 (en) 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
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JP6014186B2 (ja) * 2015-03-03 2016-10-25 イルジン マテリアルズ カンパニー リミテッドＩｌｊｉｎ Ｍａｔｅｒｉａｌｓ Ｃｏ．， Ｌｔｄ． 電解銅箔、これを含む電気部品および電池

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CN101146933A (zh) * 2005-03-31 2008-03-19 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
CN101106196A (zh) * 2006-06-29 2008-01-16 索尼株式会社 电极集流体及其检查方法、电池电极及其制备方法以及二次电池及其制备方法
CN104349582A (zh) * 2013-07-30 2015-02-11 古河电气工业株式会社 线路板用铜箔及线路板
CN105705329A (zh) * 2013-11-08 2016-06-22 日进材料股份有限公司 电沉积铜、包括其的电部件和电池
CN106104876A (zh) * 2014-03-20 2016-11-09 日进材料股份有限公司 电解铜箔、包含该电解铜箔的集电体、阴极以及锂电池

Also Published As

Publication number Publication date
KR102028365B1 (ko) 2019-10-04
KR20180117064A (ko) 2018-10-26
TW201839147A (zh) 2018-11-01
US10081875B1 (en) 2018-09-25
US20180298508A1 (en) 2018-10-18
JP6554203B2 (ja) 2019-07-31
US10190225B2 (en) 2019-01-29
US20180298509A1 (en) 2018-10-18
CN108728874A (zh) 2018-11-02
TWI663269B (zh) 2019-06-21
JP2018178261A (ja) 2018-11-15

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