KR102028365B1 - 저 반발력 전착 구리박 및 그의 제조 방법 및 응용 - Google Patents

저 반발력 전착 구리박 및 그의 제조 방법 및 응용 Download PDF

Info

Publication number
KR102028365B1
KR102028365B1 KR1020180045043A KR20180045043A KR102028365B1 KR 102028365 B1 KR102028365 B1 KR 102028365B1 KR 1020180045043 A KR1020180045043 A KR 1020180045043A KR 20180045043 A KR20180045043 A KR 20180045043A KR 102028365 B1 KR102028365 B1 KR 102028365B1
Authority
KR
South Korea
Prior art keywords
copper foil
range
kgf
measured
electrodeposited copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180045043A
Other languages
English (en)
Korean (ko)
Other versions
KR20180117064A (ko
Inventor
야오-셍 라이
쿠이-센 쳉
지안 밍 후앙
Original Assignee
장 춘 페트로케미컬 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 장 춘 페트로케미컬 컴퍼니 리미티드 filed Critical 장 춘 페트로케미컬 컴퍼니 리미티드
Publication of KR20180117064A publication Critical patent/KR20180117064A/ko
Application granted granted Critical
Publication of KR102028365B1 publication Critical patent/KR102028365B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/045—Electrochemical coating; Electrochemical impregnation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/0469—Electroforming a self-supporting electrode; Electroforming of powdered electrode material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
KR1020180045043A 2017-04-18 2018-04-18 저 반발력 전착 구리박 및 그의 제조 방법 및 응용 Active KR102028365B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US15/490,608 US10190225B2 (en) 2017-04-18 2017-04-18 Electrodeposited copper foil with low repulsive force
US15/490,608 2017-04-18
US15/626,877 US10081875B1 (en) 2017-04-18 2017-06-19 Electrodeposited copper foil with low repulsive force
US15/626,877 2017-06-19

Publications (2)

Publication Number Publication Date
KR20180117064A KR20180117064A (ko) 2018-10-26
KR102028365B1 true KR102028365B1 (ko) 2019-10-04

Family

ID=63556755

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180045043A Active KR102028365B1 (ko) 2017-04-18 2018-04-18 저 반발력 전착 구리박 및 그의 제조 방법 및 응용

Country Status (5)

Country Link
US (2) US10190225B2 (https=)
JP (1) JP6554203B2 (https=)
KR (1) KR102028365B1 (https=)
CN (1) CN108728874B (https=)
TW (1) TWI663269B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646227B (zh) * 2017-12-08 2019-01-01 南亞塑膠工業股份有限公司 應用於信號傳輸的銅箔以及線路板組件的製造方法
US11753735B2 (en) * 2018-09-06 2023-09-12 Proterial, Ltd. Nickel-coated copper foil and method for manufacturing the same
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI700393B (zh) * 2019-08-27 2020-08-01 長春石油化學股份有限公司 電解銅箔以及包含其之電極與鋰離子電池
CN110724979A (zh) * 2019-12-02 2020-01-24 东强（连州）铜箔有限公司 一种电解铜箔用添加剂、超低峰值hvlp铜箔及其制备方法
JP7656554B2 (ja) 2020-01-30 2025-04-03 三井金属鉱業株式会社 電解銅箔
PL245191B1 (pl) 2020-01-30 2024-05-27 Mitsui Mining & Smelting Co Ltd Elektrolityczna folia miedziana
CN111590454B (zh) * 2020-05-28 2020-12-08 广东嘉元科技股份有限公司 一种改进型的防擦伤阴极辊的生箔机及其应用
TWI749818B (zh) * 2020-10-22 2021-12-11 元智大學 金屬導線結構改質方法
CN112501660A (zh) * 2020-11-26 2021-03-16 江西省江铜耶兹铜箔有限公司 一种高粗化电解铜箔的制备方法
CN113402044A (zh) * 2021-07-06 2021-09-17 江西鑫铂瑞科技有限公司 一种可节约水资源的洗箔水使用方法
CN114543745B (zh) * 2022-03-07 2022-09-27 广东嘉元科技股份有限公司 一种动力电池用电解铜箔翘曲连续化测试方法及设备
CN116960266A (zh) * 2023-09-21 2023-10-27 河南锂动电源有限公司 一种极片补锂装置、极片补锂系统及极片补锂方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101449342B1 (ko) 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975491B1 (ko) * 2005-03-31 2010-08-11 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박 및 전해 동박의 제조 방법
KR20070044774A (ko) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법
JP4470917B2 (ja) * 2006-06-29 2010-06-02 ソニー株式会社 電極集電体、電池用電極及び二次電池
WO2008149772A1 (ja) * 2007-06-08 2008-12-11 Mitsui Mining & Smelting Co., Ltd. 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置
JP5391366B2 (ja) 2011-06-28 2014-01-15 古河電気工業株式会社 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板
JP5177268B2 (ja) 2011-09-01 2013-04-03 日立電線株式会社 圧延銅箔
EP2568063A1 (en) 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
JP5706026B1 (ja) * 2013-07-30 2015-04-22 古河電気工業株式会社 配線板用銅箔及び配線板
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
JP6039540B2 (ja) * 2013-12-13 2016-12-07 三井金属鉱業株式会社 電解銅箔及びその製造方法
KR101500566B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
JP5859078B1 (ja) * 2014-08-29 2016-02-10 Jx日鉱日石金属株式会社 キャリア付銅箔の製造方法、銅張積層板の製造方法、プリント配線板の製造方法、及び、電子機器の製造方法
JP5916904B1 (ja) * 2015-01-07 2016-05-11 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池並びにリジッドプリント配線板及びフレキシブルプリント配線板
JP6014186B2 (ja) * 2015-03-03 2016-10-25 イルジン マテリアルズ カンパニー リミテッドＩｌｊｉｎ Ｍａｔｅｒｉａｌｓ Ｃｏ．， Ｌｔｄ． 電解銅箔、これを含む電気部品および電池

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101449342B1 (ko) 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지

Also Published As

Publication number Publication date
KR20180117064A (ko) 2018-10-26
TW201839147A (zh) 2018-11-01
US10081875B1 (en) 2018-09-25
US20180298508A1 (en) 2018-10-18
JP6554203B2 (ja) 2019-07-31
US10190225B2 (en) 2019-01-29
US20180298509A1 (en) 2018-10-18
CN108728874A (zh) 2018-11-02
TWI663269B (zh) 2019-06-21
JP2018178261A (ja) 2018-11-15
CN108728874B (zh) 2020-08-04

Similar Documents

Publication Publication Date Title
KR102028365B1 (ko) 저 반발력 전착 구리박 및 그의 제조 방법 및 응용
JP6297124B2 (ja) 銅箔、キャリア箔付銅箔及び銅張積層板
US10686191B2 (en) Electrodeposited copper foil, and electrical component and battery comprising same
US9060431B2 (en) Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
CN105814242B (zh) 表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
KR102028353B1 (ko) 낮은 내부 응력 구리 전기도금 방법
WO2013018773A1 (ja) 電解銅合金箔、その製造方法、それの製造に用いる電解液、それを用いた二次電池用負極集電体、二次電池及びその電極
CN108138349B (zh) 导电部件及其制造方法
WO2007052630A1 (ja) 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
KR101787513B1 (ko) 전해 동박, 상기 전해 동박을 이용한 전지용 집전체, 상기 집전체를 이용한 이차전지용 전극, 상기 전극을 이용한 이차전지
US20220232699A1 (en) Printed wiring board and method of manufacturing the same
KR20240009937A (ko) 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
KR101096638B1 (ko) 구리 라미네이트의 박리 강도 강화
TWI912595B (zh) 表面處理銅箔、銅箔卷、銅張積層板、及印刷電路板
EP4491774A1 (en) Composite material, production method for composite material, and terminal
EP4202084A2 (en) Double layered electrolytic copper foil and manufacturing method thereof
TWI679316B (zh) 鈦陰極表面改質方法用於電鍍低粗糙度銅箔
KR20160125876A (ko) 프린트 배선판용 전해 동박 및 그 전해 동박을 사용한 구리 피복 적층판
EP4424882A1 (en) Electrolytic copper foil for current collector of secondary battery
KR101315364B1 (ko) 내열성이 개선된 표면 처리 동박 및 그 제조방법
KR20170099588A (ko) 비전도성 고분자막과의 박리강도를 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20180418

PG1501 Laying open of application
A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190322

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20180418

Comment text: Patent Application

PA0302 Request for accelerated examination

Patent event date: 20190322

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20180418

Patent event code: PA03021R01I

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190703

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190925

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190927

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190927

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20220314

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20220314

Start annual number: 4

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20240305

Start annual number: 6

End annual number: 8