TWI563888B - - Google Patents

Info

Publication number
TWI563888B
TWI563888B TW103127884A TW103127884A TWI563888B TW I563888 B TWI563888 B TW I563888B TW 103127884 A TW103127884 A TW 103127884A TW 103127884 A TW103127884 A TW 103127884A TW I563888 B TWI563888 B TW I563888B
Authority
TW
Taiwan
Application number
TW103127884A
Other versions
TW201515533A (zh
Inventor
Ryo Fukuchi
Tomota Nagaura
Hideta Arai
Atsushi Miki
Kohsuke Arai
Kaichiro Nakamuro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201515533A publication Critical patent/TW201515533A/zh
Application granted granted Critical
Publication of TWI563888B publication Critical patent/TWI563888B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
TW103127884A 2013-08-20 2014-08-14 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法 TW201515533A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013186668 2013-08-20

Publications (2)

Publication Number Publication Date
TW201515533A TW201515533A (zh) 2015-04-16
TWI563888B true TWI563888B (zh) 2016-12-21

Family

ID=52821354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103127884A TW201515533A (zh) 2013-08-20 2014-08-14 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法

Country Status (5)

Country Link
JP (1) JP5885790B2 (zh)
KR (1) KR101632792B1 (zh)
CN (1) CN104427757B (zh)
MY (1) MY177723A (zh)
TW (1) TW201515533A (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6343205B2 (ja) * 2013-08-21 2018-06-13 Ｊｘ金属株式会社 キャリア付銅箔及びそれを用いた積層板の製造方法、プリント配線板、電子機器、プリント配線板の製造方法、並びに、電子機器の製造方法
TWI625229B (zh) * 2015-09-24 2018-06-01 Jx Nippon Mining & Metals Corp Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
WO2017149810A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
JP2018090906A (ja) 2016-12-06 2018-06-14 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
WO2018110579A1 (ja) * 2016-12-14 2018-06-21 古河電気工業株式会社 表面処理銅箔および銅張積層板
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP7033905B2 (ja) 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108449868B (zh) * 2017-02-07 2022-08-16 Ｊｘ金属株式会社 表面处理铜箔、带载体的铜箔、层压体、印刷配线板的制造方法及电子机器的制造方法
KR102335444B1 (ko) * 2017-03-30 2021-12-03 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이를 이용한 동 클래드 적층판 및 프린트 배선판
CN108696987B (zh) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 表面处理铜箔、附有载体的铜箔、积层体、印刷布线板的制造方法及电子机器的制造方法
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018172782A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
JP6430092B1 (ja) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP6550196B2 (ja) * 2017-07-24 2019-07-24 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
WO2020039987A1 (ja) * 2018-08-22 2020-02-27 株式会社豊田自動織機 蓄電モジュール
US11770904B2 (en) 2019-02-04 2023-09-26 Panasonic Intellectual Property Management Co., Ltd. Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
KR102349377B1 (ko) 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
CN110996557A (zh) * 2020-01-15 2020-04-10 深圳市聚永能科技有限公司 激光粗化印刷电路板铜箔表面的方法和设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200936817A (en) * 2007-10-31 2009-09-01 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing the electrolytic copper foil
TW201035390A (en) * 2009-03-24 2010-10-01 Mitsui Mining & Smelting Co Electrolytic copper foil having carrier foil, method for producing electrolytic copper foil having carrier foil and copper cladding laminate obtained by using the same
JP2013147688A (ja) * 2012-01-18 2013-08-01 Jx Nippon Mining & Metals Corp 銅張積層板用表面処理銅箔及びそれを用いた銅張積層板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849059B2 (ja) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
US6984456B2 (en) 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
JP2004098659A (ja) 2002-07-19 2004-04-02 Ube Ind Ltd 銅張積層板及びその製造方法
JP2004244656A (ja) 2003-02-12 2004-09-02 Furukawa Techno Research Kk 高周波用途対応可能銅箔とその製造方法
KR20080063159A (ko) * 2006-12-28 2008-07-03 미쓰이 긴조꾸 고교 가부시키가이샤 가요성 프린트 배선 기판 및 반도체 장치
US8524378B2 (en) * 2008-11-25 2013-09-03 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
WO2011090044A1 (ja) * 2010-01-25 2011-07-28 Jx日鉱日石金属株式会社 二次電池負極集電体用銅箔
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
WO2012132577A1 (ja) * 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP5417538B1 (ja) * 2012-06-11 2014-02-19 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP5228130B1 (ja) * 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200936817A (en) * 2007-10-31 2009-09-01 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing the electrolytic copper foil
TW201035390A (en) * 2009-03-24 2010-10-01 Mitsui Mining & Smelting Co Electrolytic copper foil having carrier foil, method for producing electrolytic copper foil having carrier foil and copper cladding laminate obtained by using the same
JP2013147688A (ja) * 2012-01-18 2013-08-01 Jx Nippon Mining & Metals Corp 銅張積層板用表面処理銅箔及びそれを用いた銅張積層板

Also Published As

Publication number Publication date
MY177723A (en) 2020-09-23
CN104427757A (zh) 2015-03-18
JP5885790B2 (ja) 2016-03-15
KR20150021474A (ko) 2015-03-02
JP2015061934A (ja) 2015-04-02
TW201515533A (zh) 2015-04-16
KR101632792B1 (ko) 2016-06-22
CN104427757B (zh) 2018-08-28

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