KR101632792B1 - 표면 처리 동박 및 그것을 사용한 적층판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 - Google Patents

표면 처리 동박 및 그것을 사용한 적층판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR101632792B1
KR101632792B1 KR1020140107820A KR20140107820A KR101632792B1 KR 101632792 B1 KR101632792 B1 KR 101632792B1 KR 1020140107820 A KR1020140107820 A KR 1020140107820A KR 20140107820 A KR20140107820 A KR 20140107820A KR 101632792 B1 KR101632792 B1 KR 101632792B1
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KR
South Korea
Prior art keywords
copper foil
layer
carrier
printed wiring
wiring board
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KR1020140107820A
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English (en)
Korean (ko)
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KR20150021474A (ko
Inventor
료 후쿠치
도모타 나가우라
히데타 아라이
아츠시 미키
고스케 아라이
가이치로 나카무로
Original Assignee
제이엑스금속주식회사
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Publication of KR20150021474A publication Critical patent/KR20150021474A/ko
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Publication of KR101632792B1 publication Critical patent/KR101632792B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
KR1020140107820A 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 KR101632792B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-186668 2013-08-20
JP2013186668 2013-08-20

Publications (2)

Publication Number Publication Date
KR20150021474A KR20150021474A (ko) 2015-03-02
KR101632792B1 true KR101632792B1 (ko) 2016-06-22

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KR1020140107820A KR101632792B1 (ko) 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP5885790B2 (zh)
KR (1) KR101632792B1 (zh)
CN (1) CN104427757B (zh)
MY (1) MY177723A (zh)
TW (1) TW201515533A (zh)

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TWI625229B (zh) * 2015-09-24 2018-06-01 Jx Nippon Mining & Metals Corp Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
WO2017149810A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102268478B1 (ko) * 2016-12-14 2021-06-22 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박 및 동 클래드 적층판
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP7033905B2 (ja) 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108449868B (zh) * 2017-02-07 2022-08-16 Ｊｘ金属株式会社 表面处理铜箔、带载体的铜箔、层压体、印刷配线板的制造方法及电子机器的制造方法
CN110832120B (zh) * 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108696987B (zh) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 表面处理铜箔、附有载体的铜箔、积层体、印刷布线板的制造方法及电子机器的制造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6632739B2 (ja) * 2017-04-25 2020-01-22 古河電気工業株式会社 表面処理銅箔
JP6430092B1 (ja) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019021895A1 (ja) * 2017-07-24 2019-01-31 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
WO2020039987A1 (ja) * 2018-08-22 2020-02-27 株式会社豊田自動織機 蓄電モジュール
CN113383117A (zh) * 2019-02-04 2021-09-10 松下知识产权经营株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜箔层压板、带树脂的铜箔和电路板
KR102349377B1 (ko) 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
CN110996557A (zh) * 2020-01-15 2020-04-10 深圳市聚永能科技有限公司 激光粗化印刷电路板铜箔表面的方法和设备

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Also Published As

Publication number Publication date
MY177723A (en) 2020-09-23
CN104427757A (zh) 2015-03-18
KR20150021474A (ko) 2015-03-02
CN104427757B (zh) 2018-08-28
TW201515533A (zh) 2015-04-16
TWI563888B (zh) 2016-12-21
JP2015061934A (ja) 2015-04-02
JP5885790B2 (ja) 2016-03-15

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