JP2018174135A - 熱放散効果を備えたledランプ - Google Patents
熱放散効果を備えたledランプ Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims description 41
- 238000007789 sealing Methods 0.000 claims description 16
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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- F21S10/00—Lighting devices or systems producing a varying lighting effect
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- F21S4/00—Lighting devices or systems using a string or strip of light sources
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- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
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- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
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Abstract
【解決手段】熱放散効果を有するLEDランプは、LED装置10およびランプ基部40を有する。LED装置はライトバー14および保護カバーを有し、ライトバーは、複数の導電性基板上に間隔を開けて配置されたLEDチップ、およびLEDチップを被覆するパッケージング層で形成される。保護カバーはライトバーを被覆し、内部を冷却液で充填される。冷却液は、冷却を目的としてライトバーに接触する。LEDチップによって発生する熱は、冷却液によって保護カバーに伝導され、次いで空気に分散され、それによって熱放散を向上する。
【選択図】図2
Description
上記の目的を達成するために、熱放散効果を備えたLEDランプは、以下の構成を備える。すなわち、
複数の導電性基板と、当該導電性基板上に配置された複数のLEDチップとを有するライトバー(light bar、照明バー)であって、各LEDチップは、2つの隣接した前記導電性基板によって受け入れられ(host、ホストされる)且つ電気的に接続された、両面発光するフリップチップであり、それぞれのLEDチップの上面および下面はそれぞれがパッケージング層(packaging layer)で被覆されており、ライトバーが導電性基板に接続される少なくとも1つのワイヤを有していることを特徴とする、ライトバーと、
絶縁性の光透過性チューブを備える保護カバーであって、前記光透過性チューブが、押し出し成形されたプラスチックチューブであり、且つライトバーを被覆することを特徴とする保護カバーと、
半透明(translucent)で絶縁性の冷却液であって、保護カバーに充填され、ライトバーに接触することを特徴とする冷却液と、
冷却液の漏出を防止するための保護カバーに配置された封止要素であって、ライトバーの少なくとも1つのワイヤのそれぞれが封止要素のそれぞれ1つを通過することを特徴とする封止要素と、
固定ブロックであって、保護カバーで被覆され冷却液で充填されたライトバーの端部が固定ブロックに固定され、回路基板が固定ブロックの内側に配置され、回路基板がライトバーの少なくとも1つのワイヤに電気的に接続されている固定ブロックと、
固定ブロックに取り付けられ、回路基板に電気的に接続されるランプ基部であって、外部電源に接続されるように構成されていることを特徴とするランプ基部と、を備える。
Claims (10)
- 熱放散効果を備えたLEDランプであって、
複数の導電性基板と、前記導電性基板上に配置された複数のLEDチップとを有するライトバーであって、それぞれのLEDチップが、二つの隣接する前記導電性基板によって受け入れられ且つ電気的に接続された両面発光するフリップチップであり、それぞれの前記LEDチップの上面および下面はそれぞれがパッケージング層で被覆されており、前記ライトバーが前記導電性基板に接続される少なくとも一つのワイヤを有することを特徴とするライトバーと、
絶縁性の光透過性チューブを備える保護カバーであって、前記光透過性チューブが押出成形で作成されたプラスチックチューブであり、且つ前記光透過性チューブが前記ライトバーを被覆していることを特徴とする保護カバーと、
半透明で絶縁性の冷却液であって、前記保護カバーに充填されており且つ前記ライトバーに接触することを特徴とする冷却液と、
前記冷却液の漏出を防止するために前記保護カバーに配置された封止要素であって、前記ライトバーの前記少なくとも一つのワイヤのそれぞれが前記封止要素のそれぞれ一つを通過することを特徴とする封止要素と、
固定ブロックであって、前記保護カバーで被覆され且つ前記冷却液で充填された前記ライトバーの端部が前記固定ブロックに固定され、回路基板が前記固定ブロックの内側に配置され、前記回路基板が前記ライトバーの前記少なくとも一つのワイヤに電気的に接続されることを特徴とする固定ブロックと、
前記固定ブロックに取り付けられ、前記回路基板に電気的に接続されるランプ基部であって、外部電源と接続されるように構成されていることを特徴とするランプ基部と、
を備えるLEDランプ。 - 前記封止要素は、前記光透過チューブの2つの端部にそれぞれ提供されていることを特徴とする請求項1に記載のLEDランプ。
- 前記保護カバーが更に少なくとも一つの熱放散チューブを含み、前記少なくとも一つの熱放散チューブは空洞であり、前記少なくとも一つの熱放散チューブは前記光透過性チューブと接続し且つ連通しており、前記冷却液が前記少なくとも一つの熱放散チューブおよび前記光透過性チューブを流れることを特徴とする請求項1または2に記載のLEDランプ。
- 前記少なくとも一つの熱放散チューブのそれぞれは金属製のチューブであることを特徴とする請求項3に記載のLEDランプ。
- 前記少なくとも一つの熱放散チューブが、前記光透過性チューブの前記二つの端部にそれぞれ接続された二つの熱放散チューブを含んでおり、前記封止要素がそれぞれの熱放散チューブの端部に提供されていることを特徴とする請求項4に記載のLEDランプ。
- 前記封止要素のそれぞれが環状のブロック、空洞のスリーブ、または硬化された粘着性物質であることを特徴とする請求項5に記載のLEDランプ。
- 前記保護カバーで被覆された前記ライトバーが、円形、洋梨型、ハート形、楕円形、三角形、台形、ひし形、剣型、または太極拳のシンボルの形状を有することを特徴とする請求項1に記載のLEDランプ。
- 前記保護カバーで被覆された前記ライトバーが、半円形、半分の洋梨型、半分のハート形、半楕円形、半分の三角形、半分の台形、半分のひし形、または半分の剣型であることを特徴とする請求項5に記載のLEDランプ。
- 色素が前記冷却液に添加されていることを特徴とする請求項1に記載のLEDランプ。
- 反射粒子が前記冷却液に添加されていることを特徴とする請求項1に記載のLEDランプ。
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US201762479327P | 2017-03-31 | 2017-03-31 | |
US62/479,327 | 2017-03-31 |
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JP2018174135A true JP2018174135A (ja) | 2018-11-08 |
JP6517974B2 JP6517974B2 (ja) | 2019-05-22 |
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JP2018017323A Active JP6630381B2 (ja) | 2017-03-31 | 2018-02-02 | Ledランプ |
JP2018061657A Active JP6517974B2 (ja) | 2017-03-31 | 2018-03-28 | 熱放散効果を備えたledランプ |
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EP (1) | EP3343098B1 (ja) |
JP (2) | JP6630381B2 (ja) |
CN (3) | CN108662446B (ja) |
DK (2) | DK3301354T3 (ja) |
ES (2) | ES2784922T3 (ja) |
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TWI678495B (zh) * | 2017-03-31 | 2019-12-01 | 液光固態照明股份有限公司 | 發光二極體燈具 |
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CN208312001U (zh) | 2019-01-01 |
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JP6630381B2 (ja) | 2020-01-15 |
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TW201837374A (zh) | 2018-10-16 |
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CN108692200A (zh) | 2018-10-23 |
TW201812205A (zh) | 2018-04-01 |
ES2784922T3 (es) | 2020-10-02 |
CN108692200B (zh) | 2020-06-02 |
US20180283674A1 (en) | 2018-10-04 |
CN108662446A (zh) | 2018-10-16 |
EP3343098A1 (en) | 2018-07-04 |
EP3343098B1 (en) | 2019-06-05 |
CN108662446B (zh) | 2020-06-23 |
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