CN208312001U - 具有散热效果的发光二极管灯具 - Google Patents

具有散热效果的发光二极管灯具 Download PDF

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CN208312001U
CN208312001U CN201820322059.6U CN201820322059U CN208312001U CN 208312001 U CN208312001 U CN 208312001U CN 201820322059 U CN201820322059 U CN 201820322059U CN 208312001 U CN208312001 U CN 208312001U
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heat
lamp bar
light
lamp
protective case
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黄建郎
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Liquidleds Lighting Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00—Lighting devices or systems producing a varying lighting effect
    • F21S10/002—Lighting devices or systems producing a varying lighting effect using liquids, e.g. water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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Abstract

本实用新型涉及一种具有散热效果的发光二极管灯具，该发光二极管灯具包括一发光二极管装置及一灯头；该发光二极管装置包含灯条及保护套，其中，该灯条是由在多个间隔设置的导电基板上设置发光二极管晶粒，再由一封装层包覆该多个发光二极管晶粒而构成，该保护套包覆该灯条且在该保护套内部填注导热液体，该导热液体与灯条直接接触以提供散热作用；通过该导热液体将发光二极管晶粒产生的热能传导至保护套，可使该些发光二极管晶粒所产生的热能快速散发至空气中，提高散热效果。

Description

具有散热效果的发光二极管灯具
技术领域
本实用新型涉及一种照明灯具，尤指一种具有散热效果的发光二极管灯具。
背景技术
美国专利US7,997,750B2公开了一种高功率LED灯泡，在灯泡中央具有一高功率的LED元件，该LED元件的周围环设一散热组件，该散热组件可由金属构成。虽然在灯泡内部填充有液体，但热能必须从LED元件先传递至散热组件，再由散热组件传递至液体，最后通过灯泡外壳传递至空气。在此专利中，因为灯泡外壳内部是大容积的空腔，作为发热源的LED元件相对灯泡外壳的距离较远，因此传热路径极长，不利于快速散热，再者，当空腔内部填满液体后若再加上整组散热组件的重量，则整体LED灯泡的重量及体积将明显提高。
另外，美国专利US2011/0255268A1、US2014/0015397A1也是将 LED设置在一散热基座上，该散热基座以金属制成并位于灯泡外壳的内部中心，两公开案也具有与上述专利相同的问题。
美国专利US8,115,370B2公开了一种LED弯管灯，多个LED芯片设置在一长带状的软性电路板上，再置入一玻璃弯管内，在玻璃弯管内可注入散热液。其中，此专利的LED芯片为单向发光且与相邻的 LED芯片相距较远，故不会产生连续光。且该软性电路板的宽度较大，相对的需要采用较大管径的玻璃弯管，其结构脆弱易于破裂，且受限于玻璃材质而无法任意设计造型。若在其内部再注入散热液，将提高重量而使其固定支点端(anchor)产生断裂。
实用新型内容
鉴于现有发光二极管灯泡虽填充有散热液体，但却需要额外金属散热件导致整体重量增加且传热距离较远等问题，本实用新型的主要目的是提供一以液体为散热媒介而且体积小、重量轻且散热快速的发光二极管灯具。
为达成前述目的，本实用新型的具有散热效果的发光二极管灯具包含有：一灯条，包含有多个导电基板及排列在导电基板上的多发光二极管晶粒，各发光二极管晶粒由两相邻的导电基板共同承载并且电性连接，各发光二极管晶粒为双面发光的倒装芯片，在该发光二极管晶粒的上下表面分别覆盖一封装层，其中，该灯条具有至少一导线连接该导电基板；一保护套，其包含有一绝缘可透光的透光管，该透光管为压出成型的塑料管体且包覆该灯条；导热液体，其为透光绝缘的液体，填入该保护套内部并与灯条直接接触；密封件，其设置在该保护套的端部以防止导热液体外漏，其中，该灯条的导线穿出该密封件，且该密封件维持该导热液体不外漏；一固定块，其包覆该保护套及填充该导热液体的灯条，其端点固定于该固定块，在该固定块内部容置一电路板，且该电路板与灯条的导线电性连接；一灯头，其与该固定块连接并电性连接该电路板，其中，该灯头供与一外部电源连接。
优选地，该透光管的两端分别设置有该密封件。
优选地，该保护套进一步包含至少一散热管；该散热管为中空且与该透光管相连接，使导热液体可在透光管及散热管中流通。
优选地，该散热管为一金属管。
优选地，具有散热效果的发光二极管灯具包含有两个该散热管，两个该散热管分别连接在该透光管的两端；在各散热管的末端设置该密封件。
优选地，该密封件为一环形块、一中空套体或一硬化胶体。
优选地，该包覆有保护套的灯条弯曲为圆形、梨形、心形、椭圆形、三角形、梯形、菱形、剑形或太极形。
优选地，该包覆有保护套的灯条弯曲为半圆形、半梨形、半心形、半椭圆形、半三角形、半梯形、半菱形或半剑形。
本实用新型利用灌注在保护套内的散热液体直接与灯条接触，将灯条产生的热能传导给保护管，再直接散热到保护套外围的空气，由于从灯条至保护管的距离极小，该散热液体能快速传导热能，提高散热效率。而且本实用新型无需使用额外金属制的散热元件，故可避免灯具重量过度增加，有利于降低灯具重量。
本实用新型的保护套具有一弯曲造型，故具有较长的管体长度，若在不同区段位置有明显的温度差异时，在保护套内部的导热液体因为温度差异可形成自然的对流效应，利用对流效果使散热效果更为均匀。
附图说明
图1：本实用新型的示意图。
图2：本实用新型的分解示意图。
图3：本实用新型的灯条示意图。
图4：本实用新型的灯条侧视示意图。
图5：本实用新型的LED装置剖面图。
图6：本实用新型在灯条外侧设置散热套的示意图。
图7A至图7I：本实用新型不同实施例的示意图。
图8A至图8H：本实用新型设置有散热套的不同实施例的示意图。
具体实施方式
参见图1至图2，本实用新型的具有散热效果的发光二极管灯具包含一LED装置10、一固定块20、一电路板30以及一灯头40。
该LED装置10包含一灯条14及一保护套16。如图3、图4所示，该灯条14具有多个发光二极管(LED)晶粒11、多个导电基板12及一封装层13。各LED晶粒11为倒装芯片结构的双面发光二极管，其具有至少一上出光面111，该LED晶粒11可透过该上出光面111将产生的光线向外投射，其中该上出光面111位于各LED晶粒11的顶部。各导电基板12为一金属导电薄片，各导电基板12呈间距依序排列，各LED晶粒11搭载在两相邻的导电基板12之间且电性连接该两相邻的导电基板12。该封装层13至少包含一上封装层131，以包覆各导电基板12的其中一表面及该表面上的LED晶粒11以构成灯条14。本实施例中，该灯条14具有可挠性。在本实施例中，如图3所示，在该灯条14一端的导电基板12延伸形成一第一导电部121，在该灯条14另一端的另一导电基板12延伸形成一第二导电部122，该第一导电部121 与该第二导电部122互为电极相异的两端，该第一导电部121及第二导电部122可分别连接一条导线123、124，用以接收电源；但是本实用新型的灯条14并不局限于具有两条导线123、124，在其它实施例中，只要可形成电源回路，灯条14只需具备单一导线。本实用新型的导电基板12与传统的软性电路板(flexible PCB)的设计不同，该导电基板 12的宽度相对较窄，可介于2mm～6mm之间，减轻因基板的宽度过大而只能在该宽面基板上呈现双面发光的效果，相反的，本实用新型因窄化该导电基板12，当LED晶粒11点亮后可以产生细长且全面的发光视觉效果。
如图5所示，在本实施例中，该封装层13包含有上封装层131及一下封装层132，且在各导电基板12的下表面设置一透光板15，光线能透过该透光板15向下散发；该透光板15的面积大于等于各导电基板12的面积。该上封装层131的截面大致为半椭圆状，且设置于该导电基板12的上表面并完全包覆该多个LED晶粒11，该下封装层132 的截面大致为半椭圆状，且覆盖导电基板12及LED晶粒的下表面。
该保护套16在本实施例中为一透光管160，该透光管160可成型为不同形状；且该透光管160为一绝缘体，其材质为透光材料，在保护该灯条14时也能具有良好的透光效果；该透光管160可利用压出成型的方式制造，再通过热塑工法等加热方式使其产生型变，再放入模具中成型，因此该透光管160为非玻璃的塑料材料。
在该保护套16内部灌注导热液体50，该导热液体50为透光绝缘不易自燃的液体，例如可采用硅油(silicon oil)。当导热液体50注入保护套16内部后，在该保护套16两端的开口分别置入一密封件161，该密封件可以是一环形块或一中空的套体，在该密封件161上具有一开孔，灯条14两端的导线123、124可穿过密封件161的开孔而连接至电路板30。在一实施例中，当导线穿过密封件161之后，可在密封件161的开孔上涂布封胶，令封胶硬化后封闭保护套16的两端，防止内部的导热液体50泄漏；或是该密封件161本身为可硬化的液态胶体，当导线穿过密封件161之后可待密封件161硬化后达到封闭保护套16 两端的效果。
参见图1，该固定块20上形成有多个穿孔22，本实施例中，该固定块20具有两个穿孔22，各穿孔22的孔径与该保护套16的外径相匹配，可使该LED装置10两端的第一导电部121及第二导电部122分别插入两穿孔22，并固定在该穿孔22内部，使该LED装置10得以维持牢固状态。
该电路板30设置在固定块20内部，在该电路板30上设有多个电极连接点，本实施例中包含两个电极连接点311a、311b，各电极连接点311a、311b互为相异极性，例如一正极连接点与一负极连接点，该正极连接点可与该第一导电部121电性连接，该负极连接点可与该第二导电部122电性连接；该电路板30上可设有电子组件，例如电容、电阻IC等而构成一控制电路。
该灯头40的内部具有一第一电性连接部41，该灯头40的侧边具有一第二电性连接部43，该第一电性连接部41与该第二电性连接部 43互为相异极性且分别连接一外部电源，该第一电性连接部41与该第二电性连接部43用于分别与该电路板30的电极连接点33a、33b电性连接，本实施例中，该第二电性连接部43为螺纹结构。
本实用新型因为在保护套16内部填入导热液体50与灯条14直接接触，因此由LED晶粒11产生的热能可以直接传递至导热液体50，再由导热液体50传递至保护套16，最后直接散逸在空气中，达到良好的散热效果。因为本实用新型并不需使用其它额外的金属散热结构，不会提高灯具的重量。
再者，如图7A至图7I的不同实施例，该长条状的保护套16因为呈多种弯曲长条状，其整体长度相对较长，若不同区段的温度有明显的温度时，在保护套16内部的导热液体50可产生自然的热对流效应，位在较高温度区段的导热液体50可流至较低温度区段，利用热对流效果提高散热效率。举例而言，图7A所示的该LED装置10即弯折一圆形，形成如同一般灯泡的形状；如图7B所示，该LED装置10弯折成一梨形；如图7C所示，该LED装置10弯折成一心形；如图7D所示，该LED装置10弯折成椭圆形；如图7E所示，该LED装置10弯折成一三角形；如图7F所示，该LED装置10弯折成一梯形；如图7G所示，该LED装置10弯折成一菱形；如图7H所示，该LED装置10弯折成一剑形；如图7I所示，两个LED装置10弯折排列成一太极形，各LED装置10采单端连接至电路板30。通过将该LED装置10弯曲成数种不同的造型，以提供用户多样化的造型选择。
参考图6所示，在本实施例中，该保护套16包含有一透光管160 及至少一散热管162，在此以两散热管162为例说明。该灯条14由该透光管160所包覆。该散热管162的材质可选用导热效率高的材质构成，例如金属材质。该散热管162也是一中空的管体，两散热管162分别连接在该透光管160的两端，使导热液体50可以在透光管160与散热管162之间任意流动传热。
在图6的实施例中，因为导热液体50可直接与散热管162接触，而该散热管162因其材质具有比透光管160更高的散热效率，故可以更进一步提高灯具的散热效果。除此之外，通过适当地设计散热管162 的位置可设计出多段的线状亮区及暗区，如图8A至图8H所示，创造出特殊的视觉效果。举例而言，图8A所示的该LED装置10呈现一新月形；如图8B所示，该LED装置10呈现半梨形；如图8C所示，该 LED装置10呈现半心形；如图8D所示，该LED装置10呈现半椭圆形；如图8E所示，该LED装置10呈现半三角形；如图8F所示，该 LED装置10弯折成半梯形；如图8G所示，该LED装置10呈现半菱形；如图8H所示，该LED装置10呈现半剑形。

Claims (8)

1.一种具有散热效果的发光二极管灯具，其特征在于包含：
一灯条，其包含有多个导电基板及排列在导电基板上的多发光二极管晶粒，各发光二极管晶粒由两相邻的导电基板共同承载并且电性连接，各发光二极管晶粒为双面发光的倒装芯片，在该发光二极管晶粒的上下表面分别覆盖一封装层，其中，该灯条具有至少一导线连接该导电基板；
一保护套，其包含有一绝缘可透光的透光管，该透光管为压出成型的塑料管体且包覆该灯条；
导热液体，其为透光绝缘的液体，填入该保护套内部并与灯条直接接触；
密封件，其设置在该保护套的端部以防止导热液体外漏，其中，该灯条的导线穿出该密封件，且该密封件维持该导热液体不外漏；
一固定块，其包覆该保护套及填充该导热液体的灯条，其端点固定于该固定块，在该固定块内部容置一电路板，且该电路板与灯条的导线电性连接；
一灯头，其与该固定块连接并电性连接该电路板，其中，该灯头供与一外部电源连接。
2.如权利要求1所述的具有散热效果的发光二极管灯具，其特征在于，该透光管的两端分别设置有该密封件。
3.如权利要求1或2所述的具有散热效果的发光二极管灯具，其特征在于，该保护套进一步包含至少一散热管；该散热管为中空且与该透光管相连接，使导热液体可在透光管及散热管中流通。
4.如权利要求3所述的具有散热效果的发光二极管灯具，其特征在于，该散热管为一金属管。
5.如权利要求4所述的具有散热效果的发光二极管灯具，其特征在于，其包含有两个该散热管，两个该散热管分别连接在该透光管的两端；在各散热管的末端设置该密封件。
6.如权利要求5所述的具有散热效果的发光二极管灯具，其特征在于，该密封件为一环形块、一中空套体或一硬化胶体。
7.如权利要求1所述的具有散热效果的发光二极管灯具，其特征在于，该包覆有保护套的灯条弯曲为圆形、心形、椭圆形、三角形、梯形或菱形。
8.如权利要求5所述的具有散热效果的发光二极管灯具，其特征在于，该包覆有保护套的灯条弯曲为半圆形、半心形、半椭圆形、半三角形、半梯形或半菱形。
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