TWM563517U - 具散熱效果的發光二極體燈具 - Google Patents

具散熱效果的發光二極體燈具 Download PDF

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TWM563517U
TWM563517U TW107202433U TW107202433U TWM563517U TW M563517 U TWM563517 U TW M563517U TW 107202433 U TW107202433 U TW 107202433U TW 107202433 U TW107202433 U TW 107202433U TW M563517 U TWM563517 U TW M563517U
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light
heat
emitting diode
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light bar
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黃建郎
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液光固態照明股份有限公司
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00—Lighting devices or systems producing a varying lighting effect
    • F21S10/002—Lighting devices or systems producing a varying lighting effect using liquids, e.g. water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
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Abstract

本創作係關於一種具散熱效果的發光二極體(LED)燈具，該LED燈具包括一LED裝置及一燈頭；該LED裝置包含複數一燈條及一保護套，其中，該燈條係由在複數個間隔設置的導電基板上設置LED晶粒，再由一封裝層包覆該複數個LED晶粒而構成，該保護套係包覆該燈條且在該保護套內部係填注導熱液體，該導熱液體與燈條直接接觸以提供散熱作用；藉由該導熱液體將LED晶粒產生的熱能傳導至保護套，可使該些LED晶粒所產生的熱能快速散發至空氣中，提高散熱效果。

Description

具散熱效果的發光二極體燈具
本創作係有關一種照明燈具，尤指一種具散熱效果的發光二極體燈具。
美國專利US7,997,750 B2揭露一種高功率LED燈泡，在燈泡中央具有一高功率的LED元件，該LED元件的周圍環設一散熱組件，該散熱組件可由金屬構成。雖然於燈泡內部有填充液體，但熱能必須從LED元件先傳遞至散熱組件，再由散熱組件傳遞至液體，最後通過燈泡外殼傳遞至空氣。在此專利中，因為燈泡外殼內部是大容積的空腔，作為發熱源的LED元件相對燈泡外殼的距離較遠，因此傳熱路徑極長，不利於快速散熱，再者，當空腔內部填滿液體後若再加上整組散熱組件的重量，則整體LED燈泡的重量及體積將明顯提高。
另外美專US2011/0255268A1、US2014/0015397A1亦是將LED設置在一散熱基座上，該散熱基座以金屬製成並位於燈泡外殼的內部中心，兩公開案亦具有與上述專利相同的問題。
美國專利US8,115,370 B2揭露一種LED彎管燈，複數個LED晶片設置在一長帶狀的軟性電路板上，再置入於一玻璃彎管內，在玻璃彎管內可注入散熱液。其中，此專利的LED晶片為單向發光且與相鄰之LED晶片相距較遠，故不會產生連續光。且該軟性電路板的寬度較大，相對的需要採用較大管徑的玻璃彎管，其結構脆弱易於破裂，且受限於玻璃材質而無法任意設計造型。若在其內部再注入散熱液，將提高重量而使其固定支點端(anchor)產生斷裂。
鑑於現有發光二極體燈泡雖填充有散熱液體，但卻需要額外金屬散熱件導致整體重量增加且傳熱距離較遠等問題，本創作之主要目的係提供一以液體為散熱媒介而且體積小、重量輕且散熱快速的發光二極體燈具。
為達成前述目的，本創作具散熱效果的發光二極體燈具包含有： 一燈條，包含有複數個導電基板及排列在導電基板上的複數發光二極體晶粒，各發光二極體晶粒由兩相鄰的導電基板共同承載並且電性連接，各發光二極體晶粒為雙面發光的倒裝晶片，在該發光二極體晶粒之上下表面係各別覆蓋一封裝層，其中，該燈條具有至少一導線連接該導電基板； 一保護套，包含有一絕緣可透光的透光管，該透光管為押出成型的塑膠管體且包覆該燈條； 導熱液體，為透光絕緣的液體，係填入於該保護套內部並與燈條直接接觸； 密封件，係設置在該保護套的端部以防止導熱液體外漏，其中，該燈條的導線係穿出該密封件，且該密封件維持該導熱液體不外漏； 一固定塊，其中，已包覆該保護套及填充該導熱液體的燈條，其端點固定於該固定塊，於該固定塊內部容置一電路板，且該電路板與燈條的導線電性連接； 一燈頭，與該固定塊連結並電性連接該電路板，其中，該燈頭供與一外部電源連接。
本創作利用灌注在保護套內的散熱液體直接與燈條接觸，將燈條產生的熱能傳導給保護管，再直接散熱到保護套外圍的空氣，由於從燈條至保護管的距離極小，該散熱液體能快速傳導熱能，提高散熱效率。而且本創作無需使用額外金屬製的散熱元件，故可避免燈具重量過度增加，有利於降低燈具重量。
本創作之保護套具有一彎曲造型，故具有較長的管體長度，若在不同區段位置有明顯的溫度差異時，在保護套內部的導熱液體因為溫度差異可形成自然的對流效應，利用對流效果使散熱效果更為均勻。
請參見圖1至2，本創作具散熱效果的發光二極體燈具包含一LED裝置10、一固定塊20、一電路板30以及一燈頭40。
該LED裝置10包含一燈條14及一保護套16。如圖3、4所示，該燈條14具有複數個發光二極體(LED)晶粒11、複數個導電基板12及一封裝層13。各LED晶粒11為倒裝晶片結構的雙面發光二極體，其具有至少一上出光面111，該LED晶粒11可透過該上出光面111將產生的光線向外投射，其中該上出光面111位於各LED晶粒11之頂部。各導電基板12為一金屬導電薄片，各導電基板12呈間距依序排列，各LED晶粒11搭載在兩相鄰的導電基板12之間且電性連接該兩相鄰的導電基板12。該封裝層13至少包含一上封裝層131，以包覆各導電基板12的其中一表面及該表面上的LED晶粒11以構成燈條14。本實施例中，該燈條14具有可撓性。在本實施例中，如圖3所示，在該燈條14一端的導電基板12延伸形成一第一導電部121，在該燈條14另一端的另一導電基板12延伸形成一第二導電部122，該第一導電部121與該第二導電部122互為電極相異之兩端，該第一導電部121及第二導電部122可各別連接一條導線123、124，用以接收電源；惟本創作的燈條14並不侷限於具有兩條導線123、124，在其它實施例中，只要可形成電源迴路，燈條14只需具備單一導線。本創作之導電基板12與傳統之軟性電路板(flexible PCB)的設計不同，該導電基板12之寬度相對較窄，可介於2mm~6mm之間，減輕因基板之寬度過大而只能在該寬面基板上呈現雙面發光的效果，相反的，本創作因窄化該導電基板12，當LED晶粒11點亮後可以產生細長且全面的發光視覺效果。
如圖5所示，在本實施例中，該封裝層13包含有上封裝層131及一下封裝層132，且在各導電基板12之下表面設置一透光板15，光線能透過該透光板15向下散發；該透光板15之面積大於等於各導電基板12的面積。該上封裝層131的截面大致為半橢圓狀，且設置於該導電基板12之上表面並完全包覆該複數個LED晶粒11，該下封裝層132的截面大致為半橢圓狀，且覆蓋導電基板12及LED晶粒之下表面。
該保護套16在本實施例中為一透光管160，該透光管160可成型為不同形狀；且該透光管160為一絕緣體，其材質為透光材料，在保護該燈條14時亦能具有良好的透光效果；該透光管160可利用押出成型的方式製造，再透過熱塑工法等加熱方式使其產生型變，再放入模具中成型，因此該透光管160為非玻璃的塑膠材料。
在該保護套16內部係灌注導熱液體50，該導熱液體50為透光絕緣不易自燃的液體，例如可採用矽油(silicon oil)。當導熱液體50注入保護套16內部後，在該保護套16兩端的開口分別置入一密封件161，該密封件可以是一一環形塊或一中空的套體，在該密封件161上具有一開孔，燈條14兩端的導線123、124可穿過密封件161的開孔而連接至電路板30。在一實施例中，當導線穿過密封件161之後，可在密封件161的開孔上塗佈封膠，令封膠硬化後封閉保護套16的兩端，防止內部的導熱液體50洩漏；或是該密封件161本身為可硬化的液態膠體，當導線穿過密封件161之後可待密封件161硬化後達到封閉保護套16兩端的效果。
請參見圖1，該固定塊20上形成有複數個穿孔22，本實施例中，該固定塊20具有兩個穿孔22，各穿孔22之孔徑與該保護套16的外徑相匹配，可使該LED裝置10兩端的第一導電部121及第二導電部122分別插入兩穿孔22，並固定在該穿孔22內部，使該LED裝置10得以維持牢固狀態。
該電路板30係設置在固定塊20內部，在該電路板30上設有複數個電極連接點，本實施例中包含兩個電極連接點311a、311b，各電極連接點311a、311b 互為相異極性，例如一正極連接點與一負極連接點，該正極連接點可與該第一導電部121電性連接，該負極連接點可與該第二導電部122電性連接；該電路板30上可設有電子元件，例如電容、電阻IC等而構成一控制電路。
該燈頭40的內部具有一第一電性連接部41，該燈頭40之側邊具有一第二電性連接部43，該第一電性連接部41與該第二電性連接部43互為相異極性且分別連接一外部電源，該第一電性連接部41與該第二電性連接部43用於分別與該電路板30之電極連接點33a、33b電性連接，本實施例中，該第二電性連接部43為螺紋結構。
本創作因為在保護套16內部填入導熱液體50與燈條14直接接觸，因此由LED晶粒11產生的熱能可以直接傳遞至導熱液體50，再由導熱液體50傳遞至保護套16，最後直接散逸在空氣中，達到良好的散熱效果。因為本創作並不需使用其它額外的金屬散熱結構，不會提高燈具的重量。
再者，如附件1A~附件1I的不同實施例，該長條狀的保護套16因為呈多種彎曲長條狀，其整體長度相對較長，若不同區段的溫度有明顯的溫度時，在保護套16內部的導熱液體50可產生自然的熱對流效應，位在較高溫度區段的導熱液體50可流至較低溫度區段，利用熱對流效果提高散熱效率。舉例而言，附件1A所示的該LED裝置10即彎折一圓形，形成如同一般燈泡之形狀；如附件1B所示，該LED裝置10彎折成一梨形；如附件1C所示，該LED裝置10彎折成一心形；如附件1D所示，該LED裝置10彎折成橢圓形；如附件1E所示，該LED裝置10彎折成一三角形；如附件1F所示，該LED裝置10彎折成一梯形；如附件1G所示，該LED裝置10彎折成一菱形；如附件1H所示，該LED裝置10彎折成一劍形；如附件1I所示，兩個LED裝置10彎折排列成一太極形，各LED裝置10採單端連接至電路板30。藉由將該LED裝置10彎曲成數種不同的造型，以提供使用者多樣化的造型選擇。
請參考圖6所示，在本實施例中，該保護套16包含有一透光管160及至少一散熱管162，在此以兩散熱管162為例說明。該燈條14由該透光管160所包覆。該散熱管162的材質可選用導熱效率高的材質構成，例如金屬材質。該散熱管162亦是一中空的管體，兩散熱管162分別連接在該透光管160的兩端，使導熱液體50可以在透光管160與散熱管162之間任意流動傳熱。
在圖6的實施例中，因為導熱液體50可直接與散熱管162接觸，而該散熱管162因其材質具有比透光管160更高的散熱效率，故可以更進一步提高燈具的散熱效果。除此之外，藉由適當地設計散熱管162的位置可設計出多段的線狀亮區及暗區，如附件2A~附件2H所示，創造出特殊的視覺效果。舉例而言，附件2A所示的該LED裝置10呈現一新月形；如附件2B所示，該LED裝置10呈現半梨形；如附件2C所示，該LED裝置10呈現半心形；如附件2D所示，該LED裝置10呈現半橢圓形；如附件2E所示，該LED裝置10呈現半三角形；如附件2F所示，該LED裝置10彎折成半梯形；如附件2G所示，該LED裝置10呈現半菱形；如附件2H所示，該LED裝置10呈現半劍形。
10‧‧‧LED裝置
11‧‧‧發光二極體晶粒
111‧‧‧上出光面
12‧‧‧導電基板
121‧‧‧第一導電部
122‧‧‧第二導電部
123、124‧‧‧導線
125‧‧‧第一導電部
126‧‧‧第二導電部
13‧‧‧封裝層
131‧‧‧上封裝層
132‧‧‧下封裝層
14‧‧‧燈條
15‧‧‧透光板
16‧‧‧保護套
160‧‧‧透光管
161‧‧‧密封件
162‧‧‧散熱管
20‧‧‧固定塊
22‧‧‧穿孔
30‧‧‧電路板
311a、311b‧‧‧電極連接點
33a、33b‧‧‧電極連接端
40‧‧‧燈頭
41‧‧‧第一電性連接部
43‧‧‧第二電性連接部
50‧‧‧導熱液體
圖1：本創作之示意圖。 圖2：本創作之分解示意圖。 圖3：本創作之燈條示意圖。 圖4：本創作之燈條側視示意圖。 圖5：本創作之LED裝置剖面圖。 圖6：本創作在燈條外側設置散熱套之示意圖。 附件1A~附件1I：本創作不同實施例之圖片。 附件2A~附件2H：本創作在設置散熱套之不同實施例圖片。

Claims (8)

  1. 一種具散熱效果的發光二極體燈具，包含： 一燈條，包含有複數個導電基板及排列在導電基板上的複數發光二極體晶粒，各發光二極體晶粒由兩相鄰的導電基板共同承載並且電性連接，各發光二極體晶粒為雙面發光的倒裝晶片，在該發光二極體晶粒之上下表面係各別覆蓋一封裝層，其中，該燈條具有至少一導線連接該導電基板； 一保護套，包含有一絕緣可透光的透光管，該透光管為押出成型的塑膠管體且包覆該燈條； 導熱液體，為透光絕緣的液體，係填入於該保護套內部並與燈條直接接觸； 密封件，係設置在該保護套的端部以防止導熱液體外漏，其中，該燈條的導線係穿出該密封件，且該密封件維持該導熱液體不外漏； 一固定塊，其中，已包覆該保護套及填充該導熱液體的燈條，其端點固定於該固定塊，於該固定塊內部容置一電路板，且該電路板與燈條的導線電性連接； 一燈頭，與該固定塊連結並電性連接該電路板，其中，該燈頭供與一外部電源連接。
  2. 如請求項1所述具散熱效果的發光二極體燈具，其中，該透光管的兩端分別設置有該密封件。
  3. 如請求項1或2所述具散熱效果的發光二極體燈具，其中，該保護套進一步包含至少一散熱管；該散熱管為中空且與該透光管相連接，使導熱液體可在透光管及散熱管中流通。
  4. 如請求項3所述具散熱效果的發光二極體燈具，其中，該散熱管為一金屬管。
  5. 如請求項4所述具散熱效果的發光二極體燈具，係包含有兩個該散熱管，兩個該散熱管分別連接在該透光管的兩端；於各散熱管的末端係設置該密封件。
  6. 如請求項5所述具散熱效果的發光二極體燈具，該密封件為一環形塊、一中空套體或一硬化膠體。
  7. 如請求項1所述具散熱效果的發光二極體燈具，其中，該包覆有保護套的燈條係彎曲為圓形、梨形、心形、橢圓形、三角形、梯形、菱形、劍形或太極形。
  8. 如請求項5所述具散熱效果的發光二極體燈具，其中，該包覆有保護套的燈條係彎曲為半圓形、半梨形、半心形、半橢圓形、半三角形、半梯形、半菱形或半劍形。
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