JP2018148155A5 - - Google Patents

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Publication number
JP2018148155A5
JP2018148155A5 JP2017044645A JP2017044645A JP2018148155A5 JP 2018148155 A5 JP2018148155 A5 JP 2018148155A5 JP 2017044645 A JP2017044645 A JP 2017044645A JP 2017044645 A JP2017044645 A JP 2017044645A JP 2018148155 A5 JP2018148155 A5 JP 2018148155A5
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JP
Japan
Prior art keywords
recess
device unit
electronic component
main surface
substrate
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Application number
JP2017044645A
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English (en)
Japanese (ja)
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JP2018148155A (ja
JP6968553B2 (ja
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Priority to JP2017044645A priority Critical patent/JP6968553B2/ja
Priority claimed from JP2017044645A external-priority patent/JP6968553B2/ja
Priority to US15/910,882 priority patent/US10367102B2/en
Priority to CN201810192411.3A priority patent/CN108573988B/zh
Publication of JP2018148155A publication Critical patent/JP2018148155A/ja
Publication of JP2018148155A5 publication Critical patent/JP2018148155A5/ja
Application granted granted Critical
Publication of JP6968553B2 publication Critical patent/JP6968553B2/ja
Active legal-status Critical Current
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JP2017044645A 2017-03-09 2017-03-09 電子部品及びその製造方法 Active JP6968553B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017044645A JP6968553B2 (ja) 2017-03-09 2017-03-09 電子部品及びその製造方法
US15/910,882 US10367102B2 (en) 2017-03-09 2018-03-02 Electronic component and equipment
CN201810192411.3A CN108573988B (zh) 2017-03-09 2018-03-09 电子部件和装备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017044645A JP6968553B2 (ja) 2017-03-09 2017-03-09 電子部品及びその製造方法

Publications (3)

Publication Number Publication Date
JP2018148155A JP2018148155A (ja) 2018-09-20
JP2018148155A5 true JP2018148155A5 (Direct) 2020-04-16
JP6968553B2 JP6968553B2 (ja) 2021-11-17

Family

ID=63445588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017044645A Active JP6968553B2 (ja) 2017-03-09 2017-03-09 電子部品及びその製造方法

Country Status (3)

Country Link
US (1) US10367102B2 (Direct)
JP (1) JP6968553B2 (Direct)
CN (1) CN108573988B (Direct)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102849294B1 (ko) 2021-01-26 2025-08-25 삼성전자주식회사 분리 구조물을 포함하는 이미지 센서

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093708A (en) * 1990-08-20 1992-03-03 Grumman Aerospace Corporation Multilayer integrated circuit module
US5986334A (en) 1996-10-04 1999-11-16 Anam Industrial Co., Ltd. Semiconductor package having light, thin, simple and compact structure
KR101078621B1 (ko) 2003-07-03 2011-11-01 테쎄라 테크놀로지스 아일랜드 리미티드 집적회로 디바이스를 패키징하기 위한 방법 및 장치
JP2005116943A (ja) * 2003-10-10 2005-04-28 Seiko Epson Corp プリント配線基板、実装基板モジュール、プリント配線基板の製造方法、およびそれを用いた電気光学装置、電子機器
JP4331033B2 (ja) * 2004-03-29 2009-09-16 浜松ホトニクス株式会社 半導体光検出素子及びその製造方法
JP2006128625A (ja) 2004-09-30 2006-05-18 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
EP1961696B1 (en) * 2005-11-16 2013-09-04 Kyocera Corporation Electronic device using electronic part sealing board and method of fabricating same
US7919410B2 (en) * 2007-03-14 2011-04-05 Aptina Imaging Corporation Packaging methods for imager devices
JP2009141092A (ja) * 2007-12-06 2009-06-25 Taiyo Yuden Co Ltd 半導体装置を実装した回路装置及びこれに用いる半導体装置の製造方法
JP2010166004A (ja) * 2009-01-19 2010-07-29 Panasonic Corp 半導体装置及びその製造方法
JP2010238995A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体モジュールおよびこれを搭載したカメラモジュール
JP5694670B2 (ja) 2010-02-05 2015-04-01 キヤノン株式会社 固体撮像装置およびその製造方法
JP5877291B2 (ja) 2010-05-14 2016-03-08 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
US8558392B2 (en) * 2010-05-14 2013-10-15 Stats Chippac, Ltd. Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
JP2012182309A (ja) * 2011-03-01 2012-09-20 Seiko Instruments Inc 光学デバイス
JP5709165B2 (ja) 2011-03-10 2015-04-30 セイコーインスツル株式会社 光学デバイス
JP6164879B2 (ja) 2013-03-08 2017-07-19 セイコーインスツル株式会社 パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2015002414A (ja) 2013-06-14 2015-01-05 セイコーインスツル株式会社 電子デバイス
JP6554338B2 (ja) 2014-07-28 2019-07-31 ローム株式会社 半導体装置
JP6373678B2 (ja) * 2014-07-28 2018-08-15 ローム株式会社 半導体装置
JP6425933B2 (ja) 2014-07-28 2018-11-21 ローム株式会社 半導体装置
JP2016100554A (ja) 2014-11-26 2016-05-30 ローム株式会社 半導体装置

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