JP2018141699A - 電子部品搬送装置および電子部品検査装置 - Google Patents

電子部品搬送装置および電子部品検査装置 Download PDF

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Publication number
JP2018141699A
JP2018141699A JP2017035980A JP2017035980A JP2018141699A JP 2018141699 A JP2018141699 A JP 2018141699A JP 2017035980 A JP2017035980 A JP 2017035980A JP 2017035980 A JP2017035980 A JP 2017035980A JP 2018141699 A JP2018141699 A JP 2018141699A
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Japan
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electronic component
information
unit
button
setting screen
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JP2017035980A
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English (en)
Japanese (ja)
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JP2018141699A5 (enExample
Inventor
山崎　孝
Takashi Yamazaki
孝 山崎
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Seiko Epson Corp
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Seiko Epson Corp
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Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2017035980A priority Critical patent/JP2018141699A/ja
Priority to TW107105516A priority patent/TWI696234B/zh
Priority to CN201810156886.7A priority patent/CN108508345A/zh
Publication of JP2018141699A publication Critical patent/JP2018141699A/ja
Publication of JP2018141699A5 publication Critical patent/JP2018141699A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • User Interface Of Digital Computer (AREA)
JP2017035980A 2017-02-28 2017-02-28 電子部品搬送装置および電子部品検査装置 Pending JP2018141699A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017035980A JP2018141699A (ja) 2017-02-28 2017-02-28 電子部品搬送装置および電子部品検査装置
TW107105516A TWI696234B (zh) 2017-02-28 2018-02-14 電子零件搬送裝置及電子零件檢查裝置
CN201810156886.7A CN108508345A (zh) 2017-02-28 2018-02-24 电子元器件传送装置以及电子元器件检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017035980A JP2018141699A (ja) 2017-02-28 2017-02-28 電子部品搬送装置および電子部品検査装置

Publications (2)

Publication Number Publication Date
JP2018141699A true JP2018141699A (ja) 2018-09-13
JP2018141699A5 JP2018141699A5 (enExample) 2020-02-27

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Family Applications (1)

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JP2017035980A Pending JP2018141699A (ja) 2017-02-28 2017-02-28 電子部品搬送装置および電子部品検査装置

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JP (1) JP2018141699A (enExample)
CN (1) CN108508345A (enExample)
TW (1) TWI696234B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202443168A (zh) * 2020-12-22 2024-11-01 韓商泰克元股份有限公司 電子元件輸送裝置及用於處理電子元件的分類機

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001516885A (ja) * 1997-09-16 2001-10-02 テラダイン・インコーポレーテッド 集積回路検査システム用プロダクション・インターフェース
US20030113010A1 (en) * 2001-12-17 2003-06-19 Mirae Corporation Method for recognizing working position of a device transfer apparatus in semiconductor test handler
JP2009532695A (ja) * 2006-04-04 2009-09-10 オプティマルテスト エルティーディー． 試験シナリオ言語を用いた半導体試験方法およびシステム
JP2011106852A (ja) * 2009-11-13 2011-06-02 Seiko Epson Corp 電子部品検査装置
JP2016161296A (ja) * 2015-02-26 2016-09-05 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016176897A (ja) * 2015-03-23 2016-10-06 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5720031A (en) * 1995-12-04 1998-02-17 Micron Technology, Inc. Method and apparatus for testing memory devices and displaying results of such tests
JPH1138083A (ja) * 1997-07-14 1999-02-12 Advantest Corp Ｉｃテストハンドラ
KR19990013599A (ko) * 1997-07-14 1999-02-25 오노히로시게 아이.씨. 테스트 핸들러
TW586174B (en) * 2003-02-27 2004-05-01 Taiwan Semiconductor Mfg Petri-Net based simulation method for a probed equipment of an IC foundry
JP4221014B2 (ja) * 2006-06-20 2009-02-12 ファナック株式会社 ロボット制御装置
JP5621313B2 (ja) * 2010-05-14 2014-11-12 セイコーエプソン株式会社 電子部品検査装置及び電子部品搬送方法
JP5713589B2 (ja) * 2010-06-30 2015-05-07 東洋機械金属株式会社 成形機
JP5903858B2 (ja) * 2011-12-06 2016-04-13 セイコーエプソン株式会社 電子部品搬送装置及び電子部品検査装置
US20130200915A1 (en) * 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
JP2016070777A (ja) * 2014-09-30 2016-05-09 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016156715A (ja) * 2015-02-25 2016-09-01 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN106405368A (zh) * 2015-07-31 2017-02-15 精工爱普生株式会社 电子部件搬送装置以及电子部件检查装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001516885A (ja) * 1997-09-16 2001-10-02 テラダイン・インコーポレーテッド 集積回路検査システム用プロダクション・インターフェース
US20030113010A1 (en) * 2001-12-17 2003-06-19 Mirae Corporation Method for recognizing working position of a device transfer apparatus in semiconductor test handler
JP2009532695A (ja) * 2006-04-04 2009-09-10 オプティマルテスト エルティーディー． 試験シナリオ言語を用いた半導体試験方法およびシステム
JP2011106852A (ja) * 2009-11-13 2011-06-02 Seiko Epson Corp 電子部品検査装置
JP2016161296A (ja) * 2015-02-26 2016-09-05 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016176897A (ja) * 2015-03-23 2016-10-06 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置

Also Published As

Publication number Publication date
CN108508345A (zh) 2018-09-07
TWI696234B (zh) 2020-06-11
TW201834127A (zh) 2018-09-16

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