JP2018137213A5 - - Google Patents

Download PDF

Info

Publication number
JP2018137213A5
JP2018137213A5 JP2018012439A JP2018012439A JP2018137213A5 JP 2018137213 A5 JP2018137213 A5 JP 2018137213A5 JP 2018012439 A JP2018012439 A JP 2018012439A JP 2018012439 A JP2018012439 A JP 2018012439A JP 2018137213 A5 JP2018137213 A5 JP 2018137213A5
Authority
JP
Japan
Prior art keywords
conductive ink
melting point
low melting
hybrid conductive
silver nanoparticles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018012439A
Other languages
English (en)
Japanese (ja)
Other versions
JP6975055B2 (ja
JP2018137213A (ja
Filing date
Publication date
Priority claimed from US15/439,754 external-priority patent/US10492297B2/en
Application filed filed Critical
Publication of JP2018137213A publication Critical patent/JP2018137213A/ja
Publication of JP2018137213A5 publication Critical patent/JP2018137213A5/ja
Application granted granted Critical
Publication of JP6975055B2 publication Critical patent/JP6975055B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018012439A 2017-02-22 2018-01-29 ハイブリッドナノ銀/液体金属インク組成物およびその使用 Expired - Fee Related JP6975055B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/439,754 US10492297B2 (en) 2017-02-22 2017-02-22 Hybrid nanosilver/liquid metal ink composition and uses thereof
US15/439,754 2017-02-22

Publications (3)

Publication Number Publication Date
JP2018137213A JP2018137213A (ja) 2018-08-30
JP2018137213A5 true JP2018137213A5 (cg-RX-API-DMAC7.html) 2021-03-18
JP6975055B2 JP6975055B2 (ja) 2021-12-01

Family

ID=61231042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018012439A Expired - Fee Related JP6975055B2 (ja) 2017-02-22 2018-01-29 ハイブリッドナノ銀/液体金属インク組成物およびその使用

Country Status (5)

Country Link
US (3) US10492297B2 (cg-RX-API-DMAC7.html)
EP (1) EP3366732B1 (cg-RX-API-DMAC7.html)
JP (1) JP6975055B2 (cg-RX-API-DMAC7.html)
KR (1) KR102314393B1 (cg-RX-API-DMAC7.html)
CA (1) CA2994749C (cg-RX-API-DMAC7.html)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10428234B2 (en) * 2017-09-25 2019-10-01 United States Of America As Represented By The Secretary Of The Air Force Liquid metal ink
US10800948B2 (en) * 2018-08-02 2020-10-13 Xerox Corporation Conductive adhesive compositions and method for the same
US10947424B2 (en) 2018-08-02 2021-03-16 Xerox Corporation Adhesive composition comprising eutectic metal alloy nanoparticles
US10843262B2 (en) 2018-08-02 2020-11-24 Xerox Corporation Compositions comprising eutectic metal alloy nanoparticles
US11142671B2 (en) 2018-08-02 2021-10-12 Xerox Corporation Adhesive composition comprising metal nanoparticles
JP7342024B2 (ja) * 2018-10-31 2023-09-11 ソニーグループ株式会社 撮影装置、制御方法、及び、プログラム
US11898021B2 (en) * 2019-01-04 2024-02-13 Syracuse University Polymeric composites with tunable properties
US11017915B2 (en) * 2019-01-23 2021-05-25 Carnegie Mellon University Stretchable electronics and methods of making the same
FR3101881B1 (fr) * 2019-10-10 2022-02-18 Commissariat Energie Atomique Encre comprenant des nanoparticules métalliques à structure cœur-coquille et sa mise en œuvre par impression par jet d’encre et frittage laser
CN111774576A (zh) * 2020-07-09 2020-10-16 东莞职业技术学院 一种纳米金属颗粒的制备方法
US20220108975A1 (en) * 2020-10-05 2022-04-07 Stmicroelectronics S.R.L. Silver nanoparticles synthesis method for low temperature and pressure sintering
US11631565B2 (en) 2020-11-10 2023-04-18 Science Applications International Corporation Thermal fuse
KR102893541B1 (ko) 2021-01-07 2025-12-02 삼성디스플레이 주식회사 발광 소자, 이의 제조방법 및 이를 포함하는 표시 장치
US11856708B2 (en) * 2021-03-22 2023-12-26 Carnegie Mellon University Stretchable 3D-printed circuit boards
US12152156B2 (en) 2021-03-24 2024-11-26 Science Applications International Corporation Self-sintering conductive inks
CN115181453A (zh) * 2022-06-24 2022-10-14 温州大学新材料与产业技术研究院 一种含镓的金属导电墨水及其制备方法和应用
US12257633B2 (en) * 2022-08-31 2025-03-25 Xerox Corporation Metal and fusible metal alloy particles and related methods
US12213250B2 (en) * 2022-08-31 2025-01-28 Ncr Voyix Corporation Conductive ink interconnected devices
CN117866484B (zh) * 2024-03-12 2024-06-04 成都先进金属材料产业技术研究院股份有限公司 一种液态金属油墨及其制备方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174244A (en) 1976-05-28 1979-11-13 Industrial Electronic Rubber Company Method of making a printing blanket
JP2000118164A (ja) 1998-10-14 2000-04-25 Kinyosha Co Ltd オフセット印刷用ブランケット及びその製造方法
IT1318961B1 (it) 2000-10-03 2003-09-19 Erminio Rossini S P A Ora Ross Manica perfezionata per cilindro sussidiario di una macchina da stampaindiretta o "offset".
JP3866591B2 (ja) * 2001-10-29 2007-01-10 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
US7234806B2 (en) 2002-06-20 2007-06-26 Xerox Corporation Phase change ink imaging component with fluorosilicone layer
US6923533B2 (en) 2002-12-09 2005-08-02 Xerox Corporation Phase change ink imaging component with nano-size filler
JP2007527102A (ja) * 2004-02-18 2007-09-20 バージニア テック インテレクチュアル プロパティーズ インコーポレーテッド 相互接続用のナノスケールの金属ペーストおよび使用方法
JP4431085B2 (ja) * 2004-06-24 2010-03-10 シャープ株式会社 導電性インキ組成物、反射部材、回路基板、電子装置
US8063315B2 (en) 2005-10-06 2011-11-22 Endicott Interconnect Technologies, Inc. Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
US8293370B2 (en) * 2006-08-04 2012-10-23 Panasonic Corporation Bonding material, bonded portion and circuit board
JP2008294160A (ja) * 2007-05-23 2008-12-04 Nippon Paint Co Ltd 導電性パターン用インク、導電性パターン形成方法及び導電性パターンを有する基板
US7878667B2 (en) * 2007-11-09 2011-02-01 Mario Rabinowitz Latching solar concentrator pivoted mirrors during off-power period
US7976733B2 (en) * 2007-11-30 2011-07-12 Xerox Corporation Air stable copper nanoparticle ink and applications therefor
US8062698B2 (en) * 2008-03-10 2011-11-22 Xerox Corporation Synthesis of conductive metal markings for chipless RFID applications
US7789935B2 (en) * 2008-05-23 2010-09-07 Xerox Corporation Photochemical synthesis of metallic nanoparticles for ink applications
US7749300B2 (en) * 2008-06-05 2010-07-06 Xerox Corporation Photochemical synthesis of bimetallic core-shell nanoparticles
EP2291471A1 (en) * 2008-06-12 2011-03-09 NanoMas Technologies, Inc. Conductive inks and pastes
US8361350B2 (en) 2008-12-10 2013-01-29 Xerox Corporation Silver nanoparticle ink composition
US8834965B2 (en) 2009-02-12 2014-09-16 Xerox Corporation Organoamine stabilized silver nanoparticles and process for producing same
DE102009003817A1 (de) 2009-04-23 2010-10-28 Contitech Elastomer-Beschichtungen Gmbh Mehrschichtiges Flächengebilde in Form eines Drucktuches oder einer Druckplatte für den Flexo-und Hochdruck mit einer Lasergravur
JP5246096B2 (ja) * 2009-08-10 2013-07-24 日立電線株式会社 複合金属微粒子材料、金属膜及び金属膜の製造方法、並びにプリント配線板及び電線ケーブル
TWI420540B (zh) * 2009-09-14 2013-12-21 Ind Tech Res Inst 藉由光能或熱能成形之導電材料、導電材料之製備方法以及導電組合物
GB2479412A (en) * 2010-04-09 2011-10-12 Henkel Corp Printable ink containing metal nanoparticles
US8158032B2 (en) 2010-08-20 2012-04-17 Xerox Corporation Silver nanoparticle ink composition for highly conductive features with enhanced mechanical properties
US20120103212A1 (en) 2010-10-29 2012-05-03 Palo Alto Research Center Incorporated Variable Data Lithography System
US8586871B2 (en) 2011-07-19 2013-11-19 The Charles Stark Draper Laboratory, Inc. Interconnect schemes, and materials and methods for producing the same
JP2013112807A (ja) * 2011-12-01 2013-06-10 Daiso Co Ltd 導電性インク組成物、及び導電性パターンの製造方法
US9573360B2 (en) 2013-09-09 2017-02-21 Xerox Corporation Thermally conductive aqueous transfix blanket
US20150240100A1 (en) 2014-02-24 2015-08-27 Xerox Corporation Silver nanoparticle inks with gelling agent for gravure and flexographic printing
US20150240102A1 (en) * 2014-02-24 2015-08-27 Xerox Corporation Low viscosity and high loading silver nanoparticles inks for ultrasonic aerosol (ua)
US20150240101A1 (en) 2014-02-24 2015-08-27 Xerox Corporation High silver content nanosilver ink for gravure and flexographic printing applications
US9494884B2 (en) 2014-03-28 2016-11-15 Xerox Corporation Imaging plate coating composite composed of fluoroelastomer and aminosilane crosslinkers
US9353290B2 (en) 2014-04-11 2016-05-31 Xerox Corporation Transfix surface member coating
US20160018489A1 (en) * 2014-05-28 2016-01-21 The Royal Institution For The Advancement Of Learning / Mcgill University Methods and systems relating to high resolution magnetic resonance imaging
US10161835B1 (en) * 2014-11-20 2018-12-25 National Technology & Engineering Solutions Of Sandia, Llc Microsampler and method of making the same
US9956760B2 (en) 2014-12-19 2018-05-01 Xerox Corporation Multilayer imaging blanket coating
US9573405B2 (en) 2015-02-17 2017-02-21 LCY Chemical Corp. Method and blanket for transferring a paste image from engraved plate to substrate
EP3939740A1 (en) 2015-04-28 2022-01-19 Ormet Circuits, Inc. Sintering pastes with high metal loading for semiconductor die attach applications
JP6266137B2 (ja) * 2015-07-09 2018-01-24 古河電気工業株式会社 金属微粒子含有組成物
US9950549B2 (en) 2016-05-27 2018-04-24 Xerox Corporation Imaging plate multi-layer blanket
US9744757B1 (en) 2016-08-18 2017-08-29 Xerox Corporation Methods for rejuvenating an imaging member of an ink-based digital printing system
US20180063967A1 (en) * 2016-08-26 2018-03-01 Tyco Electronics Corporation Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening Temperatures
US20180118967A1 (en) * 2016-10-31 2018-05-03 Xerox Corporation Metal Nanoparticle Ink Compositions For Printed Electronic Device Applications
US10575412B2 (en) * 2016-12-27 2020-02-25 Mitsuboshi Belting Ltd. Electroconductive paste, electronic substrate, and method for manufacturing said substrate
US20190322114A1 (en) 2018-04-23 2019-10-24 Xerox Corporation Multi-layer blanket
US12122178B2 (en) 2019-03-07 2024-10-22 Xerox Corporation Imaging blanket and variable data lithography system employing the imaging blanket
US11230135B2 (en) 2019-05-07 2022-01-25 Xerox Corporation Multi-layer imaging blanket
US20210016590A1 (en) 2019-07-18 2021-01-21 Xerox Corporation Imaging blanket and method of making imaging blanket
US11939478B2 (en) 2020-03-10 2024-03-26 Xerox Corporation Metallic inks composition for digital offset lithographic printing

Similar Documents

Publication Publication Date Title
JP2018137213A5 (cg-RX-API-DMAC7.html)
US20100245024A1 (en) Protective element
JP6281468B2 (ja) 半導体装置とその製造方法
CN107073656B (zh) 软钎焊材料、焊膏、成形焊料、钎焊接头以及软钎焊材料的管理方法
CN104822773B (zh) 导电材料及连接结构体
JP2016535169A5 (cg-RX-API-DMAC7.html)
JP6287759B2 (ja) 半導体装置とその製造方法
CN107921543A (zh) 高温烧结型导电性浆料用银粉末的制造方法
US9703335B2 (en) Information handling system chassis with anisotropic conductance
JP5932638B2 (ja) 導電性ペースト用銅粉及び導電性ペースト
JP2019512561A5 (cg-RX-API-DMAC7.html)
JP2017505977A (ja) 導電性ペースト及びそれを用いた半導体装置の製造方法
JP2011006740A (ja) 導電性ペースト用銅粉及び導電性ペースト
CN109047768A (zh) 一种用于3d打印的低熔点金属线材
JP4678654B2 (ja) 電子デバイス。
CN104959621A (zh) 一种金属颗粒的制备方法及其装置
US9851161B2 (en) Heat exchanger construction using low temperature sinter techniques
JP2020205213A (ja) ヒューズエレメント、ヒューズ素子及び保護素子
JP4790089B2 (ja) 導電性組成物及び電子デバイスの製造方法
JP2014044955A (ja) 保護素子及びバッテリーパック
JP6546384B2 (ja) 導電フィラー用粉末
WO2016052643A1 (ja) 導電フィラー用粉末
JP2011006739A (ja) 導電性ペースト用銅粉及び導電性ペースト
SE536911C2 (sv) Material för att åstadkomma ett elektriskt ledande kontaktskikt, ett kontaktelement med sådant skikt, metod för att åstadkomma kontaktelementet, samt användning av materialet
JP2015196877A (ja) AgCuBi系導電フィラー用粉末