JP2018125378A - ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法 - Google Patents

ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法 Download PDF

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Publication number
JP2018125378A
JP2018125378A JP2017015448A JP2017015448A JP2018125378A JP 2018125378 A JP2018125378 A JP 2018125378A JP 2017015448 A JP2017015448 A JP 2017015448A JP 2017015448 A JP2017015448 A JP 2017015448A JP 2018125378 A JP2018125378 A JP 2018125378A
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JP
Japan
Prior art keywords
film
resin
dry film
resin layer
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017015448A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018125378A5 (enExample
Inventor
貴幸 中条
Takayuki Nakajo
貴幸 中条
諭 興津
Satoshi Okitsu
諭 興津
良朋 青山
Yoshitomo Aoyama
良朋 青山
遠藤　新
Arata Endo
新 遠藤
友澤 韓
Wootack HAN
友澤 韓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2017015448A priority Critical patent/JP2018125378A/ja
Priority to KR1020197024921A priority patent/KR20190113852A/ko
Priority to CN201780076241.6A priority patent/CN110050514A/zh
Priority to PCT/JP2017/047140 priority patent/WO2018142827A1/ja
Priority to TW107101482A priority patent/TW201839040A/zh
Publication of JP2018125378A publication Critical patent/JP2018125378A/ja
Publication of JP2018125378A5 publication Critical patent/JP2018125378A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B32B7/028—Heat-shrinkability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2017015448A 2017-01-31 2017-01-31 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法 Pending JP2018125378A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017015448A JP2018125378A (ja) 2017-01-31 2017-01-31 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
KR1020197024921A KR20190113852A (ko) 2017-01-31 2017-12-27 드라이 필름, 경화물, 프린트 배선판, 및 경화물의 제조 방법
CN201780076241.6A CN110050514A (zh) 2017-01-31 2017-12-27 干膜、固化物、印刷电路板和固化物的制造方法
PCT/JP2017/047140 WO2018142827A1 (ja) 2017-01-31 2017-12-27 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
TW107101482A TW201839040A (zh) 2017-01-31 2018-01-16 乾膜、硬化物、印刷配線板、及硬化物之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017015448A JP2018125378A (ja) 2017-01-31 2017-01-31 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法

Publications (2)

Publication Number Publication Date
JP2018125378A true JP2018125378A (ja) 2018-08-09
JP2018125378A5 JP2018125378A5 (enExample) 2020-01-16

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ID=63040521

Family Applications (1)

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JP2017015448A Pending JP2018125378A (ja) 2017-01-31 2017-01-31 ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法

Country Status (5)

Country Link
JP (1) JP2018125378A (enExample)
KR (1) KR20190113852A (enExample)
CN (1) CN110050514A (enExample)
TW (1) TW201839040A (enExample)
WO (1) WO2018142827A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2018199797A (ja) * 2017-05-30 2018-12-20 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
KR20200094616A (ko) * 2019-01-30 2020-08-07 다이요 잉키 세이조 가부시키가이샤 드라이 필름, 경화물 및 전자 부품
JP2022161968A (ja) * 2018-10-11 2022-10-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200429A1 (ja) * 2020-03-31 2021-10-07 太陽インキ製造株式会社 構造体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252458A (ja) * 2001-02-26 2002-09-06 Mitsubishi Polyester Film Copp 多層プリント配線板製造用ポリエステルフィルム
JP2004122433A (ja) * 2002-09-30 2004-04-22 Nippon Zeon Co Ltd プリント基板製造用離型フィルム及びその製造方法
WO2008133293A1 (ja) * 2007-04-25 2008-11-06 Hitachi Chemical Company, Ltd. 接着シート
JP2014093355A (ja) * 2012-11-01 2014-05-19 Ajinomoto Co Inc プリント配線板の製造方法
JP2015010179A (ja) * 2013-06-28 2015-01-19 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP2016203379A (ja) * 2015-04-15 2016-12-08 東レ株式会社 接着剤積層フィルム、保護フィルム付接着剤積層フィルムおよび多層プリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016074849A (ja) * 2014-10-08 2016-05-12 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252458A (ja) * 2001-02-26 2002-09-06 Mitsubishi Polyester Film Copp 多層プリント配線板製造用ポリエステルフィルム
JP2004122433A (ja) * 2002-09-30 2004-04-22 Nippon Zeon Co Ltd プリント基板製造用離型フィルム及びその製造方法
WO2008133293A1 (ja) * 2007-04-25 2008-11-06 Hitachi Chemical Company, Ltd. 接着シート
JP2014093355A (ja) * 2012-11-01 2014-05-19 Ajinomoto Co Inc プリント配線板の製造方法
JP2015010179A (ja) * 2013-06-28 2015-01-19 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP2016203379A (ja) * 2015-04-15 2016-12-08 東レ株式会社 接着剤積層フィルム、保護フィルム付接着剤積層フィルムおよび多層プリント配線板

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7258453B2 (ja) 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2018199797A (ja) * 2017-05-30 2018-12-20 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7119290B2 (ja) 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2022121436A (ja) * 2017-05-30 2022-08-19 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7388482B2 (ja) 2017-05-30 2023-11-29 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2022161968A (ja) * 2018-10-11 2022-10-21 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7565982B2 (ja) 2018-10-11 2024-10-11 積水化学工業株式会社 樹脂材料及び多層プリント配線板
KR20200094616A (ko) * 2019-01-30 2020-08-07 다이요 잉키 세이조 가부시키가이샤 드라이 필름, 경화물 및 전자 부품
JP2020121481A (ja) * 2019-01-30 2020-08-13 太陽インキ製造株式会社 ドライフィルム、硬化物および電子部品
KR102313172B1 (ko) * 2019-01-30 2021-10-15 다이요 잉키 세이조 가부시키가이샤 드라이 필름, 경화물 및 전자 부품
JP7221064B2 (ja) 2019-01-30 2023-02-13 太陽インキ製造株式会社 ドライフィルム、硬化物および電子部品

Also Published As

Publication number Publication date
KR20190113852A (ko) 2019-10-08
TW201839040A (zh) 2018-11-01
CN110050514A (zh) 2019-07-23
WO2018142827A1 (ja) 2018-08-09

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