JP2018113410A - フレームユニット搬送システム - Google Patents
フレームユニット搬送システム Download PDFInfo
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- JP2018113410A JP2018113410A JP2017004421A JP2017004421A JP2018113410A JP 2018113410 A JP2018113410 A JP 2018113410A JP 2017004421 A JP2017004421 A JP 2017004421A JP 2017004421 A JP2017004421 A JP 2017004421A JP 2018113410 A JP2018113410 A JP 2018113410A
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- 230000032258 transport Effects 0.000 claims description 40
- 230000009191 jumping Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 44
- 238000000034 method Methods 0.000 description 17
- 230000007246 mechanism Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
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- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 230000010354 integration Effects 0.000 description 1
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- 238000001020 plasma etching Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
Description
5 バーコード
10,10A トレー
11 底部
11a 載置面
11b 外縁部
12 側壁
13 天板
14 天井部
15 搬出入口
16 突き当て部
17 開口部
18 突出部
19a 凹部
19b 凸部
20 コンベヤ
21 載置部
30,30A トレー支持部
31 載置面
32,32A 押し上げ部
33 ローラーユニット
40 トレー搬送部
41 フック
51 第1バーコードリーダ
52 第2バーコードリーダ
53 第3バーコードリーダ
60 搬出入機構
61 把持アーム
62 ガイドレール
101 第1加工装置
102 第2加工装置
103 第3加工装置
D デバイス
F 環状フレーム
F1 開口
FU フレームユニット
L 分割予定ライン
T 粘着シート
W ウエーハ
WS 表面
Claims (2)
- 環状フレームの開口に被加工物を粘着テープで支持したフレームユニットを収容して搬送するトレーと、該トレーを搬送するコンベヤと、該コンベヤと該コンベヤに隣接して設置され該トレーを支持するトレー支持部との間で該トレーを搬送するトレー搬送部と、を備えるフレームユニット搬送システムであって、
該トレーは、
搬送中に該フレームユニットが載置される載置面を有する底部と、
該底部から立設する側壁と、
該側壁に形成され該フレームユニットが出入りする搬出入口と、
該搬出入口の下側に設けられ該底部に載置された該フレームユニットの該搬出入口からの飛び出しを防止する突き当て部と、
該フレームユニットに対応して該底部の対象位置に形成された複数の開口部と、を有し、
該トレー支持部に設けられる押し上げ部が、
該開口部から該トレーに侵入し、該載置面に載置された該フレームユニットを上昇させて該突き当て部より高い位置に押し上げ、該搬出入口から出し入れされる位置に該フレームユニットを位置付けるフレームユニット搬送システム。 - 該トレーは、内部に収容された該フレームユニットを挟んで該底部と反対側に位置する天井部を備え、
該天井部は、上面に該トレーが積みあげられた際に該トレーの移動を規制する規制部を有することを特徴とする請求項1に記載のフレームユニット搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017004421A JP6813367B2 (ja) | 2017-01-13 | 2017-01-13 | フレームユニット搬送システム |
TW106142737A TWI730205B (zh) | 2017-01-13 | 2017-12-06 | 框架單元搬送系統 |
KR1020180001212A KR102290940B1 (ko) | 2017-01-13 | 2018-01-04 | 프레임 유닛 반송 시스템 |
US15/867,290 US10037907B1 (en) | 2017-01-13 | 2018-01-10 | Frame unit transfer system |
CN201810029275.6A CN108336007B (zh) | 2017-01-13 | 2018-01-11 | 框架单元搬送系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017004421A JP6813367B2 (ja) | 2017-01-13 | 2017-01-13 | フレームユニット搬送システム |
Publications (2)
Publication Number | Publication Date |
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JP2018113410A true JP2018113410A (ja) | 2018-07-19 |
JP6813367B2 JP6813367B2 (ja) | 2021-01-13 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2017004421A Active JP6813367B2 (ja) | 2017-01-13 | 2017-01-13 | フレームユニット搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10037907B1 (ja) |
JP (1) | JP6813367B2 (ja) |
KR (1) | KR102290940B1 (ja) |
CN (1) | CN108336007B (ja) |
TW (1) | TWI730205B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020053473A (ja) * | 2018-09-25 | 2020-04-02 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
JP2020092233A (ja) * | 2018-12-07 | 2020-06-11 | 株式会社ディスコ | 搬送システム |
JP2020161578A (ja) * | 2019-03-26 | 2020-10-01 | 株式会社ディスコ | 搬送システム |
JP2020178108A (ja) * | 2019-04-23 | 2020-10-29 | 株式会社ディスコ | 搬送システム |
JP2021086934A (ja) * | 2019-11-28 | 2021-06-03 | 株式会社ディスコ | 運搬システム、及び消耗品ボックス |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6688912B1 (ja) * | 2019-01-11 | 2020-04-28 | Dmg森精機株式会社 | パレット搬送システム、パレット搬送方法、および、パレット搬送プログラム |
JP7488442B2 (ja) * | 2019-09-26 | 2024-05-22 | シンフォニアテクノロジー株式会社 | 搬送システム |
JP7366499B2 (ja) * | 2019-11-20 | 2023-10-23 | 株式会社ディスコ | 搬送車 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09328188A (ja) * | 1996-06-12 | 1997-12-22 | Hitachi Ltd | 基板の収納ケース |
JP2002167038A (ja) * | 2000-11-30 | 2002-06-11 | Ishikawajima Harima Heavy Ind Co Ltd | 基板移載装置 |
JP2005026286A (ja) * | 2003-06-30 | 2005-01-27 | Nikon Corp | マスク収納装置、搬送装置及び露光装置 |
JP2016149437A (ja) * | 2015-02-12 | 2016-08-18 | 株式会社ディスコ | ウェーハ処理システム |
JP2016201421A (ja) * | 2015-04-08 | 2016-12-01 | 株式会社ディスコ | 被加工物の搬送トレー |
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US4744712A (en) * | 1986-05-06 | 1988-05-17 | Ron Mitchell | Apparatus and method for an improved wafer handling system for cantilever type diffusion tubes |
JPH0927543A (ja) | 1995-07-10 | 1997-01-28 | Disco Abrasive Syst Ltd | ウェーハカセット |
US7651583B2 (en) * | 2004-06-04 | 2010-01-26 | Tokyo Electron Limited | Processing system and method for treating a substrate |
TW201135845A (en) | 2009-10-09 | 2011-10-16 | Canon Anelva Corp | Acuum heating and cooling apparatus |
JP5589045B2 (ja) * | 2012-10-23 | 2014-09-10 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
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2017
- 2017-01-13 JP JP2017004421A patent/JP6813367B2/ja active Active
- 2017-12-06 TW TW106142737A patent/TWI730205B/zh active
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2018
- 2018-01-04 KR KR1020180001212A patent/KR102290940B1/ko active IP Right Grant
- 2018-01-10 US US15/867,290 patent/US10037907B1/en active Active
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TW201830565A (zh) | 2018-08-16 |
CN108336007A (zh) | 2018-07-27 |
TWI730205B (zh) | 2021-06-11 |
JP6813367B2 (ja) | 2021-01-13 |
US10037907B1 (en) | 2018-07-31 |
KR102290940B1 (ko) | 2021-08-17 |
US20180204752A1 (en) | 2018-07-19 |
CN108336007B (zh) | 2023-03-28 |
KR20180083793A (ko) | 2018-07-23 |
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