JP2018098327A - 積層セラミックコンデンサおよびその製造方法 - Google Patents

積層セラミックコンデンサおよびその製造方法 Download PDF

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Publication number
JP2018098327A
JP2018098327A JP2016240850A JP2016240850A JP2018098327A JP 2018098327 A JP2018098327 A JP 2018098327A JP 2016240850 A JP2016240850 A JP 2016240850A JP 2016240850 A JP2016240850 A JP 2016240850A JP 2018098327 A JP2018098327 A JP 2018098327A
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Japan
Prior art keywords
main component
layer
ceramic
thermal expansion
metal
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Pending
Application number
JP2016240850A
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English (en)
Japanese (ja)
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JP2018098327A5 (enExample
Inventor
和巳 金田
Kazumi Kaneda
和巳 金田
康之 猪又
Yasuyuki Inomata
康之 猪又
幹夫 田原
Mikio Tawara
幹夫 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2016240850A priority Critical patent/JP2018098327A/ja
Priority to US15/836,718 priority patent/US10475581B2/en
Publication of JP2018098327A publication Critical patent/JP2018098327A/ja
Publication of JP2018098327A5 publication Critical patent/JP2018098327A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1254—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
    • H01G4/1263—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates containing also zirconium oxides or zirconates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
    • B22F2007/047—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method non-pressurised baking of the paste or slurry containing metal powder

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
JP2016240850A 2016-12-13 2016-12-13 積層セラミックコンデンサおよびその製造方法 Pending JP2018098327A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016240850A JP2018098327A (ja) 2016-12-13 2016-12-13 積層セラミックコンデンサおよびその製造方法
US15/836,718 US10475581B2 (en) 2016-12-13 2017-12-08 Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016240850A JP2018098327A (ja) 2016-12-13 2016-12-13 積層セラミックコンデンサおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2018098327A true JP2018098327A (ja) 2018-06-21
JP2018098327A5 JP2018098327A5 (enExample) 2020-08-13

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Family Applications (1)

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JP2016240850A Pending JP2018098327A (ja) 2016-12-13 2016-12-13 積層セラミックコンデンサおよびその製造方法

Country Status (2)

Country Link
US (1) US10475581B2 (enExample)
JP (1) JP2018098327A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020195523A1 (enExample) * 2019-03-28 2020-10-01
JPWO2020195522A1 (enExample) * 2019-03-28 2020-10-01
DE102022134924A1 (de) 2022-01-12 2023-07-13 Taiyo Yuden Co., Ltd. Elektronische mehrschicht-keramikvorrichtung und verfahren zu deren herstellung
US12308178B2 (en) 2022-07-14 2025-05-20 Taiyo Yuden Co., Ltd. Multilayer ceramic electronic device and manufacturing method of the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7089402B2 (ja) * 2018-05-18 2022-06-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7145652B2 (ja) * 2018-06-01 2022-10-03 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7446705B2 (ja) * 2018-06-12 2024-03-11 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7151543B2 (ja) * 2019-02-22 2022-10-12 株式会社村田製作所 積層セラミックコンデンサ
KR102671969B1 (ko) * 2019-08-16 2024-06-05 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
US11600446B2 (en) * 2019-12-27 2023-03-07 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
US11508524B2 (en) * 2019-12-27 2022-11-22 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
KR20220060286A (ko) 2020-11-04 2022-05-11 삼성전기주식회사 적층형 커패시터
JP7765255B2 (ja) * 2021-11-15 2025-11-06 Tdk株式会社 電子部品

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230508A (ja) * 1990-02-06 1991-10-14 Toshiba Corp チップ型セラミック電子部品及びその製造方法
JPH0437009A (ja) * 1990-05-31 1992-02-07 Kyocera Corp 積層型コンデンサの端子電極形成用導電性ペースト
JPH05151820A (ja) * 1991-11-26 1993-06-18 Sumitomo Metal Mining Co Ltd 導体ペースト
JPH05174616A (ja) * 1991-12-20 1993-07-13 Sumitomo Metal Mining Co Ltd 導体ペースト
JP2005209404A (ja) * 2004-01-20 2005-08-04 Murata Mfg Co Ltd 積層セラミック電子部品の内部電極用導電ペースト及びそれを用いた積層セラミック電子部品の製造方法
JP2012028458A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd セラミック電子部品
JP2015063590A (ja) * 2013-09-25 2015-04-09 三井化学株式会社 導電ペースト組成物および焼成体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04260314A (ja) 1991-02-15 1992-09-16 Taiyo Yuden Co Ltd セラミック積層体
JP2999303B2 (ja) * 1991-08-29 2000-01-17 第一工業製薬株式会社 セラミックコンデンサー電極用導体ペースト
JP3039403B2 (ja) * 1996-12-06 2000-05-08 株式会社村田製作所 積層セラミックコンデンサ
JP3548775B2 (ja) * 1998-03-13 2004-07-28 株式会社村田製作所 導電ペースト及びセラミック電子部品
JP2005044903A (ja) 2003-07-24 2005-02-17 Murata Mfg Co Ltd 積層セラミック電子部品の外部電極形成方法
KR101361149B1 (ko) * 2012-07-17 2014-02-24 전남대학교산학협력단 가뭄 스트레스 저항성 관련 유전자 및 형질전환 식물체
KR20140102003A (ko) * 2013-02-13 2014-08-21 삼성전기주식회사 도전성 페이스트 조성물, 이를 이용한 적층 세라믹 커패시터 및 이를 이용한 적층 세라믹 커패시터의 제조 방법
KR102078015B1 (ko) * 2013-11-07 2020-04-07 삼성전기주식회사 커패시터 내장형 저온동시소성 세라믹 기판

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230508A (ja) * 1990-02-06 1991-10-14 Toshiba Corp チップ型セラミック電子部品及びその製造方法
JPH0437009A (ja) * 1990-05-31 1992-02-07 Kyocera Corp 積層型コンデンサの端子電極形成用導電性ペースト
JPH05151820A (ja) * 1991-11-26 1993-06-18 Sumitomo Metal Mining Co Ltd 導体ペースト
JPH05174616A (ja) * 1991-12-20 1993-07-13 Sumitomo Metal Mining Co Ltd 導体ペースト
JP2005209404A (ja) * 2004-01-20 2005-08-04 Murata Mfg Co Ltd 積層セラミック電子部品の内部電極用導電ペースト及びそれを用いた積層セラミック電子部品の製造方法
JP2012028458A (ja) * 2010-07-21 2012-02-09 Murata Mfg Co Ltd セラミック電子部品
JP2015063590A (ja) * 2013-09-25 2015-04-09 三井化学株式会社 導電ペースト組成物および焼成体

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7136334B2 (ja) 2019-03-28 2022-09-13 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
JPWO2020195522A1 (enExample) * 2019-03-28 2020-10-01
WO2020195523A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2020195522A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
CN113614866A (zh) * 2019-03-28 2021-11-05 株式会社村田制作所 芯片型陶瓷电子部件及其制造方法
CN113632187A (zh) * 2019-03-28 2021-11-09 株式会社村田制作所 芯片型陶瓷电子部件及其制造方法
JPWO2020195523A1 (enExample) * 2019-03-28 2020-10-01
JP7136333B2 (ja) 2019-03-28 2022-09-13 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
US12243689B2 (en) 2019-03-28 2025-03-04 Murata Manufacturing Co., Ltd. Chip ceramic electronic component and method for manufacturing the same
US12308170B2 (en) 2019-03-28 2025-05-20 Murata Manufacturing Co., Ltd. Method for manufacturing chip ceramic electronic component
DE102022134924A1 (de) 2022-01-12 2023-07-13 Taiyo Yuden Co., Ltd. Elektronische mehrschicht-keramikvorrichtung und verfahren zu deren herstellung
KR20230109095A (ko) 2022-01-12 2023-07-19 다이요 유덴 가부시키가이샤 적층 세라믹 전자 부품 및 그 제조 방법
US12308178B2 (en) 2022-07-14 2025-05-20 Taiyo Yuden Co., Ltd. Multilayer ceramic electronic device and manufacturing method of the same

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US10475581B2 (en) 2019-11-12
US20180162780A1 (en) 2018-06-14

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