JP2018041080A5 - - Google Patents

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JP2018041080A5
JP2018041080A5 JP2017169699A JP2017169699A JP2018041080A5 JP 2018041080 A5 JP2018041080 A5 JP 2018041080A5 JP 2017169699 A JP2017169699 A JP 2017169699A JP 2017169699 A JP2017169699 A JP 2017169699A JP 2018041080 A5 JP2018041080 A5 JP 2018041080A5
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substrate
internal stress
curvature
overlay
module
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JP2018041080A (ja
JP7164289B2 (ja
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JP2017169699A 2016-09-05 2017-09-04 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング Active JP7164289B2 (ja)

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JP2021155236A JP7216785B2 (ja) 2016-09-05 2021-09-24 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング

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US201662383549P 2016-09-05 2016-09-05
US62/383,549 2016-09-05

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JP2018041080A JP2018041080A (ja) 2018-03-15
JP2018041080A5 true JP2018041080A5 (enExample) 2020-10-22
JP7164289B2 JP7164289B2 (ja) 2022-11-01

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JP2021155236A Active JP7216785B2 (ja) 2016-09-05 2021-09-24 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング

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US (5) US10453692B2 (enExample)
JP (2) JP7164289B2 (enExample)
KR (1) KR102467979B1 (enExample)
CN (1) CN107799451B (enExample)
TW (3) TWI776817B (enExample)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112485971B (zh) * 2015-04-21 2024-12-03 科磊股份有限公司 用于倾斜装置设计的计量目标设计
JP7164289B2 (ja) 2016-09-05 2022-11-01 東京エレクトロン株式会社 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング
US10622233B2 (en) * 2016-09-05 2020-04-14 Tokyo Electron Limited Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor wafer
US10770327B2 (en) * 2017-07-28 2020-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for correcting non-ideal wafer topography
EP3540767A1 (en) * 2018-03-16 2019-09-18 ASML Netherlands B.V. Inspection system, lithographic apparatus, and inspection method
WO2019182913A1 (en) * 2018-03-20 2019-09-26 Tokyo Electron Limited Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
KR102812035B1 (ko) 2018-04-10 2025-05-22 램 리써치 코포레이션 레지스트 및 에칭 모델링
US11164768B2 (en) * 2018-04-27 2021-11-02 Kla Corporation Process-induced displacement characterization during semiconductor production
US10790232B2 (en) * 2018-09-15 2020-09-29 International Business Machines Corporation Controlling warp in semiconductor laminated substrates with conductive material layout and orientation
WO2020068254A1 (en) * 2018-09-25 2020-04-02 Applied Materials, Inc. Methods and apparatus to eliminate wafer bow for cvd and patterning hvm systems
KR102746093B1 (ko) * 2018-09-28 2024-12-23 램 리써치 코포레이션 비대칭 웨이퍼 보우 보상
US10896821B2 (en) * 2018-09-28 2021-01-19 Lam Research Corporation Asymmetric wafer bow compensation by physical vapor deposition
US10903070B2 (en) * 2018-09-28 2021-01-26 Lam Research Corporation Asymmetric wafer bow compensation by chemical vapor deposition
JP7129888B2 (ja) * 2018-11-07 2022-09-02 東京エレクトロン株式会社 成膜方法及び半導体製造装置
US10847408B2 (en) * 2019-01-31 2020-11-24 Sandisk Technologies Llc Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
US11114406B2 (en) 2019-01-31 2021-09-07 Sandisk Technologies Llc Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
US11036147B2 (en) * 2019-03-20 2021-06-15 Kla Corporation System and method for converting backside surface roughness to frontside overlay
JP2020174076A (ja) * 2019-04-08 2020-10-22 東京エレクトロン株式会社 成膜装置、成膜方法、および成膜システム
CN110246788B (zh) * 2019-06-28 2020-05-19 英特尔半导体(大连)有限公司 用于在晶圆沉积薄膜的设备
US11990334B2 (en) * 2019-07-19 2024-05-21 Tokyo Electron Limited Method for tuning stress transitions of films on a substrate
CN110517968B (zh) * 2019-08-19 2022-12-20 西安奕斯伟材料科技有限公司 一种翘曲度的控制方法及装置
CN110620057B (zh) * 2019-09-12 2021-12-07 中国科学院微电子研究所 一种三维器件的套刻误差补偿方法及系统
JP7336369B2 (ja) * 2019-11-25 2023-08-31 株式会社Screenホールディングス 基板支持装置、熱処理装置、基板支持方法、熱処理方法
US12272608B2 (en) 2020-01-03 2025-04-08 Lam Research Corporation Station-to-station control of backside bow compensation deposition
WO2021154641A1 (en) * 2020-01-30 2021-08-05 Lam Research Corporation Uv cure for local stress modulation
WO2021178310A1 (en) * 2020-03-05 2021-09-10 Lam Research Corporation Control of wafer bow during integrated circuit processing
DE102020106768B4 (de) 2020-03-12 2023-06-15 Institut Für Nanophotonik Göttingen E.V. Verfahren zur umformenden Bearbeitung eines Trägersubstrates für ein optisches Funktionsbauteil
JP2021149000A (ja) * 2020-03-19 2021-09-27 キオクシア株式会社 露光方法、露光装置、及び半導体装置の製造方法
US11569134B2 (en) * 2020-04-14 2023-01-31 International Business Machines Corporation Wafer backside engineering for wafer stress control
JP7384106B2 (ja) * 2020-04-17 2023-11-21 三菱電機株式会社 半導体装置の製造方法
KR20210131798A (ko) * 2020-04-24 2021-11-03 삼성전자주식회사 Euv 노광 장치, 및 그 노광 장치를 이용한 오버레이 보정 방법과 반도체 소자 제조방법
US12276922B2 (en) * 2020-05-22 2025-04-15 Tokyo Electron Limited Backside deposition tuning of stress to control wafer bow in semiconductor processing
US11473199B2 (en) 2020-06-10 2022-10-18 Sandisk Technologies Llc Method and apparatus for depositing a multi-sector film on backside of a semiconductor wafer
US11702750B2 (en) * 2020-06-10 2023-07-18 Sandisk Technologies Llc Method and apparatus for depositing a multi-sector film on backside of a semiconductor wafer
US11830778B2 (en) 2020-11-12 2023-11-28 International Business Machines Corporation Back-side wafer modification
US11721551B2 (en) * 2021-01-26 2023-08-08 Tokyo Electron Limited Localized stress regions for three-dimension chiplet formation
CN113068326B (zh) * 2021-03-29 2022-09-30 北京小米移动软件有限公司 一种焊接质量处理方法及装置、电路板
US20220336226A1 (en) * 2021-04-15 2022-10-20 Tokyo Electron Limited Method of correcting wafer bow using a direct write stress film
US12217974B2 (en) * 2021-04-26 2025-02-04 Applied Materials, Inc. Localized stress modulation by implant to back of wafer
EP4331006A4 (en) * 2021-04-27 2025-03-12 Applied Materials, Inc. Stress and overlay management for semiconductor processing
US12469725B2 (en) * 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
US12394618B2 (en) 2021-07-08 2025-08-19 Tokyo Electron Limited Method of adjusting wafer shape using multi-directional actuation films
US12001147B2 (en) * 2021-11-19 2024-06-04 Tokyo Electron Limited Precision multi-axis photolithography alignment correction using stressor film
KR20230093693A (ko) * 2021-12-20 2023-06-27 삼성전자주식회사 척킹력 제어 장치 및 방법
US20230251574A1 (en) * 2022-02-04 2023-08-10 Tokyo Electron Limited Method to enhance lithography pattern creation using semiconductor stress film tuning
US11994807B2 (en) 2022-05-03 2024-05-28 Tokyo Electron Limited In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones
WO2023219983A1 (en) * 2022-05-13 2023-11-16 Applied Materials, Inc. Dose mapping and substrate rotation for substrate curvature control with improved resolution
KR20240156433A (ko) * 2022-05-13 2024-10-29 어플라이드 머티어리얼스, 인코포레이티드 기판 곡률을 사용하여 면외 왜곡을 보상하기 위한 선량 맵핑
CN115513068B (zh) * 2022-09-22 2024-08-27 上海美维科技有限公司 板级rdl封装结构及其制备方法
US12224192B2 (en) 2022-11-10 2025-02-11 Applied Materials, Inc. Bowed substrate clamping method, apparatus, and system
WO2024215502A1 (en) * 2023-04-10 2024-10-17 Lam Research Corporation Bow compensation of semiconductor substrate using plasma jet
CN116228773B (zh) * 2023-05-09 2023-08-04 华芯程(杭州)科技有限公司 一种晶圆检测机台的量测数据校准方法、装置及设备
US20240427979A1 (en) * 2023-06-26 2024-12-26 Applied Materials, Inc. Substrate stress uniformity management based on overlay error measurements
US12435964B2 (en) 2023-11-16 2025-10-07 Tokyo Electron Limited Contactless capacitive measurement tool with improved throughput and accuracy
WO2025122404A1 (en) * 2023-12-04 2025-06-12 Applied Materials, Inc. Control of anisotropic deformation with directional stress modulation for device manufacturing
CN117410199B (zh) * 2023-12-15 2024-03-08 合肥晶合集成电路股份有限公司 一种套刻误差的测量方法
US20250308977A1 (en) * 2024-03-28 2025-10-02 Tokyo Electron Limited Eccentricity based wafer shape control
US20250314974A1 (en) * 2024-04-08 2025-10-09 Onto Innovation Inc. Front-to-back overlay (ftbo) standard

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851929A (en) * 1996-01-04 1998-12-22 Micron Technology, Inc. Controlling semiconductor structural warpage in rapid thermal processing by selective and dynamic control of a heating source
US5972570A (en) 1997-07-17 1999-10-26 International Business Machines Corporation Method of photolithographically defining three regions with one mask step and self aligned isolation structure formed thereby
JPH1197506A (ja) * 1997-09-22 1999-04-09 Dainippon Screen Mfg Co Ltd 基板処理装置
EP1089328A1 (en) 1999-09-29 2001-04-04 Infineon Technologies AG Method for manufacturing of a semiconductor device
JP2001344710A (ja) * 2000-06-05 2001-12-14 Tdk Corp ウエハの平面度制御方法及び薄膜磁気ヘッドの製造方法
EP2264524A3 (en) 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System High-resolution overlay alignement methods and systems for imprint lithography
US7139083B2 (en) 2000-09-20 2006-11-21 Kla-Tencor Technologies Corp. Methods and systems for determining a composition and a thickness of a specimen
US7169685B2 (en) * 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
KR100487562B1 (ko) * 2003-03-24 2005-05-03 삼성전자주식회사 웨이퍼 휘어짐을 억제할 수 있는 반도체 제조방법
EP1475667A1 (en) * 2003-05-09 2004-11-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2004356386A (ja) * 2003-05-29 2004-12-16 Trecenti Technologies Inc 半導体装置およびその製造方法
JP4232605B2 (ja) * 2003-10-30 2009-03-04 住友電気工業株式会社 窒化物半導体基板の製造方法と窒化物半導体基板
US7164200B2 (en) * 2004-02-27 2007-01-16 Agere Systems Inc. Techniques for reducing bowing in power transistor devices
US7184853B2 (en) * 2005-05-18 2007-02-27 Infineon Technologies Richmond, Lp Lithography method and system with correction of overlay offset errors caused by wafer processing
US7853920B2 (en) * 2005-06-03 2010-12-14 Asml Netherlands B.V. Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing
US7645546B2 (en) * 2006-02-06 2010-01-12 Macronix International Co., Ltd. Method for determining an overlay correlation set
US7719089B2 (en) * 2006-05-05 2010-05-18 Sony Corporation MOSFET having a channel region with enhanced flexure-induced stress
US7936445B2 (en) * 2006-06-19 2011-05-03 Asml Netherlands B.V. Altering pattern data based on measured optical element characteristics
KR100849366B1 (ko) * 2006-08-24 2008-07-31 세메스 주식회사 기판을 처리하는 장치 및 방법
KR101108709B1 (ko) * 2007-07-12 2012-01-30 삼성전자주식회사 반도체 장치 및 반도체 장치의 제조 방법
US8900715B2 (en) * 2008-06-11 2014-12-02 Infineon Technologies Ag Semiconductor device
US20100314725A1 (en) * 2009-06-12 2010-12-16 Qualcomm Incorporated Stress Balance Layer on Semiconductor Wafer Backside
KR20110024997A (ko) * 2009-09-03 2011-03-09 주식회사 하이닉스반도체 웨이퍼 휨 방지를 위한 반도체장치 제조 방법
JP2011119472A (ja) 2009-12-03 2011-06-16 Panasonic Corp 半導体製造装置
US8768665B2 (en) * 2010-01-08 2014-07-01 Kla-Tencor Technologies Corporation Site based quantification of substrate topography and its relation to lithography defocus and overlay
JP2011201759A (ja) 2010-03-05 2011-10-13 Namiki Precision Jewel Co Ltd 多層膜付き単結晶基板、多層膜付き単結晶基板の製造方法および素子製造方法
US20120074523A1 (en) * 2010-09-23 2012-03-29 Michael Goldstein Controlling microelectronic substrate bowing
JP5703896B2 (ja) * 2011-03-29 2015-04-22 凸版印刷株式会社 パターン形成方法およびパターン形成体
JP5642628B2 (ja) * 2011-05-27 2014-12-17 東京エレクトロン株式会社 基板反り除去装置、基板反り除去方法及び記憶媒体
US9354526B2 (en) * 2011-10-11 2016-05-31 Kla-Tencor Corporation Overlay and semiconductor process control using a wafer geometry metric
JP6149728B2 (ja) 2012-03-30 2017-06-21 新東工業株式会社 半導体素子用基板の反り矯正装置及び反り矯正方法
US20140045411A1 (en) * 2012-08-10 2014-02-13 Yevsey SENDERZON Methods of and apparatus for producing wafers
US9430593B2 (en) 2012-10-11 2016-08-30 Kla-Tencor Corporation System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
US9158209B2 (en) * 2012-10-19 2015-10-13 Taiwan Semiconductor Manufacturing Company, Ltd. Method of overlay prediction
US9601395B2 (en) * 2012-12-28 2017-03-21 Sunedison Semiconductor Limited (Uen201334164H) Methods for post-epitaxial warp prediction and control
US9059241B2 (en) * 2013-01-29 2015-06-16 International Business Machines Corporation 3D assembly for interposer bow
JP5924778B2 (ja) * 2013-06-24 2016-05-25 株式会社リガク 単結晶基板の反り測定方法及び測定装置
US9281251B2 (en) 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
US20150044783A1 (en) * 2013-08-12 2015-02-12 Micron Technology, Inc. Methods of alleviating adverse stress effects on a wafer, and methods of forming a semiconductor device
JP5934156B2 (ja) * 2013-08-20 2016-06-15 Towa株式会社 基板の搬送供給方法及び基板の搬送供給装置
US9397051B2 (en) * 2013-12-03 2016-07-19 Invensas Corporation Warpage reduction in structures with electrical circuitry
US9824894B2 (en) 2014-04-09 2017-11-21 Tokyo Electron Limited Method for correcting wafer bow from overlay
US9269607B2 (en) 2014-06-17 2016-02-23 Globalfoundries Inc. Wafer stress control with backside patterning
CN105448762A (zh) * 2014-08-28 2016-03-30 中国科学院微电子研究所 一种衬底翘曲度的调整方法
US10692839B2 (en) * 2015-06-26 2020-06-23 Intel Corporation GaN devices on engineered silicon substrates
JP6540430B2 (ja) 2015-09-28 2019-07-10 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US10784100B2 (en) * 2016-07-21 2020-09-22 Tokyo Electron Limited Back-side friction reduction of a substrate
JP7164289B2 (ja) 2016-09-05 2022-11-01 東京エレクトロン株式会社 半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング

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