CN107799451B - 半导体加工中控制曲度以控制叠对的位置特定的应力调节 - Google Patents

半导体加工中控制曲度以控制叠对的位置特定的应力调节 Download PDF

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CN107799451B
CN107799451B CN201710791991.3A CN201710791991A CN107799451B CN 107799451 B CN107799451 B CN 107799451B CN 201710791991 A CN201710791991 A CN 201710791991A CN 107799451 B CN107799451 B CN 107799451B
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substrate
internal stress
overlay
curvature
location
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CN107799451A (zh
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安东·德维利耶
丹尼尔·富尔福德
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Tokyo Electron Ltd
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    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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CN201710791991.3A 2016-09-05 2017-09-05 半导体加工中控制曲度以控制叠对的位置特定的应力调节 Active CN107799451B (zh)

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US (5) US10453692B2 (enExample)
JP (2) JP7164289B2 (enExample)
KR (1) KR102467979B1 (enExample)
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TW (3) TWI776817B (enExample)

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