KR102467979B1 - 반도체 프로세싱에서 오버레이를 제어하기 위해 보우를 제어하기 위한 응력의 위치-특정 튜닝 - Google Patents

반도체 프로세싱에서 오버레이를 제어하기 위해 보우를 제어하기 위한 응력의 위치-특정 튜닝 Download PDF

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KR102467979B1
KR102467979B1 KR1020170113329A KR20170113329A KR102467979B1 KR 102467979 B1 KR102467979 B1 KR 102467979B1 KR 1020170113329 A KR1020170113329 A KR 1020170113329A KR 20170113329 A KR20170113329 A KR 20170113329A KR 102467979 B1 KR102467979 B1 KR 102467979B1
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substrate
overlay
bow
internal stresses
correction pattern
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KR20180027382A (ko
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안톤 제이 데빌리어스
다니엘 풀포드
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도쿄엘렉트론가부시키가이샤
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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  • General Engineering & Computer Science (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Saccharide Compounds (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020170113329A 2016-09-05 2017-09-05 반도체 프로세싱에서 오버레이를 제어하기 위해 보우를 제어하기 위한 응력의 위치-특정 튜닝 Active KR102467979B1 (ko)

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US201662383549P 2016-09-05 2016-09-05
US62/383,549 2016-09-05

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KR20180027382A KR20180027382A (ko) 2018-03-14
KR102467979B1 true KR102467979B1 (ko) 2022-11-16

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US (5) US10453692B2 (enExample)
JP (2) JP7164289B2 (enExample)
KR (1) KR102467979B1 (enExample)
CN (1) CN107799451B (enExample)
TW (3) TWI776817B (enExample)

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