JP2018018979A - 発光装置の製造方法 - Google Patents
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Abstract
【解決手段】1つの素子基板5上に複数の発光素子3を備える素子集合体2を基板6に実装する工程と、素子集合体2と基板6との間に光反射部材10を設ける工程と、素子基板5を複数の発光素子3から除去する工程と、複数の発光素子3の間において、基板6と光反射部材10とを切断し、複数の発光装置1を分離する工程と、をこの順に有することを特徴とするので、素子集合体2が基板6に実装された状態で、発光素子3の上面は素子基板5で覆われており、素子集合体2と基板6との間に光反射部材10を設けるとき、光反射部材10が発光素子の上面に付着することが防止される。
【選択図】図2
Description
1つの素子基板上に複数の発光素子を備える素子集合体を基板に実装する工程と、前記素子集合体と前記基板との間に光反射部材を設ける工程と、前記素子基板を前記複数の発光素子から除去する工程と、前記複数の発光素子の間において、前記基板と前記光反射部材とを切断し、複数の発光装置を分離する工程と、をこの順に有することを特徴とする。
以下、各部材について詳説する。
基板は、絶縁性の母材と、正負一対の電極として機能する導電部材と、を備える。
1つの発光装置における母材の形状、大きさ、厚み等は特に限定されるものではなく、適宜設定することができる。母材の厚みは、用いる材料、載置する発光素子の種類及び構造等にもよるが、例えば、470μm程度以下が好ましく、370μm程度以下、320μm程度以下、270μm、200μm、150μm、100μm程度以下がより好ましい。また、強度等を考慮すると、20μm程度以上が好ましい。母材の曲げ強度は、基板全体の強度を確保するために、上述した基板の強度と同等、例えば、300MPa程度以上であることが好ましく、400MPa程度以上、600MPa程度以上がより好ましい。
一対の導電部材は、基板の少なくとも上面(発光素子が載置される側)に形成されていればよい。この場合、導電部材の縁部の少なくとも一部は、基板の上面の縁部の一部に一致するように形成することが好ましい。言い換えると、導電部材の端面の一部と基板の実装面の一部とが同一面となるように形成されていることが好ましい。これにより、発光装置を実装基板に実装する際に、実装基板と導電部材の端面とを接触(または限りなく近接)させることができるため、発光装置の実装性を向上させることができる。ここで同一面とは、段差がない又はほとんどないことを意味し、数μmから十数μm程度の凹凸は許容されることを意味する。本願明細書において、同一面については以下同じ意味である。
素子基板としては、後述する発光素子の半導体積層体の成長基板を用いることが生産性の観点から好ましい。このようなサファイア(Al2O3)、スピネル(MgAl2O4)のような絶縁性基板、窒化物系の半導体基板等が挙げられる。素子基板の厚みは、例えば、190μm程度以下が好ましく、180μm程度以下、150μm程度以下がより好ましい。
発光素子の大きさ、形状、発光波長は適宜選択することができる。複数の発光素子が実装される場合、行列など規則的又は周期的に配置されることが好ましい。また、複数の発光素子は、直列、並列、直並列又は並直列のいずれの形態で接続されてもよい。
一対の電極は、半導体積層体の同一面側に形成されている。これにより、基板の配線電極と、発光素子の電極とを、対向させて接合するフリップチップ実装が可能となる。
光反射部材は、1つの素子基板上に複数の発光素子を備えた素子集合体と、基板との間に設けられ、少なくとも発光素子の周囲に設けられる。その材料は特に限定されるものではなく、セラミック、樹脂、誘電体、パルプ、ガラス又はこれらの複合材料等が挙げられる。なかでも、任意の形状に容易に成形することができるという観点から、樹脂が好ましい。
素子集合体と基板との間に光反射部材を設けた後、素子基板を発光素子から除去した状態で、少なくとも発光素子の上面には、発光素子が発する光の波長を変換する波長変換層が形成される。
2…素子集合体
3…発光素子
4…電極
5…素子基板
6…基板
7…導電部材
10…光反射部材
11…外周面
13…凸部
14…上面
15…波長変換層;15a…第1波長変換層;15b…第2波長変換層
16…破線
17,18,19,20…縁部
Claims (7)
- 1つの素子基板上に複数の発光素子を備える素子集合体を基板上に実装する工程と、
前記素子集合体と前記基板との間に光反射部材を設ける工程と、
前記素子基板を前記複数の発光素子から除去する工程と、
前記複数の発光素子の間において、前記基板と前記光反射部材とを切断し、複数の発光装置を分離する工程と、
をこの順に有することを特徴とする発光装置の製造方法。 - 請求項1に記載の発光装置の製造方法であって、
前記素子基板は前記発光素子の成長基板であり、レーザリフトオフ法によって取り除かれることを特徴とする、発光装置の製造方法。 - 請求項1又は2に記載の発光装置の製造方法であって、
前記光反射部材は、光反射部材が含有された熱硬化性樹脂であることを特徴とする、発光装置の製造方法。 - 請求項1から3のいずれか一項に記載の発光装置の製造方法であって、
前記素子基板が取り除かれた後、前記発光素子の上面には、前記発光素子が発する光の波長を変換する波長変換層が形成されることを特徴とする、発光装置の製造方法。 - 請求項4に記載の発光装置の製造方法であって、
前記波長変換層はスプレーによって形成されることを特徴とする、発光装置の製造方法。 - 請求項4に記載の発光装置の製造方法であって、
前記波長変換層はポッティングで形成されることを特徴とする、発光装置の製造方法。 - 請求項1から6のいずれか一項に記載の発光装置の製造方法であって、前記発光装置は、2つ以上の発光素子を含むことを特徴とする、発光装置の製造方法。
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JP2016148663A JP6724634B2 (ja) | 2016-07-28 | 2016-07-28 | 発光装置の製造方法 |
US15/660,965 US10230032B2 (en) | 2016-07-28 | 2017-07-27 | Method of manufacturing light emitting device |
US16/264,481 US10825695B2 (en) | 2016-07-28 | 2019-01-31 | Method of manufacturing light emitting device |
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JP6724634B2 (ja) * | 2016-07-28 | 2020-07-15 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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