JP2018006482A - 電子部品装置、回路基板への電子部品装置の実装方法、および、回路基板への電子部品装置の実装構造 - Google Patents
電子部品装置、回路基板への電子部品装置の実装方法、および、回路基板への電子部品装置の実装構造 Download PDFInfo
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Abstract
【解決手段】 一方の主面に外部電極2が形成され、他方の主面に実装用電極5が形成された実装基板1と、一方の主面に端子電極8が形成され、端子電極8を実装用電極5に接合することにより、実装基板1上に実装された、少なくとも1個の基板部品6と、基板部品6が実装された実装基板1上に形成された封止樹脂層10と、を備え、封止樹脂層10に、厚みの大きな領域TAが設けられ、封止樹脂層10の天面に傾斜Sが形成されたものとした。
【選択図】 図1
Description
図1(A)〜(C)に、第1実施形態にかかる電子部品装置100を示す。ただし、図1(A)は、電子部品装置100の断面図である。図1(B)は、電子部品装置100の平面図であり、透視して内蔵された基板部品6を併せて示している。図1(C)も、電子部品装置100の平面図であり、透視して下側の主面に形成された外部電極2を併せて示している。なお、図1(A)の断面図は、図1(B)および(C)の一点鎖線X-X部分を示している。
図3(A)〜(C)に、第2実施形態にかかる電子部品装置200を示す。ただし、図3(A)は、電子部品装置200の断面図である。図3(B)は、電子部品装置200の平面図であり、透視して内蔵された基板部品6を併せて示している。図3(C)も、電子部品装置100の平面図であり、透視して下側の主面に形成された信号用外部電極2S、グランド用外部電極2Gを併せて示している。なお、図3(A)の断面図は、図3(B)および(C)の一点鎖線X-X部分を示している。
図4に、第3実施形態にかかる電子部品装置300を示す。ただし、図4は、電子部品装置300の断面図である。
図5(C)に、第4実施形態にかかる電子部品装置400を示す。ただし、図5(C)は、電子部品装置400の断面図である。
図6(C)に、第5実施形態にかかる電子部品装置500を示す。ただし、図6(C)は、電子部品装置500の断面図である。
図7(A)、(B)に、第6実施形態にかかる電子部品装置600を示す。ただし、図7(A)は、電子部品装置600の断面図である。図7(B)は、電子部品装置600の平面図であり、透視して下側の主面に形成された外部電極12、22を併せて示している。なお、図7(A)の断面図は、図7(B)の一点鎖線X-X部分を示している。
図8(A)、(B)に、第7実施形態にかかる電子部品装置700を示す。ただし、図8(A)は、電子部品装置700の断面図である。図8(B)は、電子部品装置700の平面図であり、透視して下側の主面に形成された信号用外部電極32S、グランド用外部電極32Gを併せて示している。なお、図7(A)の断面図は、図7(B)の一点鎖線X-X部分を示している。
2、12、22・・・外部電極
2S、32S・・・信号用外部電極
2G、32G・・・グランド用外部電極
3・・・導電ビア
4・・・層間導体
5・・・実装用電極
6・・・基板部品
6H・・・高さの大きい基板部品
6L・・・高さの小さい基板部品
7・・・機能部
8・・・端子電極
9・・・接合部材(バンプ)
10、20、30、40、50・・・封止樹脂層
100、200、300、400、500、600、700・・・電子部品装置(弾性表面波装置)
Claims (9)
- 一方の主面に外部電極が形成され、他方の主面に実装用電極が形成された実装基板と、
一方の主面に端子電極が形成され、前記端子電極を前記実装用電極に接合することにより、前記実装基板上に実装された、少なくとも1個の基板部品と、
前記基板部品が実装された前記実装基板上に形成された封止樹脂層と、を備えた電子部品装置であって、
前記封止樹脂層に、厚みの大きな領域が設けられ、前記封止樹脂層の天面に傾斜が形成された電子部品装置。 - 平面方向に透視した場合に、
前記実装基板に、前記外部電極の形成密度が低い領域が設けられ、
前記封止樹脂層の前記厚みの大きな領域と、前記実装基板の前記外部電極の前記形成密度の低い領域とが重なっている、請求項1に記載された電子部品装置。 - 前記外部電極が、信号用外部電極と、グランド用外部電極とに分類され、
平面方向に透視した場合に、
前記実装基板に、前記グランド用外部電極の形成密度が高い領域が設けられ、
前記封止樹脂層の前記厚みの大きな領域と、前記実装基板の前記グランド用外部電極の前記形成密度が高い領域とが重なっている、請求項1に記載された電子部品装置。 - 前記封止樹脂層の前記厚みの大きな領域が、当該領域に、前記基板部品が実装されたことによって設けられた、請求項1ないし3のいずれか1項に記載された電子部品装置。
- 前記封止樹脂層の前記厚みの大きな領域が、当該領域に、他の前記基板部品に比べて、厚みの大きな前記基板部品が実装されたことによって設けられた、請求項1ないし3のいずれか1項に記載された電子部品装置。
- 前記封止樹脂層の形成が金型を使用したモールドによっておこなわれ、前記封止樹脂層の前記厚みの大きな領域が、前記金型の間隔を当該領域において大きくすることによって設けられた、請求項1ないし3のいずれか1項に記載された電子部品装置。
- 前記封止樹脂層の天面に設けられた前記傾斜が、前記封止樹脂層の天面を切削することによって設けられた、請求項1ないし3のいずれか1項に記載された電子部品装置。
- 一方の主面に実装用電極が形成された回路基板を準備する工程と、
一方の主面に外部電極が形成された実装基板と、前記実装基板の他方の主面上に実装された少なくとも1個の基板部品と、前記基板部品が実装された前記実装基板上に形成された封止樹脂層と、を備え、前記封止樹脂層に厚みの大きな領域が設けられた電子部品装置を準備する工程と、
前記回路基板の前記実装電極上に、軟性を有する接合部材を設ける工程と、
前記接合部材上に前記外部電極を当接させて、前記電子部品装置を前記回路基板上に配置し、続いて、前記電子部品装置を前記回路基板方向に押圧することにより、前記外部電極を前記接合部材に押込み、前記封止樹脂層の前記厚みの大きな領域において、前記電子部品装置と前記回路基板との間隔が最も小さくなるようにして、前記電子部品装置を前記回路基板上に仮配置する工程と、
加熱して前記接合部材を溶融させ、さらに冷却して前記接合部材を固化させ、前記接合部材により、前記実装用電極と前記外部電極とを接合する工程と、を備えた、回路基板への電子部品装置の実装方法。 - 回路基板への電子部品装置の実装構造であって、
前記回路基板は、一方の主面に実装用電極が形成され、
前記電子部品装置は、一方の主面に外部電極が形成された実装基板と、前記実装基板の他方の主面上に実装された少なくとも1個の基板部品と、前記基板部品が実装された前記実装基板上に形成され封止樹脂層と、を備え、前記封止樹脂層に厚みの大きな領域が設けられ、
接合部材により、前記実装用電極と前記外部電極とが接合され、
実装後の前記電子部品装置は、前記封止樹脂層の厚みの大きな領域において、高さが最も大きい、回路基板への電子部品装置の実装構造。
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