JP2017535066A - はんだペーストフラックスを塗布するための方法および装置 - Google Patents

はんだペーストフラックスを塗布するための方法および装置 Download PDF

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Publication number
JP2017535066A
JP2017535066A JP2017513519A JP2017513519A JP2017535066A JP 2017535066 A JP2017535066 A JP 2017535066A JP 2017513519 A JP2017513519 A JP 2017513519A JP 2017513519 A JP2017513519 A JP 2017513519A JP 2017535066 A JP2017535066 A JP 2017535066A
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JP
Japan
Prior art keywords
deposit
flux
solder paste
substrate
head assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017513519A
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English (en)
Japanese (ja)
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JP2017535066A5 (enExample
Inventor
ベルグストローム、ヨハン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic AB
Original Assignee
Mycronic AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mycronic AB filed Critical Mycronic AB
Publication of JP2017535066A publication Critical patent/JP2017535066A/ja
Publication of JP2017535066A5 publication Critical patent/JP2017535066A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017513519A 2014-09-09 2015-09-07 はんだペーストフラックスを塗布するための方法および装置 Pending JP2017535066A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1400425 2014-09-09
SE1400425-3 2014-09-09
PCT/EP2015/001794 WO2016037694A1 (en) 2014-09-09 2015-09-07 Method and device for applying solder paste flux

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020159645A Division JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Publications (2)

Publication Number Publication Date
JP2017535066A true JP2017535066A (ja) 2017-11-24
JP2017535066A5 JP2017535066A5 (enExample) 2018-10-18

Family

ID=54608477

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017513519A Pending JP2017535066A (ja) 2014-09-09 2015-09-07 はんだペーストフラックスを塗布するための方法および装置
JP2020159645A Pending JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020159645A Pending JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Country Status (6)

Country Link
US (2) US11076490B2 (enExample)
EP (1) EP3192336A1 (enExample)
JP (2) JP2017535066A (enExample)
KR (1) KR20170092529A (enExample)
CN (1) CN107079587B (enExample)
WO (1) WO2016037694A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022529277A (ja) * 2019-04-19 2022-06-20 リンゼンス・ホールディング チップカード用の生体認証センサモジュール、およびこのようなモジュールを製造するための方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10326955B1 (en) * 2018-01-16 2019-06-18 Omnivision Technologies, Inc. Image sensor readout circuitry including analog-to-digital conversion with hybrid counter structure
KR102094014B1 (ko) * 2018-09-20 2020-03-27 주식회사 지엔테크 인쇄회로기판의 솔더링 장치 및 이를 이용한 공정방법
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
JP2022137835A (ja) * 2021-03-09 2022-09-22 Jnc株式会社 重合性化合物
CN118111377A (zh) * 2022-11-24 2024-05-31 中兴通讯股份有限公司 锡膏检测阈值调整方法、设备及存储介质

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390194A (ja) * 1986-10-02 1988-04-21 ソニー株式会社 部品マウント方法
JPH02310991A (ja) * 1989-05-26 1990-12-26 Furukawa Electric Co Ltd:The 電子部品表面実装方法
JPH0621636A (ja) * 1992-07-03 1994-01-28 Fujitsu Ltd 基板上への電子回路部品の半田付け方法
JPH10290066A (ja) * 1997-04-16 1998-10-27 Nec Ibaraki Ltd 部品搭載方法及び装置
JP2004502539A (ja) * 2000-07-11 2004-01-29 マイデータ　オートメーション　アクチボラグ 粘性媒体を基板に塗布する方法、装置および使用
JP2004502538A (ja) * 2000-07-11 2004-01-29 マイデータ　オートメーション　アクチボラグ 粘性媒体を備えた基板を用意する方法と装置及び塗布誤りの訂正のための噴射手段の使用
JP2005532906A (ja) * 2002-07-18 2005-11-04 マイデータ オートメーション アクチボラグ 噴射装置及び噴射装置の方法
WO2006030665A1 (ja) * 2004-09-13 2006-03-23 Matsushita Electric Industrial Co., Ltd. 半田ペーストおよびそれを用いた電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
JP4282552B2 (ja) * 2004-06-01 2009-06-24 パナソニック株式会社 部品実装済み基板製造方法及び製造装置
US20070090170A1 (en) 2005-10-20 2007-04-26 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having a plurality of solder connection sites thereon
US20080156895A1 (en) * 2006-12-29 2008-07-03 Mellody James P Flux overspray reduction apparatus, systems, and methods
US20130129913A1 (en) * 2011-11-21 2013-05-23 Shenzhen China Star Optoellectronics Technolohy Co., Ltd. Coating apparatus and coating method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390194A (ja) * 1986-10-02 1988-04-21 ソニー株式会社 部品マウント方法
JPH02310991A (ja) * 1989-05-26 1990-12-26 Furukawa Electric Co Ltd:The 電子部品表面実装方法
JPH0621636A (ja) * 1992-07-03 1994-01-28 Fujitsu Ltd 基板上への電子回路部品の半田付け方法
JPH10290066A (ja) * 1997-04-16 1998-10-27 Nec Ibaraki Ltd 部品搭載方法及び装置
JP2004502539A (ja) * 2000-07-11 2004-01-29 マイデータ　オートメーション　アクチボラグ 粘性媒体を基板に塗布する方法、装置および使用
JP2004502538A (ja) * 2000-07-11 2004-01-29 マイデータ　オートメーション　アクチボラグ 粘性媒体を備えた基板を用意する方法と装置及び塗布誤りの訂正のための噴射手段の使用
JP2005532906A (ja) * 2002-07-18 2005-11-04 マイデータ オートメーション アクチボラグ 噴射装置及び噴射装置の方法
WO2006030665A1 (ja) * 2004-09-13 2006-03-23 Matsushita Electric Industrial Co., Ltd. 半田ペーストおよびそれを用いた電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022529277A (ja) * 2019-04-19 2022-06-20 リンゼンス・ホールディング チップカード用の生体認証センサモジュール、およびこのようなモジュールを製造するための方法
JP7544743B2 (ja) 2019-04-19 2024-09-03 リンゼンス・ホールディング チップカード用の生体認証センサモジュール、およびこのようなモジュールを製造するための方法

Also Published As

Publication number Publication date
KR20170092529A (ko) 2017-08-11
CN107079587A (zh) 2017-08-18
US20170257951A1 (en) 2017-09-07
EP3192336A1 (en) 2017-07-19
CN107079587B (zh) 2020-07-14
WO2016037694A8 (en) 2017-03-16
US11076490B2 (en) 2021-07-27
US20210352808A1 (en) 2021-11-11
JP2021010013A (ja) 2021-01-28
WO2016037694A1 (en) 2016-03-17

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