JP2017535066A5 - - Google Patents

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Publication number
JP2017535066A5
JP2017535066A5 JP2017513519A JP2017513519A JP2017535066A5 JP 2017535066 A5 JP2017535066 A5 JP 2017535066A5 JP 2017513519 A JP2017513519 A JP 2017513519A JP 2017513519 A JP2017513519 A JP 2017513519A JP 2017535066 A5 JP2017535066 A5 JP 2017535066A5
Authority
JP
Japan
Prior art keywords
deposit
flux
solder paste
providing
additional flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017513519A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017535066A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2015/001794 external-priority patent/WO2016037694A1/en
Publication of JP2017535066A publication Critical patent/JP2017535066A/ja
Publication of JP2017535066A5 publication Critical patent/JP2017535066A5/ja
Pending legal-status Critical Current

Links

JP2017513519A 2014-09-09 2015-09-07 はんだペーストフラックスを塗布するための方法および装置 Pending JP2017535066A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1400425-3 2014-09-09
SE1400425 2014-09-09
PCT/EP2015/001794 WO2016037694A1 (en) 2014-09-09 2015-09-07 Method and device for applying solder paste flux

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020159645A Division JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Publications (2)

Publication Number Publication Date
JP2017535066A JP2017535066A (ja) 2017-11-24
JP2017535066A5 true JP2017535066A5 (enExample) 2018-10-18

Family

ID=54608477

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017513519A Pending JP2017535066A (ja) 2014-09-09 2015-09-07 はんだペーストフラックスを塗布するための方法および装置
JP2020159645A Pending JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020159645A Pending JP2021010013A (ja) 2014-09-09 2020-09-24 はんだペーストフラックスを塗布するための方法および装置

Country Status (6)

Country Link
US (2) US11076490B2 (enExample)
EP (1) EP3192336A1 (enExample)
JP (2) JP2017535066A (enExample)
KR (1) KR20170092529A (enExample)
CN (1) CN107079587B (enExample)
WO (1) WO2016037694A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10326955B1 (en) * 2018-01-16 2019-06-18 Omnivision Technologies, Inc. Image sensor readout circuitry including analog-to-digital conversion with hybrid counter structure
KR102094014B1 (ko) * 2018-09-20 2020-03-27 주식회사 지엔테크 인쇄회로기판의 솔더링 장치 및 이를 이용한 공정방법
KR102528016B1 (ko) 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
FR3095287B1 (fr) * 2019-04-19 2022-11-04 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
JP2022137835A (ja) * 2021-03-09 2022-09-22 Jnc株式会社 重合性化合物
CN118111377A (zh) * 2022-11-24 2024-05-31 中兴通讯股份有限公司 锡膏检测阈值调整方法、设备及存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390194A (ja) * 1986-10-02 1988-04-21 ソニー株式会社 部品マウント方法
JPH0671134B2 (ja) * 1989-05-26 1994-09-07 古河電気工業株式会社 電子部品表面実装方法
JPH0621636A (ja) * 1992-07-03 1994-01-28 Fujitsu Ltd 基板上への電子回路部品の半田付け方法
JPH10290066A (ja) * 1997-04-16 1998-10-27 Nec Ibaraki Ltd 部品搭載方法及び装置
SE513527C2 (sv) * 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
JP4282552B2 (ja) * 2004-06-01 2009-06-24 パナソニック株式会社 部品実装済み基板製造方法及び製造装置
JPWO2006030665A1 (ja) * 2004-09-13 2008-05-15 松下電器産業株式会社 半田ペーストおよびそれを用いた電子機器
US20070090170A1 (en) 2005-10-20 2007-04-26 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having a plurality of solder connection sites thereon
US20080156895A1 (en) 2006-12-29 2008-07-03 Mellody James P Flux overspray reduction apparatus, systems, and methods
US20130129913A1 (en) * 2011-11-21 2013-05-23 Shenzhen China Star Optoellectronics Technolohy Co., Ltd. Coating apparatus and coating method

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