KR20170092529A - 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스 - Google Patents

솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스 Download PDF

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Publication number
KR20170092529A
KR20170092529A KR1020177009414A KR20177009414A KR20170092529A KR 20170092529 A KR20170092529 A KR 20170092529A KR 1020177009414 A KR1020177009414 A KR 1020177009414A KR 20177009414 A KR20177009414 A KR 20177009414A KR 20170092529 A KR20170092529 A KR 20170092529A
Authority
KR
South Korea
Prior art keywords
flux
solder paste
deposition
applying
viscous medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177009414A
Other languages
English (en)
Korean (ko)
Inventor
요한 베르크스트룀
Original Assignee
마이크로닉 아베
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마이크로닉 아베 filed Critical 마이크로닉 아베
Publication of KR20170092529A publication Critical patent/KR20170092529A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/3484—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020177009414A 2014-09-09 2015-09-07 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스 Ceased KR20170092529A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1400425 2014-09-09
SE1400425-3 2014-09-09
PCT/EP2015/001794 WO2016037694A1 (en) 2014-09-09 2015-09-07 Method and device for applying solder paste flux

Publications (1)

Publication Number Publication Date
KR20170092529A true KR20170092529A (ko) 2017-08-11

Family

ID=54608477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177009414A Ceased KR20170092529A (ko) 2014-09-09 2015-09-07 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스

Country Status (6)

Country Link
US (2) US11076490B2 (enExample)
EP (1) EP3192336A1 (enExample)
JP (2) JP2017535066A (enExample)
KR (1) KR20170092529A (enExample)
CN (1) CN107079587B (enExample)
WO (1) WO2016037694A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102094014B1 (ko) * 2018-09-20 2020-03-27 주식회사 지엔테크 인쇄회로기판의 솔더링 장치 및 이를 이용한 공정방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10326955B1 (en) * 2018-01-16 2019-06-18 Omnivision Technologies, Inc. Image sensor readout circuitry including analog-to-digital conversion with hybrid counter structure
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
FR3095287B1 (fr) * 2019-04-19 2022-11-04 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
JP2022137835A (ja) * 2021-03-09 2022-09-22 Jnc株式会社 重合性化合物
CN118111377A (zh) * 2022-11-24 2024-05-31 中兴通讯股份有限公司 锡膏检测阈值调整方法、设备及存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6390194A (ja) * 1986-10-02 1988-04-21 ソニー株式会社 部品マウント方法
JPH0671134B2 (ja) * 1989-05-26 1994-09-07 古河電気工業株式会社 電子部品表面実装方法
JPH0621636A (ja) * 1992-07-03 1994-01-28 Fujitsu Ltd 基板上への電子回路部品の半田付け方法
JPH10290066A (ja) * 1997-04-16 1998-10-27 Nec Ibaraki Ltd 部品搭載方法及び装置
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
JP4282552B2 (ja) * 2004-06-01 2009-06-24 パナソニック株式会社 部品実装済み基板製造方法及び製造装置
US20070277909A1 (en) * 2004-09-13 2007-12-06 Norihito Tsukahara Solder Paste and Electronic Device Using Same
US20070090170A1 (en) 2005-10-20 2007-04-26 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having a plurality of solder connection sites thereon
US20080156895A1 (en) * 2006-12-29 2008-07-03 Mellody James P Flux overspray reduction apparatus, systems, and methods
US20130129913A1 (en) * 2011-11-21 2013-05-23 Shenzhen China Star Optoellectronics Technolohy Co., Ltd. Coating apparatus and coating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102094014B1 (ko) * 2018-09-20 2020-03-27 주식회사 지엔테크 인쇄회로기판의 솔더링 장치 및 이를 이용한 공정방법

Also Published As

Publication number Publication date
CN107079587A (zh) 2017-08-18
US20170257951A1 (en) 2017-09-07
EP3192336A1 (en) 2017-07-19
CN107079587B (zh) 2020-07-14
JP2017535066A (ja) 2017-11-24
WO2016037694A8 (en) 2017-03-16
US11076490B2 (en) 2021-07-27
US20210352808A1 (en) 2021-11-11
JP2021010013A (ja) 2021-01-28
WO2016037694A1 (en) 2016-03-17

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