JP2017532396A - 熱伝導性クレイ - Google Patents

熱伝導性クレイ Download PDF

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Publication number
JP2017532396A
JP2017532396A JP2017509725A JP2017509725A JP2017532396A JP 2017532396 A JP2017532396 A JP 2017532396A JP 2017509725 A JP2017509725 A JP 2017509725A JP 2017509725 A JP2017509725 A JP 2017509725A JP 2017532396 A JP2017532396 A JP 2017532396A
Authority
JP
Japan
Prior art keywords
thermally conductive
clay
conductive particles
particle size
micrometers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2017509725A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017532396A5 (enExample
Inventor
ペイ ティエン，
ペイ ティエン，
チャオ−ユアン ワン，
チャオ−ユアン ワン，
メイ−チン リャオ，
メイ−チン リャオ，
ウェイ−ユー チェン，
ウェイ−ユー チェン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2017532396A publication Critical patent/JP2017532396A/ja
Publication of JP2017532396A5 publication Critical patent/JP2017532396A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017509725A 2014-08-18 2015-08-17 熱伝導性クレイ Withdrawn JP2017532396A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/461,753 2014-08-18
US14/461,753 US9353245B2 (en) 2014-08-18 2014-08-18 Thermally conductive clay
PCT/US2015/045459 WO2016028661A1 (en) 2014-08-18 2015-08-17 Thermally conductive clay

Publications (2)

Publication Number Publication Date
JP2017532396A true JP2017532396A (ja) 2017-11-02
JP2017532396A5 JP2017532396A5 (enExample) 2018-09-06

Family

ID=54015218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017509725A Withdrawn JP2017532396A (ja) 2014-08-18 2015-08-17 熱伝導性クレイ

Country Status (6)

Country Link
US (1) US9353245B2 (enExample)
JP (1) JP2017532396A (enExample)
KR (1) KR20170044675A (enExample)
CN (1) CN106661332A (enExample)
TW (1) TW201623569A (enExample)
WO (1) WO2016028661A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022186046A1 (enExample) * 2021-03-02 2022-09-09

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102166470B1 (ko) * 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
US10741471B2 (en) 2018-01-19 2020-08-11 Laird Technologies, Inc. Highly compliant non-silicone putties and thermal interface materials including the same
KR102542423B1 (ko) * 2020-09-23 2023-06-12 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2732792B2 (ja) 1993-12-24 1998-03-30 富士高分子工業株式会社 Ｉｃパッケージの放熱装置
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
US6211276B1 (en) 1997-06-04 2001-04-03 The Furukawa Electric Co., Ltd. Heat-conductive rubber composition material and heat-conductive rubber sheet
US7445797B2 (en) * 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
JP4397650B2 (ja) 1999-09-01 2010-01-13 北川工業株式会社 熱伝導シート及びその製造方法
JP2002121332A (ja) 2000-10-12 2002-04-23 Shin Etsu Chem Co Ltd 熱軟化性放熱シート
JP2002121393A (ja) 2000-10-12 2002-04-23 Sekisui Chem Co Ltd 熱伝導性樹脂組成物及び熱伝導性シート
US20040116571A1 (en) 2002-12-12 2004-06-17 Yung-Ming Su Thermally conductive thermoplastic materials and method of making the same
US6924027B2 (en) 2003-03-31 2005-08-02 Intel Corporation Phase change thermal interface materials including exfoliated clay
US6887942B2 (en) 2003-04-11 2005-05-03 Chung Shan Instruments Co., Ltd. Low softening temperature thermal conductive adhesive composition
TWI251320B (en) 2003-07-04 2006-03-11 Fuji Polymer Ind Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same
US7408787B2 (en) 2003-07-30 2008-08-05 Intel Corporation Phase change thermal interface materials including polyester resin
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2006036931A (ja) 2004-07-27 2006-02-09 Three M Innovative Properties Co 熱伝導性組成物
JP2006054221A (ja) 2004-08-09 2006-02-23 Nitto Denko Corp 熱伝導シート
EP1797155B1 (en) 2004-08-23 2015-10-07 General Electric Company Thermally conductive composition and method for preparing the same
JP4764220B2 (ja) 2005-03-30 2011-08-31 地方独立行政法人 大阪市立工業研究所 熱伝導性シート
US20070031684A1 (en) 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
JP5265885B2 (ja) 2006-10-13 2013-08-14 出光興産株式会社 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
JP2008189815A (ja) 2007-02-05 2008-08-21 Nitto Denko Corp 分散剤、フィラー、熱伝導性樹脂組成物ならび熱伝導性シート
JP2008198917A (ja) 2007-02-15 2008-08-28 Polymatech Co Ltd 熱拡散シート及びその製造方法
JP2008235238A (ja) 2007-02-23 2008-10-02 National Institute Of Advanced Industrial & Technology 透明導電膜つき粘土膜
JP5140302B2 (ja) 2007-03-29 2013-02-06 ポリマテック株式会社 熱伝導性シート
JP2010524236A (ja) * 2007-04-02 2010-07-15 スリーエム イノベイティブ プロパティズ カンパニー 熱グリース物品及び方法
JP2009013390A (ja) 2007-06-04 2009-01-22 Teijin Ltd 熱伝導性シート
JP5228385B2 (ja) 2007-07-06 2013-07-03 ダイソー株式会社 放熱シート及びその製造方法
JP5538739B2 (ja) 2009-03-17 2014-07-02 信越化学工業株式会社 熱伝導性複合シート及びその製造方法
JP5466431B2 (ja) 2009-06-03 2014-04-09 旭化成イーマテリアルズ株式会社 熱伝導性成形体の製造方法、及び熱伝導性シート
JP2011054610A (ja) 2009-08-31 2011-03-17 Dainippon Printing Co Ltd 熱伝導性シート及びその製造方法
US9260645B2 (en) 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
JP5495429B2 (ja) 2010-04-13 2014-05-21 信越化学工業株式会社 放熱性複合シート
JP2011236365A (ja) 2010-05-12 2011-11-24 Jsr Corp 熱可塑性エラストマー組成物及び熱伝導性シート
TWI610407B (zh) 2010-06-17 2018-01-01 迪睿合股份有限公司 導熱片及其製造方法
JP2012012424A (ja) 2010-06-29 2012-01-19 Dainippon Printing Co Ltd 熱伝導性シート
US20130137322A1 (en) 2010-08-31 2013-05-30 Polymatech Co., Ltd. Thermally Conductive Sheet
JP2012054314A (ja) 2010-08-31 2012-03-15 Dainippon Printing Co Ltd 放熱シートおよびその製造方法
JP2012119674A (ja) 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
JP2012144626A (ja) 2011-01-11 2012-08-02 Daicel Corp 熱伝導性樹脂組成物及び熱伝導性シート
JP2012224765A (ja) 2011-04-20 2012-11-15 Jsr Corp 熱伝導性シート用組成物
JP2012233049A (ja) 2011-04-28 2012-11-29 Hitachi Maxell Ltd 機能性粘着シートの製造方法
JP2012238820A (ja) 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
WO2013047145A1 (ja) 2011-09-28 2013-04-04 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
JP5648617B2 (ja) 2011-10-24 2015-01-07 信越化学工業株式会社 熱伝導性接着剤組成物並びにそれを用いた接着用シート及び熱伝導性ダイシング・ダイアタッチフィルム
JP5449306B2 (ja) 2011-12-20 2014-03-19 日東電工株式会社 分散剤、熱伝導性樹脂組成物ならび熱伝導性シート

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022186046A1 (enExample) * 2021-03-02 2022-09-09
WO2022186046A1 (ja) * 2021-03-02 2022-09-09 Nok株式会社 軟質熱伝導部材
JP7492645B2 (ja) 2021-03-02 2024-05-29 Nok株式会社 軟質熱伝導部材

Also Published As

Publication number Publication date
US20160046791A1 (en) 2016-02-18
TW201623569A (zh) 2016-07-01
KR20170044675A (ko) 2017-04-25
CN106661332A (zh) 2017-05-10
US9353245B2 (en) 2016-05-31
WO2016028661A1 (en) 2016-02-25

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