KR20170044675A - 열전도성 클레이 - Google Patents

열전도성 클레이 Download PDF

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Publication number
KR20170044675A
KR20170044675A KR1020177007103A KR20177007103A KR20170044675A KR 20170044675 A KR20170044675 A KR 20170044675A KR 1020177007103 A KR1020177007103 A KR 1020177007103A KR 20177007103 A KR20177007103 A KR 20177007103A KR 20170044675 A KR20170044675 A KR 20170044675A
Authority
KR
South Korea
Prior art keywords
thermally conductive
clay
conductive particles
particle size
conductive clay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020177007103A
Other languages
English (en)
Korean (ko)
Inventor
페이 티엔
차오 위앤 왕
메이 친 랴오
웨이 위 천
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20170044675A publication Critical patent/KR20170044675A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020177007103A 2014-08-18 2015-08-17 열전도성 클레이 Withdrawn KR20170044675A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/461,753 2014-08-18
US14/461,753 US9353245B2 (en) 2014-08-18 2014-08-18 Thermally conductive clay
PCT/US2015/045459 WO2016028661A1 (en) 2014-08-18 2015-08-17 Thermally conductive clay

Publications (1)

Publication Number Publication Date
KR20170044675A true KR20170044675A (ko) 2017-04-25

Family

ID=54015218

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177007103A Withdrawn KR20170044675A (ko) 2014-08-18 2015-08-17 열전도성 클레이

Country Status (6)

Country Link
US (1) US9353245B2 (enExample)
JP (1) JP2017532396A (enExample)
KR (1) KR20170044675A (enExample)
CN (1) CN106661332A (enExample)
TW (1) TW201623569A (enExample)
WO (1) WO2016028661A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220040394A (ko) * 2020-09-23 2022-03-30 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체

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KR102166470B1 (ko) * 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
US10741471B2 (en) 2018-01-19 2020-08-11 Laird Technologies, Inc. Highly compliant non-silicone putties and thermal interface materials including the same
JP7492645B2 (ja) * 2021-03-02 2024-05-29 Nok株式会社 軟質熱伝導部材

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220040394A (ko) * 2020-09-23 2022-03-30 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체
US11955438B2 (en) 2020-09-23 2024-04-09 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers

Also Published As

Publication number Publication date
US20160046791A1 (en) 2016-02-18
JP2017532396A (ja) 2017-11-02
TW201623569A (zh) 2016-07-01
CN106661332A (zh) 2017-05-10
US9353245B2 (en) 2016-05-31
WO2016028661A1 (en) 2016-02-25

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20170315

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination