JP2017532396A5 - - Google Patents

Download PDF

Info

Publication number
JP2017532396A5
JP2017532396A5 JP2017509725A JP2017509725A JP2017532396A5 JP 2017532396 A5 JP2017532396 A5 JP 2017532396A5 JP 2017509725 A JP2017509725 A JP 2017509725A JP 2017509725 A JP2017509725 A JP 2017509725A JP 2017532396 A5 JP2017532396 A5 JP 2017532396A5
Authority
JP
Japan
Prior art keywords
thermally conductive
clay
conductive particles
micrometers
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2017509725A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017532396A (ja
Filing date
Publication date
Priority claimed from US14/461,753 external-priority patent/US9353245B2/en
Application filed filed Critical
Publication of JP2017532396A publication Critical patent/JP2017532396A/ja
Publication of JP2017532396A5 publication Critical patent/JP2017532396A5/ja
Withdrawn legal-status Critical Current

Links

JP2017509725A 2014-08-18 2015-08-17 熱伝導性クレイ Withdrawn JP2017532396A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/461,753 2014-08-18
US14/461,753 US9353245B2 (en) 2014-08-18 2014-08-18 Thermally conductive clay
PCT/US2015/045459 WO2016028661A1 (en) 2014-08-18 2015-08-17 Thermally conductive clay

Publications (2)

Publication Number Publication Date
JP2017532396A JP2017532396A (ja) 2017-11-02
JP2017532396A5 true JP2017532396A5 (enExample) 2018-09-06

Family

ID=54015218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017509725A Withdrawn JP2017532396A (ja) 2014-08-18 2015-08-17 熱伝導性クレイ

Country Status (6)

Country Link
US (1) US9353245B2 (enExample)
JP (1) JP2017532396A (enExample)
KR (1) KR20170044675A (enExample)
CN (1) CN106661332A (enExample)
TW (1) TW201623569A (enExample)
WO (1) WO2016028661A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102166470B1 (ko) * 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
US10741471B2 (en) 2018-01-19 2020-08-11 Laird Technologies, Inc. Highly compliant non-silicone putties and thermal interface materials including the same
KR102542423B1 (ko) * 2020-09-23 2023-06-12 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체
JP7492645B2 (ja) * 2021-03-02 2024-05-29 Nok株式会社 軟質熱伝導部材

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2732792B2 (ja) 1993-12-24 1998-03-30 富士高分子工業株式会社 Ｉｃパッケージの放熱装置
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
US6211276B1 (en) 1997-06-04 2001-04-03 The Furukawa Electric Co., Ltd. Heat-conductive rubber composition material and heat-conductive rubber sheet
US7445797B2 (en) * 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
JP4397650B2 (ja) 1999-09-01 2010-01-13 北川工業株式会社 熱伝導シート及びその製造方法
JP2002121332A (ja) 2000-10-12 2002-04-23 Shin Etsu Chem Co Ltd 熱軟化性放熱シート
JP2002121393A (ja) 2000-10-12 2002-04-23 Sekisui Chem Co Ltd 熱伝導性樹脂組成物及び熱伝導性シート
US20040116571A1 (en) 2002-12-12 2004-06-17 Yung-Ming Su Thermally conductive thermoplastic materials and method of making the same
US6924027B2 (en) 2003-03-31 2005-08-02 Intel Corporation Phase change thermal interface materials including exfoliated clay
US6887942B2 (en) 2003-04-11 2005-05-03 Chung Shan Instruments Co., Ltd. Low softening temperature thermal conductive adhesive composition
TWI251320B (en) 2003-07-04 2006-03-11 Fuji Polymer Ind Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same
US7408787B2 (en) 2003-07-30 2008-08-05 Intel Corporation Phase change thermal interface materials including polyester resin
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2006036931A (ja) 2004-07-27 2006-02-09 Three M Innovative Properties Co 熱伝導性組成物
JP2006054221A (ja) 2004-08-09 2006-02-23 Nitto Denko Corp 熱伝導シート
EP1797155B1 (en) 2004-08-23 2015-10-07 General Electric Company Thermally conductive composition and method for preparing the same
JP4764220B2 (ja) 2005-03-30 2011-08-31 地方独立行政法人 大阪市立工業研究所 熱伝導性シート
US20070031684A1 (en) 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
JP5265885B2 (ja) 2006-10-13 2013-08-14 出光興産株式会社 低硬度熱伝導性樹脂組成物及びそれを用いたシート状放熱部材
JP2008189815A (ja) 2007-02-05 2008-08-21 Nitto Denko Corp 分散剤、フィラー、熱伝導性樹脂組成物ならび熱伝導性シート
JP2008198917A (ja) 2007-02-15 2008-08-28 Polymatech Co Ltd 熱拡散シート及びその製造方法
JP2008235238A (ja) 2007-02-23 2008-10-02 National Institute Of Advanced Industrial & Technology 透明導電膜つき粘土膜
JP5140302B2 (ja) 2007-03-29 2013-02-06 ポリマテック株式会社 熱伝導性シート
JP2010524236A (ja) * 2007-04-02 2010-07-15 スリーエム イノベイティブ プロパティズ カンパニー 熱グリース物品及び方法
JP2009013390A (ja) 2007-06-04 2009-01-22 Teijin Ltd 熱伝導性シート
JP5228385B2 (ja) 2007-07-06 2013-07-03 ダイソー株式会社 放熱シート及びその製造方法
JP5538739B2 (ja) 2009-03-17 2014-07-02 信越化学工業株式会社 熱伝導性複合シート及びその製造方法
JP5466431B2 (ja) 2009-06-03 2014-04-09 旭化成イーマテリアルズ株式会社 熱伝導性成形体の製造方法、及び熱伝導性シート
JP2011054610A (ja) 2009-08-31 2011-03-17 Dainippon Printing Co Ltd 熱伝導性シート及びその製造方法
US9260645B2 (en) 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
JP5495429B2 (ja) 2010-04-13 2014-05-21 信越化学工業株式会社 放熱性複合シート
JP2011236365A (ja) 2010-05-12 2011-11-24 Jsr Corp 熱可塑性エラストマー組成物及び熱伝導性シート
TWI610407B (zh) 2010-06-17 2018-01-01 迪睿合股份有限公司 導熱片及其製造方法
JP2012012424A (ja) 2010-06-29 2012-01-19 Dainippon Printing Co Ltd 熱伝導性シート
US20130137322A1 (en) 2010-08-31 2013-05-30 Polymatech Co., Ltd. Thermally Conductive Sheet
JP2012054314A (ja) 2010-08-31 2012-03-15 Dainippon Printing Co Ltd 放熱シートおよびその製造方法
JP2012119674A (ja) 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
JP2012144626A (ja) 2011-01-11 2012-08-02 Daicel Corp 熱伝導性樹脂組成物及び熱伝導性シート
JP2012224765A (ja) 2011-04-20 2012-11-15 Jsr Corp 熱伝導性シート用組成物
JP2012233049A (ja) 2011-04-28 2012-11-29 Hitachi Maxell Ltd 機能性粘着シートの製造方法
JP2012238820A (ja) 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
WO2013047145A1 (ja) 2011-09-28 2013-04-04 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
JP5648617B2 (ja) 2011-10-24 2015-01-07 信越化学工業株式会社 熱伝導性接着剤組成物並びにそれを用いた接着用シート及び熱伝導性ダイシング・ダイアタッチフィルム
JP5449306B2 (ja) 2011-12-20 2014-03-19 日東電工株式会社 分散剤、熱伝導性樹脂組成物ならび熱伝導性シート

Similar Documents

Publication Publication Date Title
JP2015164123A5 (enExample)
CN106663808A8 (zh) 碳材料、碳材料的制造方法、以及使用了碳材料的非水系二次电池
MY184948A (en) Copper paste for joining, method for producing joined body, and method for producing semiconductor device
JP2015127808A5 (enExample)
JP2017532396A5 (enExample)
TW201612462A (en) Heat-sink for high bay LED device, high bay LED device and methods of use thereof
EP2779229A3 (en) Advanced cooling for power module switches
MY191292A (en) Sinterable feedstock for use in 3d printing devices
GB2533504A (en) Discovery and sharing of photos between devices
PE20150447A1 (es) Composicion de lechada de cal de gran finura
WO2015062883A3 (de) Verfahren zur herstellung wasserabsorbierender polymerpartikel durch suspensionspolymerisation
TWD184088S (zh) 電子裝置
JP2017528591A5 (enExample)
EP2959613A4 (en) DETECTION PROTOCOL FOR NETWORK-BASED MULTI-CELL DEVICE FOR D2D COMMUNICATIONS
MY179013A (en) Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste
TW201613457A (en) Electronic device and heat dissipating casing thereof
EP3050110A4 (en) Forming iii-v device structures on (111) planes of silicon fins
MY169154A (en) Tobacco material, tobacco product to which tobacco material is added, and method for producing tobacco material
EP2975640A3 (en) Electronic device assembly
CL2017000925A1 (es) Emulsiones y productos de polímero de etilvinilacetato/acrílico y métodos relacionados con estos.
JP2015512855A5 (enExample)
JP2017116570A5 (enExample)
JP2015045861A5 (enExample)
EP2891808A3 (en) Systems and methods for coupling a semiconductor device of an automation device to a heat sink
EA201501067A1 (ru) Классификатор