JP2017531162A5 - - Google Patents

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Publication number
JP2017531162A5
JP2017531162A5 JP2017503491A JP2017503491A JP2017531162A5 JP 2017531162 A5 JP2017531162 A5 JP 2017531162A5 JP 2017503491 A JP2017503491 A JP 2017503491A JP 2017503491 A JP2017503491 A JP 2017503491A JP 2017531162 A5 JP2017531162 A5 JP 2017531162A5
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JP
Japan
Prior art keywords
illumination
path
lens
sensor
light
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JP2017503491A
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Japanese (ja)
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JP6807829B2 (ja
JP2017531162A (ja
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Priority claimed from US14/804,296 external-priority patent/US9726615B2/en
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JP2017503491A 2014-07-22 2015-07-21 暗視野および位相コントラストの同時検査のためのシステムおよび方法 Active JP6807829B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462027393P 2014-07-22 2014-07-22
US62/027,393 2014-07-22
US14/804,296 2015-07-20
US14/804,296 US9726615B2 (en) 2014-07-22 2015-07-20 System and method for simultaneous dark field and phase contrast inspection
PCT/US2015/041409 WO2016014590A1 (en) 2014-07-22 2015-07-21 System and method for simultaneous dark field and phase contrast inspection

Publications (3)

Publication Number Publication Date
JP2017531162A JP2017531162A (ja) 2017-10-19
JP2017531162A5 true JP2017531162A5 (enExample) 2018-08-30
JP6807829B2 JP6807829B2 (ja) 2021-01-06

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ID=55163659

Family Applications (1)

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JP2017503491A Active JP6807829B2 (ja) 2014-07-22 2015-07-21 暗視野および位相コントラストの同時検査のためのシステムおよび方法

Country Status (8)

Country Link
US (1) US9726615B2 (enExample)
JP (1) JP6807829B2 (enExample)
KR (1) KR102241899B1 (enExample)
CN (1) CN106575631B (enExample)
DE (1) DE112015003394B4 (enExample)
SG (1) SG11201610820YA (enExample)
TW (1) TWI639822B (enExample)
WO (1) WO2016014590A1 (enExample)

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US9726615B2 (en) 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection
TWI606101B (zh) 2016-12-28 2017-11-21 財團法人工業技術研究院 塗佈組合物及其製備方法
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
CN108022849B (zh) * 2017-11-30 2020-06-16 上海华力微电子有限公司 一种亮场缺陷检测设备自动优化光强条件的方法及系统
US10845187B2 (en) * 2018-03-02 2020-11-24 Drexel University Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns
US11067389B2 (en) * 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
US10732130B2 (en) * 2018-06-19 2020-08-04 Kla-Tencor Corporation Embedded particle depth binning based on multiple scattering signals
US11017520B2 (en) * 2018-09-04 2021-05-25 Kla Corporation Multi-wavelength interferometry for defect classification
US10705026B2 (en) * 2018-10-26 2020-07-07 Kla Corporation Scanning differential interference contrast in an imaging system design
US10948423B2 (en) * 2019-02-17 2021-03-16 Kla Corporation Sensitive particle detection with spatially-varying polarization rotator and polarizer
JP7511013B2 (ja) * 2020-02-12 2024-07-04 深▲セン▼華大智造科技股▲ふん▼有限公司 光学結像系及びそれを適用した生化物質検出系
US20240280483A1 (en) * 2021-07-14 2024-08-22 Hitachi High-Tech Corporation Defect inspection device

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JPS5961142A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 欠陥検出装置
US5798829A (en) 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
US6999183B2 (en) 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US20030215791A1 (en) 2002-05-20 2003-11-20 Applied Spectral Imaging Ltd. Method of and system for multiplexed analysis by spectral imaging
JP3878107B2 (ja) * 2002-11-06 2007-02-07 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
US7957066B2 (en) * 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US20050254065A1 (en) * 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
WO2007016682A2 (en) * 2005-08-02 2007-02-08 Kla-Tencor Technologies Corporation Systems configured to generate output corresponding to defects on a specimen
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
WO2008048612A2 (en) 2006-10-17 2008-04-24 Hnuphotonics Miniature microscope camera
US7728969B2 (en) 2006-12-05 2010-06-01 Kla-Tencor Technologies Corp. Methods and systems for identifying defect types on a wafer
JP2008151865A (ja) 2006-12-14 2008-07-03 Olympus Corp 顕微鏡システム
DE102007047935A1 (de) 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
JP5104346B2 (ja) * 2008-01-29 2012-12-19 株式会社ニコン 表面欠陥検査方法及びその装置
US20120225475A1 (en) 2010-11-16 2012-09-06 1087 Systems, Inc. Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells
US10048480B2 (en) 2011-01-07 2018-08-14 Zeta Instruments, Inc. 3D microscope including insertable components to provide multiple imaging and measurement capabilities
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
EP2737303B1 (en) * 2011-07-28 2017-06-28 Paul Scherrer Institut Method for image fusion based on principal component analysis
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WO2013134068A1 (en) 2012-03-07 2013-09-12 Kla-Tencor Corporation Wafer and reticle inspection systems and method for selecting illumination pupil configurations
US9053390B2 (en) 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation
JP6124774B2 (ja) * 2013-03-22 2017-05-10 オリンパス株式会社 位相分布計測方法、及び、位相分布計測装置
US9726615B2 (en) 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection

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