TWI639822B - 用於同步暗場及相位對比檢測之系統及方法 - Google Patents
用於同步暗場及相位對比檢測之系統及方法 Download PDFInfo
- Publication number
- TWI639822B TWI639822B TW104123748A TW104123748A TWI639822B TW I639822 B TWI639822 B TW I639822B TW 104123748 A TW104123748 A TW 104123748A TW 104123748 A TW104123748 A TW 104123748A TW I639822 B TWI639822 B TW I639822B
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- TW
- Taiwan
- Prior art keywords
- signal
- illumination
- sample
- sensor
- path
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- 238000005286 illumination Methods 0.000 claims abstract description 126
- 230000003287 optical effect Effects 0.000 claims abstract description 71
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 230000001360 synchronised effect Effects 0.000 claims abstract description 14
- 210000001747 pupil Anatomy 0.000 claims description 66
- 238000000926 separation method Methods 0.000 claims description 8
- 230000004927 fusion Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000000523 sample Substances 0.000 claims 18
- 239000012472 biological sample Substances 0.000 claims 3
- 230000007547 defect Effects 0.000 description 23
- 238000012545 processing Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
Landscapes
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Microscoopes, Condenser (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462027393P | 2014-07-22 | 2014-07-22 | |
| US62/027,393 | 2014-07-22 | ||
| US14/804,296 | 2015-07-20 | ||
| US14/804,296 US9726615B2 (en) | 2014-07-22 | 2015-07-20 | System and method for simultaneous dark field and phase contrast inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201617603A TW201617603A (zh) | 2016-05-16 |
| TWI639822B true TWI639822B (zh) | 2018-11-01 |
Family
ID=55163659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104123748A TWI639822B (zh) | 2014-07-22 | 2015-07-22 | 用於同步暗場及相位對比檢測之系統及方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9726615B2 (enExample) |
| JP (1) | JP6807829B2 (enExample) |
| KR (1) | KR102241899B1 (enExample) |
| CN (1) | CN106575631B (enExample) |
| DE (1) | DE112015003394B4 (enExample) |
| SG (1) | SG11201610820YA (enExample) |
| TW (1) | TWI639822B (enExample) |
| WO (1) | WO2016014590A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
| TWI606101B (zh) | 2016-12-28 | 2017-11-21 | 財團法人工業技術研究院 | 塗佈組合物及其製備方法 |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| CN108022849B (zh) * | 2017-11-30 | 2020-06-16 | 上海华力微电子有限公司 | 一种亮场缺陷检测设备自动优化光强条件的方法及系统 |
| US10845187B2 (en) * | 2018-03-02 | 2020-11-24 | Drexel University | Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns |
| US11067389B2 (en) * | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| US10705026B2 (en) * | 2018-10-26 | 2020-07-07 | Kla Corporation | Scanning differential interference contrast in an imaging system design |
| US10948423B2 (en) * | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
| JP7511013B2 (ja) * | 2020-02-12 | 2024-07-04 | 深▲セン▼華大智造科技股▲ふん▼有限公司 | 光学結像系及びそれを適用した生化物質検出系 |
| US20240280483A1 (en) * | 2021-07-14 | 2024-08-22 | Hitachi High-Tech Corporation | Defect inspection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050254065A1 (en) * | 2004-05-12 | 2005-11-17 | Stokowski Stanley E | Method and apparatus for detecting surface characteristics on a mask blank |
| US20090059215A1 (en) * | 2007-08-31 | 2009-03-05 | Courosh Mehanian | Systems and Method for Simultaneously Inspecting a Specimen with Two Distinct Channels |
| US20090180176A1 (en) * | 2003-02-21 | 2009-07-16 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US20110181891A1 (en) * | 2005-08-02 | 2011-07-28 | Kla-Tencor Technologies Corporation | Systems Configured to Generate Output Corresponding to Defects on a Specimen |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961142A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | 欠陥検出装置 |
| US5798829A (en) | 1996-03-05 | 1998-08-25 | Kla-Tencor Corporation | Single laser bright field and dark field system for detecting anomalies of a sample |
| US6999183B2 (en) | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
| US20030215791A1 (en) | 2002-05-20 | 2003-11-20 | Applied Spectral Imaging Ltd. | Method of and system for multiplexed analysis by spectral imaging |
| JP3878107B2 (ja) * | 2002-11-06 | 2007-02-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| WO2008048612A2 (en) | 2006-10-17 | 2008-04-24 | Hnuphotonics | Miniature microscope camera |
| US7728969B2 (en) | 2006-12-05 | 2010-06-01 | Kla-Tencor Technologies Corp. | Methods and systems for identifying defect types on a wafer |
| JP2008151865A (ja) | 2006-12-14 | 2008-07-03 | Olympus Corp | 顕微鏡システム |
| DE102007047935A1 (de) | 2007-03-19 | 2008-09-25 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer |
| JP5104346B2 (ja) * | 2008-01-29 | 2012-12-19 | 株式会社ニコン | 表面欠陥検査方法及びその装置 |
| US20120225475A1 (en) | 2010-11-16 | 2012-09-06 | 1087 Systems, Inc. | Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells |
| US10048480B2 (en) | 2011-01-07 | 2018-08-14 | Zeta Instruments, Inc. | 3D microscope including insertable components to provide multiple imaging and measurement capabilities |
| US9279774B2 (en) | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| EP2737303B1 (en) * | 2011-07-28 | 2017-06-28 | Paul Scherrer Institut | Method for image fusion based on principal component analysis |
| US8755044B2 (en) | 2011-08-15 | 2014-06-17 | Kla-Tencor Corporation | Large particle detection for multi-spot surface scanning inspection systems |
| WO2013134068A1 (en) | 2012-03-07 | 2013-09-12 | Kla-Tencor Corporation | Wafer and reticle inspection systems and method for selecting illumination pupil configurations |
| US9053390B2 (en) | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
| JP6124774B2 (ja) * | 2013-03-22 | 2017-05-10 | オリンパス株式会社 | 位相分布計測方法、及び、位相分布計測装置 |
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
-
2015
- 2015-07-20 US US14/804,296 patent/US9726615B2/en active Active
- 2015-07-21 WO PCT/US2015/041409 patent/WO2016014590A1/en not_active Ceased
- 2015-07-21 KR KR1020177004868A patent/KR102241899B1/ko active Active
- 2015-07-21 SG SG11201610820YA patent/SG11201610820YA/en unknown
- 2015-07-21 JP JP2017503491A patent/JP6807829B2/ja active Active
- 2015-07-21 CN CN201580038195.1A patent/CN106575631B/zh active Active
- 2015-07-21 DE DE112015003394.7T patent/DE112015003394B4/de active Active
- 2015-07-22 TW TW104123748A patent/TWI639822B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090180176A1 (en) * | 2003-02-21 | 2009-07-16 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US20050254065A1 (en) * | 2004-05-12 | 2005-11-17 | Stokowski Stanley E | Method and apparatus for detecting surface characteristics on a mask blank |
| US20110181891A1 (en) * | 2005-08-02 | 2011-07-28 | Kla-Tencor Technologies Corporation | Systems Configured to Generate Output Corresponding to Defects on a Specimen |
| US20090059215A1 (en) * | 2007-08-31 | 2009-03-05 | Courosh Mehanian | Systems and Method for Simultaneously Inspecting a Specimen with Two Distinct Channels |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112015003394B4 (de) | 2023-04-27 |
| KR102241899B1 (ko) | 2021-04-16 |
| DE112015003394T5 (de) | 2017-03-30 |
| US9726615B2 (en) | 2017-08-08 |
| KR20170033884A (ko) | 2017-03-27 |
| SG11201610820YA (en) | 2017-02-27 |
| CN106575631B (zh) | 2019-02-01 |
| TW201617603A (zh) | 2016-05-16 |
| US20160025645A1 (en) | 2016-01-28 |
| JP6807829B2 (ja) | 2021-01-06 |
| JP2017531162A (ja) | 2017-10-19 |
| CN106575631A (zh) | 2017-04-19 |
| WO2016014590A1 (en) | 2016-01-28 |
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