SG11201610820YA - System and method for simultaneous dark field and phase contrast inspection - Google Patents
System and method for simultaneous dark field and phase contrast inspectionInfo
- Publication number
- SG11201610820YA SG11201610820YA SG11201610820YA SG11201610820YA SG11201610820YA SG 11201610820Y A SG11201610820Y A SG 11201610820YA SG 11201610820Y A SG11201610820Y A SG 11201610820YA SG 11201610820Y A SG11201610820Y A SG 11201610820YA SG 11201610820Y A SG11201610820Y A SG 11201610820YA
- Authority
- SG
- Singapore
- Prior art keywords
- phase contrast
- dark field
- contrast inspection
- simultaneous dark
- simultaneous
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
Landscapes
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Microscoopes, Condenser (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462027393P | 2014-07-22 | 2014-07-22 | |
| US14/804,296 US9726615B2 (en) | 2014-07-22 | 2015-07-20 | System and method for simultaneous dark field and phase contrast inspection |
| PCT/US2015/041409 WO2016014590A1 (en) | 2014-07-22 | 2015-07-21 | System and method for simultaneous dark field and phase contrast inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201610820YA true SG11201610820YA (en) | 2017-02-27 |
Family
ID=55163659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201610820YA SG11201610820YA (en) | 2014-07-22 | 2015-07-21 | System and method for simultaneous dark field and phase contrast inspection |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9726615B2 (enExample) |
| JP (1) | JP6807829B2 (enExample) |
| KR (1) | KR102241899B1 (enExample) |
| CN (1) | CN106575631B (enExample) |
| DE (1) | DE112015003394B4 (enExample) |
| SG (1) | SG11201610820YA (enExample) |
| TW (1) | TWI639822B (enExample) |
| WO (1) | WO2016014590A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
| TWI606101B (zh) | 2016-12-28 | 2017-11-21 | 財團法人工業技術研究院 | 塗佈組合物及其製備方法 |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| CN108022849B (zh) * | 2017-11-30 | 2020-06-16 | 上海华力微电子有限公司 | 一种亮场缺陷检测设备自动优化光强条件的方法及系统 |
| US10845187B2 (en) * | 2018-03-02 | 2020-11-24 | Drexel University | Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns |
| US11067389B2 (en) * | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| US10705026B2 (en) * | 2018-10-26 | 2020-07-07 | Kla Corporation | Scanning differential interference contrast in an imaging system design |
| US10948423B2 (en) * | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
| JP7511013B2 (ja) * | 2020-02-12 | 2024-07-04 | 深▲セン▼華大智造科技股▲ふん▼有限公司 | 光学結像系及びそれを適用した生化物質検出系 |
| US20240280483A1 (en) * | 2021-07-14 | 2024-08-22 | Hitachi High-Tech Corporation | Defect inspection device |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961142A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | 欠陥検出装置 |
| US5798829A (en) | 1996-03-05 | 1998-08-25 | Kla-Tencor Corporation | Single laser bright field and dark field system for detecting anomalies of a sample |
| US6999183B2 (en) | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
| US20030215791A1 (en) | 2002-05-20 | 2003-11-20 | Applied Spectral Imaging Ltd. | Method of and system for multiplexed analysis by spectral imaging |
| JP3878107B2 (ja) * | 2002-11-06 | 2007-02-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US20050254065A1 (en) * | 2004-05-12 | 2005-11-17 | Stokowski Stanley E | Method and apparatus for detecting surface characteristics on a mask blank |
| WO2007016682A2 (en) * | 2005-08-02 | 2007-02-08 | Kla-Tencor Technologies Corporation | Systems configured to generate output corresponding to defects on a specimen |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| WO2008048612A2 (en) | 2006-10-17 | 2008-04-24 | Hnuphotonics | Miniature microscope camera |
| US7728969B2 (en) | 2006-12-05 | 2010-06-01 | Kla-Tencor Technologies Corp. | Methods and systems for identifying defect types on a wafer |
| JP2008151865A (ja) | 2006-12-14 | 2008-07-03 | Olympus Corp | 顕微鏡システム |
| DE102007047935A1 (de) | 2007-03-19 | 2008-09-25 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer |
| US7782452B2 (en) | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| JP5104346B2 (ja) * | 2008-01-29 | 2012-12-19 | 株式会社ニコン | 表面欠陥検査方法及びその装置 |
| US20120225475A1 (en) | 2010-11-16 | 2012-09-06 | 1087 Systems, Inc. | Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells |
| US10048480B2 (en) | 2011-01-07 | 2018-08-14 | Zeta Instruments, Inc. | 3D microscope including insertable components to provide multiple imaging and measurement capabilities |
| US9279774B2 (en) | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| EP2737303B1 (en) * | 2011-07-28 | 2017-06-28 | Paul Scherrer Institut | Method for image fusion based on principal component analysis |
| US8755044B2 (en) | 2011-08-15 | 2014-06-17 | Kla-Tencor Corporation | Large particle detection for multi-spot surface scanning inspection systems |
| WO2013134068A1 (en) | 2012-03-07 | 2013-09-12 | Kla-Tencor Corporation | Wafer and reticle inspection systems and method for selecting illumination pupil configurations |
| US9053390B2 (en) | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
| JP6124774B2 (ja) * | 2013-03-22 | 2017-05-10 | オリンパス株式会社 | 位相分布計測方法、及び、位相分布計測装置 |
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
-
2015
- 2015-07-20 US US14/804,296 patent/US9726615B2/en active Active
- 2015-07-21 WO PCT/US2015/041409 patent/WO2016014590A1/en not_active Ceased
- 2015-07-21 KR KR1020177004868A patent/KR102241899B1/ko active Active
- 2015-07-21 SG SG11201610820YA patent/SG11201610820YA/en unknown
- 2015-07-21 JP JP2017503491A patent/JP6807829B2/ja active Active
- 2015-07-21 CN CN201580038195.1A patent/CN106575631B/zh active Active
- 2015-07-21 DE DE112015003394.7T patent/DE112015003394B4/de active Active
- 2015-07-22 TW TW104123748A patent/TWI639822B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112015003394B4 (de) | 2023-04-27 |
| KR102241899B1 (ko) | 2021-04-16 |
| DE112015003394T5 (de) | 2017-03-30 |
| US9726615B2 (en) | 2017-08-08 |
| KR20170033884A (ko) | 2017-03-27 |
| CN106575631B (zh) | 2019-02-01 |
| TW201617603A (zh) | 2016-05-16 |
| US20160025645A1 (en) | 2016-01-28 |
| TWI639822B (zh) | 2018-11-01 |
| JP6807829B2 (ja) | 2021-01-06 |
| JP2017531162A (ja) | 2017-10-19 |
| CN106575631A (zh) | 2017-04-19 |
| WO2016014590A1 (en) | 2016-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL281672B (en) | Method and system for optical phase measurement | |
| GB2549208B (en) | System and method for image reconstruction | |
| SG11201609859YA (en) | Method and system for image georegistration | |
| GB2545588B (en) | System and method for image composition | |
| EP3190401A4 (en) | Inspection device and inspection method | |
| EP3203217A4 (en) | Inspection device and inspection method | |
| EP3146796A4 (en) | Method and apparatus for providing notification | |
| EP3098594A4 (en) | X-ray inspection apparatus and x-ray inspection method | |
| PL3341713T3 (pl) | Układ kontrolny dla obiektów w postaci kapsułek oraz powiązany sposób | |
| SG11201610820YA (en) | System and method for simultaneous dark field and phase contrast inspection | |
| ZA201606932B (en) | System and method for position detection | |
| EP3170304A4 (en) | Method and apparatus for detecting imaging conditions | |
| GB2547575B (en) | System and method for digital radiography | |
| IL247925B (en) | Customs supervision and release system and method | |
| EP3198405A4 (en) | Method and apparatus for simd structured branching | |
| IL252107A0 (en) | A method and system for spectral imaging | |
| PL3125001T3 (pl) | System i sposób do radiacyjnej inspekcji ruchomego obiektu | |
| GB201417272D0 (en) | Measurement method and system | |
| EP3207696A4 (en) | Imaging apparatus and imaging method | |
| GB201409036D0 (en) | Detection apparatus and method | |
| IL230969A0 (en) | A network-based system and method for influence | |
| GB201513866D0 (en) | Method and apparatus for electrocagulation | |
| EP3102929A4 (en) | System devise and method for testing an object | |
| SG10201403334XA (en) | Detection system and method | |
| EP3128331A4 (en) | Supporting device and inspection method |