CN106575631B - 用于同步暗场及相位对比检验的系统及方法 - Google Patents
用于同步暗场及相位对比检验的系统及方法 Download PDFInfo
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- CN106575631B CN106575631B CN201580038195.1A CN201580038195A CN106575631B CN 106575631 B CN106575631 B CN 106575631B CN 201580038195 A CN201580038195 A CN 201580038195A CN 106575631 B CN106575631 B CN 106575631B
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Microscoopes, Condenser (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462027393P | 2014-07-22 | 2014-07-22 | |
| US62/027,393 | 2014-07-22 | ||
| US14/804,296 US9726615B2 (en) | 2014-07-22 | 2015-07-20 | System and method for simultaneous dark field and phase contrast inspection |
| US14/804,296 | 2015-07-20 | ||
| PCT/US2015/041409 WO2016014590A1 (en) | 2014-07-22 | 2015-07-21 | System and method for simultaneous dark field and phase contrast inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106575631A CN106575631A (zh) | 2017-04-19 |
| CN106575631B true CN106575631B (zh) | 2019-02-01 |
Family
ID=55163659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580038195.1A Active CN106575631B (zh) | 2014-07-22 | 2015-07-21 | 用于同步暗场及相位对比检验的系统及方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9726615B2 (enExample) |
| JP (1) | JP6807829B2 (enExample) |
| KR (1) | KR102241899B1 (enExample) |
| CN (1) | CN106575631B (enExample) |
| DE (1) | DE112015003394B4 (enExample) |
| SG (1) | SG11201610820YA (enExample) |
| TW (1) | TWI639822B (enExample) |
| WO (1) | WO2016014590A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
| TWI606101B (zh) | 2016-12-28 | 2017-11-21 | 財團法人工業技術研究院 | 塗佈組合物及其製備方法 |
| US10422984B2 (en) * | 2017-05-12 | 2019-09-24 | Applied Materials, Inc. | Flexible mode scanning optical microscopy and inspection system |
| CN108022849B (zh) * | 2017-11-30 | 2020-06-16 | 上海华力微电子有限公司 | 一种亮场缺陷检测设备自动优化光强条件的方法及系统 |
| US10845187B2 (en) * | 2018-03-02 | 2020-11-24 | Drexel University | Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns |
| US11067389B2 (en) * | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
| US11017520B2 (en) * | 2018-09-04 | 2021-05-25 | Kla Corporation | Multi-wavelength interferometry for defect classification |
| US10705026B2 (en) * | 2018-10-26 | 2020-07-07 | Kla Corporation | Scanning differential interference contrast in an imaging system design |
| US10948423B2 (en) * | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
| CN115380203B (zh) * | 2020-02-12 | 2025-07-22 | 深圳华大智造科技股份有限公司 | 光学成像系统及应用所述光学成像系统的生化物质检测系统 |
| US20240280483A1 (en) * | 2021-07-14 | 2024-08-22 | Hitachi High-Tech Corporation | Defect inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858002A (zh) * | 2011-07-28 | 2014-06-11 | 保罗·谢勒学院 | 基于主成分分析的图像融合方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961142A (ja) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | 欠陥検出装置 |
| US5798829A (en) | 1996-03-05 | 1998-08-25 | Kla-Tencor Corporation | Single laser bright field and dark field system for detecting anomalies of a sample |
| US6999183B2 (en) | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
| US20030215791A1 (en) | 2002-05-20 | 2003-11-20 | Applied Spectral Imaging Ltd. | Method of and system for multiplexed analysis by spectral imaging |
| JP3878107B2 (ja) | 2002-11-06 | 2007-02-07 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US20050254065A1 (en) * | 2004-05-12 | 2005-11-17 | Stokowski Stanley E | Method and apparatus for detecting surface characteristics on a mask blank |
| US7924434B2 (en) * | 2005-08-02 | 2011-04-12 | Kla-Tencor Technologies Corp. | Systems configured to generate output corresponding to defects on a specimen |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| WO2008048612A2 (en) | 2006-10-17 | 2008-04-24 | Hnuphotonics | Miniature microscope camera |
| US7728969B2 (en) | 2006-12-05 | 2010-06-01 | Kla-Tencor Technologies Corp. | Methods and systems for identifying defect types on a wafer |
| JP2008151865A (ja) | 2006-12-14 | 2008-07-03 | Olympus Corp | 顕微鏡システム |
| DE102007047935A1 (de) | 2007-03-19 | 2008-09-25 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer |
| US7782452B2 (en) | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| JP5104346B2 (ja) * | 2008-01-29 | 2012-12-19 | 株式会社ニコン | 表面欠陥検査方法及びその装置 |
| US20120225475A1 (en) | 2010-11-16 | 2012-09-06 | 1087 Systems, Inc. | Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells |
| US10048480B2 (en) | 2011-01-07 | 2018-08-14 | Zeta Instruments, Inc. | 3D microscope including insertable components to provide multiple imaging and measurement capabilities |
| US9279774B2 (en) | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| US8755044B2 (en) | 2011-08-15 | 2014-06-17 | Kla-Tencor Corporation | Large particle detection for multi-spot surface scanning inspection systems |
| JP6345125B2 (ja) | 2012-03-07 | 2018-06-20 | ケーエルエー−テンカー コーポレイション | ウェハおよびレチクル検査システムならびに照明瞳配置を選択するための方法 |
| US9053390B2 (en) | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
| JP6124774B2 (ja) * | 2013-03-22 | 2017-05-10 | オリンパス株式会社 | 位相分布計測方法、及び、位相分布計測装置 |
| US9726615B2 (en) | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
-
2015
- 2015-07-20 US US14/804,296 patent/US9726615B2/en active Active
- 2015-07-21 SG SG11201610820YA patent/SG11201610820YA/en unknown
- 2015-07-21 CN CN201580038195.1A patent/CN106575631B/zh active Active
- 2015-07-21 DE DE112015003394.7T patent/DE112015003394B4/de active Active
- 2015-07-21 KR KR1020177004868A patent/KR102241899B1/ko active Active
- 2015-07-21 WO PCT/US2015/041409 patent/WO2016014590A1/en not_active Ceased
- 2015-07-21 JP JP2017503491A patent/JP6807829B2/ja active Active
- 2015-07-22 TW TW104123748A patent/TWI639822B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858002A (zh) * | 2011-07-28 | 2014-06-11 | 保罗·谢勒学院 | 基于主成分分析的图像融合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112015003394T5 (de) | 2017-03-30 |
| WO2016014590A1 (en) | 2016-01-28 |
| DE112015003394B4 (de) | 2023-04-27 |
| SG11201610820YA (en) | 2017-02-27 |
| JP2017531162A (ja) | 2017-10-19 |
| CN106575631A (zh) | 2017-04-19 |
| TW201617603A (zh) | 2016-05-16 |
| TWI639822B (zh) | 2018-11-01 |
| US9726615B2 (en) | 2017-08-08 |
| JP6807829B2 (ja) | 2021-01-06 |
| KR20170033884A (ko) | 2017-03-27 |
| KR102241899B1 (ko) | 2021-04-16 |
| US20160025645A1 (en) | 2016-01-28 |
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| GR01 | Patent grant | ||
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