DE112015003394B4 - Vorrichtung zur gleichzeitigen dunkelfeldinspektion und inspektion mittels differentialinterferenzkontrast - Google Patents

Vorrichtung zur gleichzeitigen dunkelfeldinspektion und inspektion mittels differentialinterferenzkontrast Download PDF

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Publication number
DE112015003394B4
DE112015003394B4 DE112015003394.7T DE112015003394T DE112015003394B4 DE 112015003394 B4 DE112015003394 B4 DE 112015003394B4 DE 112015003394 T DE112015003394 T DE 112015003394T DE 112015003394 B4 DE112015003394 B4 DE 112015003394B4
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signal
illumination
sample
sensor
path
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DE112015003394.7T
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German (de)
English (en)
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DE112015003394T5 (de
Inventor
Chuanyong Huang
Qing Li
Donald Pettibone
Buzz Graves
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
DE112015003394.7T 2014-07-22 2015-07-21 Vorrichtung zur gleichzeitigen dunkelfeldinspektion und inspektion mittels differentialinterferenzkontrast Active DE112015003394B4 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462027393P 2014-07-22 2014-07-22
US62/027,393 2014-07-22
US14/804,296 2015-07-20
US14/804,296 US9726615B2 (en) 2014-07-22 2015-07-20 System and method for simultaneous dark field and phase contrast inspection
PCT/US2015/041409 WO2016014590A1 (en) 2014-07-22 2015-07-21 System and method for simultaneous dark field and phase contrast inspection

Publications (2)

Publication Number Publication Date
DE112015003394T5 DE112015003394T5 (de) 2017-03-30
DE112015003394B4 true DE112015003394B4 (de) 2023-04-27

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DE112015003394.7T Active DE112015003394B4 (de) 2014-07-22 2015-07-21 Vorrichtung zur gleichzeitigen dunkelfeldinspektion und inspektion mittels differentialinterferenzkontrast

Country Status (8)

Country Link
US (1) US9726615B2 (enExample)
JP (1) JP6807829B2 (enExample)
KR (1) KR102241899B1 (enExample)
CN (1) CN106575631B (enExample)
DE (1) DE112015003394B4 (enExample)
SG (1) SG11201610820YA (enExample)
TW (1) TWI639822B (enExample)
WO (1) WO2016014590A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9726615B2 (en) 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection
TWI606101B (zh) 2016-12-28 2017-11-21 財團法人工業技術研究院 塗佈組合物及其製備方法
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
CN108022849B (zh) * 2017-11-30 2020-06-16 上海华力微电子有限公司 一种亮场缺陷检测设备自动优化光强条件的方法及系统
US10845187B2 (en) * 2018-03-02 2020-11-24 Drexel University Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns
US11067389B2 (en) * 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
US10732130B2 (en) * 2018-06-19 2020-08-04 Kla-Tencor Corporation Embedded particle depth binning based on multiple scattering signals
US11017520B2 (en) * 2018-09-04 2021-05-25 Kla Corporation Multi-wavelength interferometry for defect classification
US10705026B2 (en) * 2018-10-26 2020-07-07 Kla Corporation Scanning differential interference contrast in an imaging system design
US10948423B2 (en) * 2019-02-17 2021-03-16 Kla Corporation Sensitive particle detection with spatially-varying polarization rotator and polarizer
CN120446068A (zh) * 2020-02-12 2025-08-08 深圳华大智造科技股份有限公司 测序拍照成像系统及测序拍照成像方法
US20240280483A1 (en) * 2021-07-14 2024-08-22 Hitachi High-Tech Corporation Defect inspection device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798829A (en) 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
US20050254065A1 (en) 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
US20090180176A1 (en) 2003-02-21 2009-07-16 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US20130016346A1 (en) 2011-07-12 2013-01-17 Kla-Tencor Corporation Wafer Inspection
US20160025645A1 (en) 2014-07-22 2016-01-28 Kla-Tencor Corporation System and Method for Simultaneous Dark Field and Phase Contrast Inspection

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961142A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 欠陥検出装置
US6999183B2 (en) 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US20030215791A1 (en) 2002-05-20 2003-11-20 Applied Spectral Imaging Ltd. Method of and system for multiplexed analysis by spectral imaging
JP3878107B2 (ja) * 2002-11-06 2007-02-07 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
US7924434B2 (en) 2005-08-02 2011-04-12 Kla-Tencor Technologies Corp. Systems configured to generate output corresponding to defects on a specimen
WO2008048612A2 (en) 2006-10-17 2008-04-24 Hnuphotonics Miniature microscope camera
US7728969B2 (en) 2006-12-05 2010-06-01 Kla-Tencor Technologies Corp. Methods and systems for identifying defect types on a wafer
JP2008151865A (ja) 2006-12-14 2008-07-03 Olympus Corp 顕微鏡システム
DE102007047935A1 (de) 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
JP5104346B2 (ja) * 2008-01-29 2012-12-19 株式会社ニコン 表面欠陥検査方法及びその装置
US20120225475A1 (en) 2010-11-16 2012-09-06 1087 Systems, Inc. Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells
US10048480B2 (en) 2011-01-07 2018-08-14 Zeta Instruments, Inc. 3D microscope including insertable components to provide multiple imaging and measurement capabilities
JP6099645B2 (ja) * 2011-07-28 2017-03-22 パウル・シェラー・インスティトゥート 主成分分析に基づく画像融合法およびｘ線用装置
US8755044B2 (en) 2011-08-15 2014-06-17 Kla-Tencor Corporation Large particle detection for multi-spot surface scanning inspection systems
JP6345125B2 (ja) 2012-03-07 2018-06-20 ケーエルエー−テンカー コーポレイション ウェハおよびレチクル検査システムならびに照明瞳配置を選択するための方法
US9053390B2 (en) 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation
JP6124774B2 (ja) * 2013-03-22 2017-05-10 オリンパス株式会社 位相分布計測方法、及び、位相分布計測装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798829A (en) 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
US20090180176A1 (en) 2003-02-21 2009-07-16 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US20050254065A1 (en) 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
US20130016346A1 (en) 2011-07-12 2013-01-17 Kla-Tencor Corporation Wafer Inspection
US20160025645A1 (en) 2014-07-22 2016-01-28 Kla-Tencor Corporation System and Method for Simultaneous Dark Field and Phase Contrast Inspection

Also Published As

Publication number Publication date
TWI639822B (zh) 2018-11-01
JP6807829B2 (ja) 2021-01-06
JP2017531162A (ja) 2017-10-19
US9726615B2 (en) 2017-08-08
KR20170033884A (ko) 2017-03-27
DE112015003394T5 (de) 2017-03-30
TW201617603A (zh) 2016-05-16
CN106575631A (zh) 2017-04-19
CN106575631B (zh) 2019-02-01
KR102241899B1 (ko) 2021-04-16
SG11201610820YA (en) 2017-02-27
WO2016014590A1 (en) 2016-01-28
US20160025645A1 (en) 2016-01-28

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