JP2007511739A5 - - Google Patents

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Publication number
JP2007511739A5
JP2007511739A5 JP2006525531A JP2006525531A JP2007511739A5 JP 2007511739 A5 JP2007511739 A5 JP 2007511739A5 JP 2006525531 A JP2006525531 A JP 2006525531A JP 2006525531 A JP2006525531 A JP 2006525531A JP 2007511739 A5 JP2007511739 A5 JP 2007511739A5
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Japan
Prior art keywords
light
specimen
subsystem
optical
illumination
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JP2006525531A
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Japanese (ja)
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JP2007511739A (ja
JP5006040B2 (ja
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Priority claimed from US10/933,873 external-priority patent/US7738089B2/en
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Publication of JP2007511739A5 publication Critical patent/JP2007511739A5/ja
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Publication of JP5006040B2 publication Critical patent/JP5006040B2/ja
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JP2006525531A 2003-09-04 2004-09-03 異なる検査パラメータを使用する試験片の検査のための方法とシステム Expired - Lifetime JP5006040B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US50017403P 2003-09-04 2003-09-04
US60/500,174 2003-09-04
US10/933,873 2004-09-03
US10/933,873 US7738089B2 (en) 2003-09-04 2004-09-03 Methods and systems for inspection of a specimen using different inspection parameters
PCT/US2004/029189 WO2005024404A1 (en) 2003-09-04 2004-09-03 Methods and systems for inspection of a specimen using different inspection parameters

Related Child Applications (1)

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JP2011132931A Division JP5529806B2 (ja) 2003-09-04 2011-06-15 異なる検査パラメータを使用する試験片の検査のための方法とシステム

Publications (3)

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JP2007511739A JP2007511739A (ja) 2007-05-10
JP2007511739A5 true JP2007511739A5 (enExample) 2007-12-06
JP5006040B2 JP5006040B2 (ja) 2012-08-22

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JP2006525531A Expired - Lifetime JP5006040B2 (ja) 2003-09-04 2004-09-03 異なる検査パラメータを使用する試験片の検査のための方法とシステム
JP2011132931A Expired - Lifetime JP5529806B2 (ja) 2003-09-04 2011-06-15 異なる検査パラメータを使用する試験片の検査のための方法とシステム

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JP2011132931A Expired - Lifetime JP5529806B2 (ja) 2003-09-04 2011-06-15 異なる検査パラメータを使用する試験片の検査のための方法とシステム

Country Status (4)

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US (2) US7738089B2 (enExample)
EP (2) EP1697729B1 (enExample)
JP (2) JP5006040B2 (enExample)
WO (1) WO2005024404A1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7352456B2 (en) * 2003-04-08 2008-04-01 Kla-Tencor Technologies Corp. Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes
JP5006040B2 (ja) * 2003-09-04 2012-08-22 ケーエルエー−テンカー コーポレイション 異なる検査パラメータを使用する試験片の検査のための方法とシステム
JP4713185B2 (ja) * 2005-03-11 2011-06-29 株式会社日立ハイテクノロジーズ 異物欠陥検査方法及びその装置
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
US7528943B2 (en) * 2005-12-27 2009-05-05 Kla-Tencor Technologies Corporation Method and apparatus for simultaneous high-speed acquisition of multiple images
US8148900B1 (en) 2006-01-17 2012-04-03 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for inspection
US7564544B2 (en) * 2006-03-22 2009-07-21 3i Systems Corporation Method and system for inspecting surfaces with improved light efficiency
US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
US7659973B2 (en) * 2006-05-26 2010-02-09 Applied Materials Southeast Asia, Pte Ltd. Wafer inspection using short-pulsed continuous broadband illumination
US7705331B1 (en) 2006-06-29 2010-04-27 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for a process performed on the specimen
US7714996B2 (en) * 2007-01-23 2010-05-11 3i Systems Corporation Automatic inspection system for flat panel substrate
US8073240B2 (en) * 2007-05-07 2011-12-06 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US9052494B2 (en) 2007-10-02 2015-06-09 Kla-Tencor Technologies Corporation Optical imaging system with catoptric objective; broadband objective with mirror; and refractive lenses and broadband optical imaging system having two or more imaging paths
TWI460421B (zh) * 2009-06-09 2014-11-11 Metal Ind Res & Dev Ct The method of selecting light source and its system
US8711346B2 (en) * 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
JP4922381B2 (ja) * 2009-11-06 2012-04-25 株式会社東芝 パターン検査装置及びパターン検査方法
US8826209B2 (en) 2011-06-30 2014-09-02 Synopsys, Inc. Automated inline defect characterization
US9430606B2 (en) 2010-01-30 2016-08-30 Synopsys, Inc. Failure analysis and inline defect characterization
JP2011191252A (ja) * 2010-03-16 2011-09-29 Nippon Steel Engineering Co Ltd 金属の表面品質評価方法および金属の表面品質評価装置
US8830464B2 (en) * 2012-11-06 2014-09-09 Kla-Tencor Corporation Film thickness, refractive index, and extinction coefficient determination for film curve creation and defect sizing in real time
US9076363B2 (en) * 2013-01-07 2015-07-07 Apple Inc. Parallel sensing configuration covers spectrum and colorimetric quantities with spatial resolution
TWI627546B (zh) 2013-06-29 2018-06-21 新納普系統股份有限公司 故障分析期間之晶片截面識別和呈現
US9454635B2 (en) 2014-01-25 2016-09-27 Synopsys, Inc. Virtual layer generation during failure analysis
DE102014111945A1 (de) * 2014-05-19 2015-11-19 Zentrum Mikroelektronik Dresden Ag Funktionseinheit mit strahlungsundurchlässigen Mitteln
US10474781B2 (en) 2014-05-24 2019-11-12 Synopsys, Inc. Virtual hierarchical layer usage
US10948421B2 (en) * 2014-08-28 2021-03-16 Asml Netherlands B.V. Laser-driven photon source and inspection apparatus including such a laser-driven photon source
US9702827B1 (en) * 2014-11-20 2017-07-11 Kla-Tencor Corp. Optical mode analysis with design-based care areas
US10139283B2 (en) 2015-11-30 2018-11-27 Kla-Tencor Corporation Non-contact thermal measurements of VUV optics
WO2017149689A1 (ja) * 2016-03-02 2017-09-08 株式会社日立ハイテクノロジーズ 欠陥検査装置、パターンチップ及び欠陥検査方法
JP2017198612A (ja) * 2016-04-28 2017-11-02 キヤノン株式会社 検査装置、検査システム、および物品製造方法
DE102016109803B3 (de) * 2016-05-27 2017-07-06 Eyec Gmbh Inspektionsvorrichtung und Inspektionsverfahren zur Inspektion des Oberflächenbildes einer einen Prüfling darstellenden Flachsache
JP2018205458A (ja) * 2017-06-01 2018-12-27 凸版印刷株式会社 Ｅｕｖブランク及びｅｕｖマスクの欠陥検査装置、欠陥検査方法、ｅｕｖマスクの製造方法
JP6859962B2 (ja) * 2018-01-10 2021-04-14 オムロン株式会社 画像検査装置および照明装置
FR3077888B1 (fr) 2018-02-13 2020-02-28 Stmicroelectronics (Crolles 2) Sas Puce optoelectronique et procede de test de circuits photoniques d'une telle puce
FR3077887B1 (fr) 2018-02-13 2021-07-23 St Microelectronics Crolles 2 Sas Puce optoelectronique et procede de test de circuits photoniques d'une telle puce
US10670536B2 (en) * 2018-03-28 2020-06-02 Kla-Tencor Corp. Mode selection for inspection
WO2021250884A1 (ja) * 2020-06-12 2021-12-16 株式会社日立ハイテク 欠陥検査のための方法、システム、及びコンピューター可読媒体
US12417816B2 (en) * 2023-09-05 2025-09-16 SanDisk Technologies, Inc. Memory testing flow set up with computational intelligence
CN119849402B (zh) * 2025-03-19 2025-06-27 北京市天润中电高压电子有限公司 一种脉冲高压硅堆制造方法

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3471214A (en) * 1966-02-21 1969-10-07 Warner Lambert Pharmaceutical Elongated flexible fiber optical sheet-like layer and associated optical components for transmitting two-dimensional images
US3758188A (en) * 1972-06-06 1973-09-11 American Optical Corp Image-transmitting optical system
US3877814A (en) * 1973-02-07 1975-04-15 Ppg Industries Inc Method of and apparatus for detecting concave and convex portions in a specular surface
US4498772A (en) * 1982-11-05 1985-02-12 Rca Corporation Method to determine the crystalline properties of an interface of two materials by an optical technique
US4771468A (en) * 1986-04-17 1988-09-13 International Business Machines Corporation System for automatic inspection of periodic patterns
US4889998A (en) * 1987-01-29 1989-12-26 Nikon Corporation Apparatus with four light detectors for checking surface of mask with pellicle
US4877326A (en) * 1988-02-19 1989-10-31 Kla Instruments Corporation Method and apparatus for optical inspection of substrates
US4933567A (en) * 1988-07-13 1990-06-12 Vti, Inc. Method and apparatus for nondestructively measuring subsurface defects in materials
US5235400A (en) * 1988-10-12 1993-08-10 Hitachi, Ltd. Method of and apparatus for detecting defect on photomask
IL94368A (en) * 1990-05-11 1993-07-08 Orbot Systems Ltd Optic inspection apparatus and illumination system particularly useful therein
US5293538A (en) * 1990-05-25 1994-03-08 Hitachi, Ltd. Method and apparatus for the inspection of defects
US5179422A (en) * 1991-05-15 1993-01-12 Environmental Research Institute Of Michigan Contamination detection system
US5345514A (en) * 1991-09-16 1994-09-06 General Electric Company Method for inspecting components having complex geometric shapes
JPH07231023A (ja) 1994-02-17 1995-08-29 Fujitsu Ltd 薄膜の形状計測方法
KR0131172B1 (ko) * 1994-05-07 1998-04-16 김은영 스펙트럴 코딩 방식에 의한 직접 화상 전송 방법 및 장치
KR960015001A (ko) * 1994-10-07 1996-05-22 가나이 쓰토무 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치
JP3381924B2 (ja) * 1995-03-10 2003-03-04 株式会社 日立製作所 検査装置
US5744381A (en) * 1995-03-13 1998-04-28 Kabushiki Kaisha Toshiba Method of inspecting a pattern formed on a sample for a defect, and an apparatus thereof
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
JP2002181723A (ja) * 1995-10-24 2002-06-26 Nkk Corp 表面検査装置
US5825498A (en) * 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
US6064517A (en) 1996-07-22 2000-05-16 Kla-Tencor Corporation High NA system for multiple mode imaging
US5798837A (en) * 1997-07-11 1998-08-25 Therma-Wave, Inc. Thin film optical measurement system and method with calibrating ellipsometer
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
JPH11142127A (ja) * 1997-11-11 1999-05-28 Topcon Corp ウェーハ表面検査方法とその装置
US6104481A (en) 1997-11-11 2000-08-15 Kabushiki Kaisha Topcon Surface inspection apparatus
US6157444A (en) * 1997-11-28 2000-12-05 Hitachi, Ltd. Defect inspection apparatus for silicon wafer
JP3166841B2 (ja) * 1998-04-10 2001-05-14 日本電気株式会社 パーティクル検査装置
US6822978B2 (en) * 1999-05-27 2004-11-23 Spectra Physics, Inc. Remote UV laser system and methods of use
JP4332933B2 (ja) * 1999-06-10 2009-09-16 ソニー株式会社 検査装置
US6392791B1 (en) * 1999-10-25 2002-05-21 University Of Alabama In Huntsville Optical system and method for performing a defined function on an optical beam having at least one of a minimized volume or reduced operating temperature
US6999614B1 (en) 1999-11-29 2006-02-14 Kla-Tencor Corporation Power assisted automatic supervised classifier creation tool for semiconductor defects
JP3784603B2 (ja) * 2000-03-02 2006-06-14 株式会社日立製作所 検査方法及びその装置並びに検査装置における検査条件設定方法
JP3652589B2 (ja) * 2000-08-01 2005-05-25 大日本スクリーン製造株式会社 欠陥検査装置
US6917433B2 (en) 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
US6731384B2 (en) * 2000-10-10 2004-05-04 Hitachi, Ltd. Apparatus for detecting foreign particle and defect and the same method
JP2002116155A (ja) * 2000-10-10 2002-04-19 Hitachi Ltd 異物・欠陥検査装置及び検査方法
US6836560B2 (en) * 2000-11-13 2004-12-28 Kla - Tencor Technologies Corporation Advanced phase shift inspection method
US7142294B2 (en) * 2000-12-20 2006-11-28 Hitachi, Ltd. Method and apparatus for detecting defects
US6538725B2 (en) * 2001-01-22 2003-03-25 General Electric Company Method for determination of structural defects of coatings
US6608321B1 (en) * 2001-02-01 2003-08-19 Advanced Micro Devices, Inc. Differential wavelength inspection system
JP4014379B2 (ja) * 2001-02-21 2007-11-28 株式会社日立製作所 欠陥レビュー装置及び方法
JP2002303586A (ja) * 2001-04-03 2002-10-18 Hitachi Ltd 欠陥検査方法及び欠陥検査装置
US6674522B2 (en) * 2001-05-04 2004-01-06 Kla-Tencor Technologies Corporation Efficient phase defect detection system and method
US6583876B2 (en) * 2001-05-24 2003-06-24 Therma-Wave, Inc. Apparatus for optical measurements of nitrogen concentration in thin films
JP2003232749A (ja) * 2002-02-06 2003-08-22 Hamamatsu Photonics Kk 半導体デバイス故障解析装置
US6710868B2 (en) * 2002-05-22 2004-03-23 Applied Materials, Inc. Optical inspection system with dual detection heads
WO2004031754A1 (en) * 2002-09-30 2004-04-15 Applied Materials Israel, Ltd. Dark field inspection system
US7352456B2 (en) * 2003-04-08 2008-04-01 Kla-Tencor Technologies Corp. Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes
JP5006040B2 (ja) 2003-09-04 2012-08-22 ケーエルエー−テンカー コーポレイション 異なる検査パラメータを使用する試験片の検査のための方法とシステム
US7110106B2 (en) * 2003-10-29 2006-09-19 Coretech Optical, Inc. Surface inspection system

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