JP2016516307A5 - - Google Patents
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- JP2016516307A5 JP2016516307A5 JP2016506620A JP2016506620A JP2016516307A5 JP 2016516307 A5 JP2016516307 A5 JP 2016516307A5 JP 2016506620 A JP2016506620 A JP 2016506620A JP 2016506620 A JP2016506620 A JP 2016506620A JP 2016516307 A5 JP2016516307 A5 JP 2016516307A5
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- lens
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- diffraction limit
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- 238000005286 illumination Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361807753P | 2013-04-03 | 2013-04-03 | |
| US61/807,753 | 2013-04-03 | ||
| US14/226,745 US9696264B2 (en) | 2013-04-03 | 2014-03-26 | Apparatus and methods for determining defect depths in vertical stack memory |
| US14/226,745 | 2014-03-26 | ||
| PCT/US2014/032842 WO2014165680A1 (en) | 2013-04-03 | 2014-04-03 | Apparatus and methods for determining defect depths in vertical stack memory |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019129253A Division JP2019208039A (ja) | 2013-04-03 | 2019-07-11 | 垂直スタックメモリにおいて欠陥深さを決定するための方法及びシステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016516307A JP2016516307A (ja) | 2016-06-02 |
| JP2016516307A5 true JP2016516307A5 (enExample) | 2017-07-13 |
Family
ID=51654220
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016506620A Pending JP2016516307A (ja) | 2013-04-03 | 2014-04-03 | 垂直スタックメモリにおいて欠陥深さを決定するための装置および方法 |
| JP2019129253A Pending JP2019208039A (ja) | 2013-04-03 | 2019-07-11 | 垂直スタックメモリにおいて欠陥深さを決定するための方法及びシステム |
| JP2021168628A Active JP7273121B2 (ja) | 2013-04-03 | 2021-10-14 | 垂直スタックメモリにおいて欠陥深さを決定するための方法及びシステム |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019129253A Pending JP2019208039A (ja) | 2013-04-03 | 2019-07-11 | 垂直スタックメモリにおいて欠陥深さを決定するための方法及びシステム |
| JP2021168628A Active JP7273121B2 (ja) | 2013-04-03 | 2021-10-14 | 垂直スタックメモリにおいて欠陥深さを決定するための方法及びシステム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9696264B2 (enExample) |
| JP (3) | JP2016516307A (enExample) |
| KR (1) | KR102079419B1 (enExample) |
| TW (1) | TWI603076B (enExample) |
| WO (1) | WO2014165680A1 (enExample) |
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| KR20140122608A (ko) * | 2013-04-10 | 2014-10-20 | 삼성전자주식회사 | 디펙의 깊이 정보 추출 장치 및 방법과 그 디펙의 깊이 정보를 이용한 반도체 공정 개선방법 |
| US10083069B2 (en) * | 2013-06-27 | 2018-09-25 | Sandisk Technologies Llc | Word line defect detection and handling for a data storage device |
| US9261358B2 (en) * | 2014-07-03 | 2016-02-16 | Align Technology, Inc. | Chromatic confocal system |
| US9439568B2 (en) | 2014-07-03 | 2016-09-13 | Align Technology, Inc. | Apparatus and method for measuring surface topography optically |
| US9599573B2 (en) * | 2014-12-02 | 2017-03-21 | Kla-Tencor Corporation | Inspection systems and techniques with enhanced detection |
| WO2016145633A1 (zh) * | 2015-03-18 | 2016-09-22 | 国立清华大学 | 高速三维成像之光学系统 |
| KR20160115682A (ko) * | 2015-03-25 | 2016-10-06 | 삼성전자주식회사 | 대상에 대하여 공간적으로 가변하는 오토 포커싱을 가능하게 하는 방법 및 이를 이용하는 촬상 시스템 |
| US10495446B2 (en) * | 2015-06-29 | 2019-12-03 | Kla-Tencor Corporation | Methods and apparatus for measuring height on a semiconductor wafer |
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| CN109563141A (zh) | 2016-05-13 | 2019-04-02 | 奥里尼斯生物科学公司 | 对非细胞结构的治疗性靶向 |
| EP3454887B1 (en) | 2016-05-13 | 2021-01-20 | Orionis Biosciences BV | Targeted mutant interferon-beta and uses thereof |
| US10324045B2 (en) * | 2016-08-05 | 2019-06-18 | Kla-Tencor Corporation | Surface defect inspection with large particle monitoring and laser power control |
| US10082470B2 (en) * | 2016-09-27 | 2018-09-25 | Kla-Tencor Corporation | Defect marking for semiconductor wafer inspection |
| US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
| US10481111B2 (en) | 2016-10-21 | 2019-11-19 | Kla-Tencor Corporation | Calibration of a small angle X-ray scatterometry based metrology system |
| US11047806B2 (en) | 2016-11-30 | 2021-06-29 | Kla-Tencor Corporation | Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures |
| JP2018091807A (ja) * | 2016-12-07 | 2018-06-14 | オルボテック リミテッド | 欠陥良否判定方法及び装置 |
| KR102790344B1 (ko) * | 2016-12-29 | 2025-04-01 | 엘지디스플레이 주식회사 | 검사장치 및 이를 이용한 검사방법 |
| US10964013B2 (en) * | 2017-01-10 | 2021-03-30 | Kla-Tencor Corporation | System, method for training and applying defect classifiers in wafers having deeply stacked layers |
| US10928740B2 (en) * | 2017-02-03 | 2021-02-23 | Kla Corporation | Three-dimensional calibration structures and methods for measuring buried defects on a three-dimensional semiconductor wafer |
| US11662646B2 (en) * | 2017-02-05 | 2023-05-30 | Kla Corporation | Inspection and metrology using broadband infrared radiation |
| US10690602B2 (en) * | 2017-02-17 | 2020-06-23 | Kla-Tencor Corporation | Methods and systems for measurement of thick films and high aspect ratio structures |
| US10444161B2 (en) * | 2017-04-05 | 2019-10-15 | Kla-Tencor Corporation | Systems and methods for metrology with layer-specific illumination spectra |
| KR20180128647A (ko) * | 2017-05-24 | 2018-12-04 | 삼성전자주식회사 | 광학 측정 방법 및 장치, 및 이를 이용한 반도체 장치의 제조 방법 |
| KR102429614B1 (ko) | 2017-06-08 | 2022-08-04 | 삼성전자주식회사 | 테스트 시스템, 테스트 방법 및 이들을 이용한 반도체 장치의 제조 방법 |
| KR102368435B1 (ko) | 2017-07-28 | 2022-03-02 | 삼성전자주식회사 | 기판 검사 장치, 기판 검사 방법 및 이를 이용한 반도체 소자의 제조 방법 |
| US10739276B2 (en) | 2017-11-03 | 2020-08-11 | Kla-Tencor Corporation | Minimizing filed size to reduce unwanted stray light |
| US10818005B2 (en) * | 2018-03-12 | 2020-10-27 | Kla-Tencor Corp. | Previous layer nuisance reduction through oblique illumination |
| JP2019168280A (ja) * | 2018-03-22 | 2019-10-03 | 東レエンジニアリング株式会社 | ボイド検査装置 |
| US10615067B2 (en) | 2018-05-18 | 2020-04-07 | Kla-Tencor Corporation | Phase filter for enhanced defect detection in multilayer structure |
| JP7393364B2 (ja) * | 2018-06-20 | 2023-12-06 | プレシテク オプトロニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | 測定対象を光学的にクロマチック共焦点で測定し、かつ共焦点で結像させる装置及び方法 |
| US10854486B2 (en) * | 2018-09-19 | 2020-12-01 | Kla Corporation | System and method for characterization of buried defects |
| US11379967B2 (en) | 2019-01-18 | 2022-07-05 | Kla Corporation | Methods and systems for inspection of semiconductor structures with automatically generated defect features |
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| JP7305495B2 (ja) * | 2019-09-18 | 2023-07-10 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| JP7391583B2 (ja) | 2019-09-18 | 2023-12-05 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
| CN110832631A (zh) * | 2019-10-12 | 2020-02-21 | 长江存储科技有限责任公司 | 用于检测深度特征中的缺陷的方法 |
| US11397153B2 (en) * | 2019-12-03 | 2022-07-26 | Kla Corporation | Apparatus and method for gray field imaging |
| US11768431B2 (en) * | 2019-12-31 | 2023-09-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of fast surface particle and scratch detection for EUV mask backside |
| JP7511013B2 (ja) * | 2020-02-12 | 2024-07-04 | 深▲セン▼華大智造科技股▲ふん▼有限公司 | 光学結像系及びそれを適用した生化物質検出系 |
| KR102335304B1 (ko) | 2020-04-29 | 2021-12-08 | 주식회사 신룡 | 전지용 검사장치 |
| US11798828B2 (en) * | 2020-09-04 | 2023-10-24 | Kla Corporation | Binning-enhanced defect detection method for three-dimensional wafer structures |
| EP4211508B1 (en) * | 2020-09-14 | 2025-11-26 | Singular Genomics Systems, Inc. | Methods and systems for multidimensional imaging |
| CN112255239B (zh) * | 2020-10-22 | 2022-09-20 | 青岛歌尔声学科技有限公司 | 污染位置检测方法、装置、设备及计算机可读存储介质 |
| JP2022108564A (ja) * | 2021-01-13 | 2022-07-26 | 株式会社デンソー | 半導体基板の検査装置および検査方法 |
| US12487175B2 (en) | 2021-02-08 | 2025-12-02 | Kla Corporation | Three-dimensional imaging with enhanced resolution |
| CN113241310B (zh) * | 2021-05-28 | 2022-07-15 | 长江存储科技有限责任公司 | 晶圆缺陷的检测方法、检测装置、检测设备及可读存储介质 |
| JP7717547B2 (ja) | 2021-09-10 | 2025-08-04 | 株式会社東芝 | 生成装置、生成システム、処理システム、生成方法、プログラム、及び記憶媒体 |
| US12211724B2 (en) * | 2022-05-10 | 2025-01-28 | Sandisk Technologies Llc | Optical measurement tool containing chromatic aberration enhancement component and optical alignment method using the same |
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| JPWO2024189664A1 (enExample) * | 2023-03-10 | 2024-09-19 | ||
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| TWI884618B (zh) | 2023-12-06 | 2025-05-21 | 晶呈科技股份有限公司 | 晶圓缺陷分析裝置及晶圓缺陷分析方法 |
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-
2014
- 2014-03-26 US US14/226,745 patent/US9696264B2/en active Active
- 2014-04-03 TW TW103112611A patent/TWI603076B/zh active
- 2014-04-03 WO PCT/US2014/032842 patent/WO2014165680A1/en not_active Ceased
- 2014-04-03 JP JP2016506620A patent/JP2016516307A/ja active Pending
- 2014-04-03 KR KR1020157031590A patent/KR102079419B1/ko active Active
-
2019
- 2019-07-11 JP JP2019129253A patent/JP2019208039A/ja active Pending
-
2021
- 2021-10-14 JP JP2021168628A patent/JP7273121B2/ja active Active
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