JP2017527126A5 - - Google Patents

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Publication number
JP2017527126A5
JP2017527126A5 JP2017518606A JP2017518606A JP2017527126A5 JP 2017527126 A5 JP2017527126 A5 JP 2017527126A5 JP 2017518606 A JP2017518606 A JP 2017518606A JP 2017518606 A JP2017518606 A JP 2017518606A JP 2017527126 A5 JP2017527126 A5 JP 2017527126A5
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JP
Japan
Prior art keywords
led lamp
adhesive
substrate
lamp according
particles
Prior art date
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Application number
JP2017518606A
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English (en)
Japanese (ja)
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JP6684273B2 (ja
JP2017527126A (ja
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Priority claimed from PCT/FI2015/050454 external-priority patent/WO2015193555A1/en
Publication of JP2017527126A publication Critical patent/JP2017527126A/ja
Publication of JP2017527126A5 publication Critical patent/JP2017527126A5/ja
Application granted granted Critical
Publication of JP6684273B2 publication Critical patent/JP6684273B2/ja
Active legal-status Critical Current
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JP2017518606A 2014-06-19 2015-06-22 シロキサン粒子材料を用いたｌｅｄランプ Active JP6684273B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462014147P 2014-06-19 2014-06-19
US62/014,147 2014-06-19
FI20145604 2014-06-19
FI20145604 2014-06-19
PCT/FI2015/050454 WO2015193555A1 (en) 2014-06-19 2015-06-22 Led lamp with siloxane particle material

Publications (3)

Publication Number Publication Date
JP2017527126A JP2017527126A (ja) 2017-09-14
JP2017527126A5 true JP2017527126A5 (https=) 2018-08-02
JP6684273B2 JP6684273B2 (ja) 2020-04-22

Family

ID=54934914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017518606A Active JP6684273B2 (ja) 2014-06-19 2015-06-22 シロキサン粒子材料を用いたｌｅｄランプ

Country Status (6)

Country Link
US (1) US10658554B2 (https=)
EP (1) EP3158595B1 (https=)
JP (1) JP6684273B2 (https=)
KR (1) KR102388629B1 (https=)
CN (1) CN106605309B (https=)
WO (1) WO2015193555A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016115921B9 (de) * 2016-08-26 2024-02-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US11047747B2 (en) 2017-03-27 2021-06-29 Firouzeh Sabri Light weight flexible temperature sensor kit
CN107952464B (zh) * 2017-12-13 2020-09-11 大连理工大学 一种新型光催化材料及双光催化电极自偏压污染控制系统
DE102018132955A1 (de) * 2018-12-19 2020-06-25 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauelement
JP7250560B2 (ja) * 2019-02-20 2023-04-03 旭化成株式会社 紫外線発光装置
FR3094561B1 (fr) * 2019-03-25 2022-08-26 Commissariat Energie Atomique Procédé de fabrication d’une structure
JP7608791B2 (ja) * 2020-11-12 2025-01-07 信越化学工業株式会社 封止用接合材及び光学素子パッケージ用リッド
JP7631026B2 (ja) * 2021-02-26 2025-02-18 サカタインクス株式会社 接着剤組成物
CN120637233A (zh) * 2025-04-29 2025-09-12 杭州爱矽科技有限公司 一种SiC功率模块烧结封装方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100509933C (zh) * 2003-01-14 2009-07-08 索尼化学株式会社 硬化剂粒子、硬化剂粒子的制造方法及粘接剂
JP2004225005A (ja) 2003-01-27 2004-08-12 Shin Etsu Polymer Co Ltd ディスプレイ用粘着剤
TW200502372A (en) 2003-02-25 2005-01-16 Kaneka Corp Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
JP4614075B2 (ja) 2005-03-22 2011-01-19 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置
WO2006123772A1 (ja) * 2005-05-19 2006-11-23 Jsr Corporation ウエハ検査用シート状プローブおよびその応用
TWI422913B (zh) * 2005-08-26 2014-01-11 Konica Minolta Opto Inc A thin film and a method for manufacturing the same, and a polarizing plate and a liquid crystal display device using the same
US8173519B2 (en) * 2006-03-03 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR20090014176A (ko) * 2006-04-26 2009-02-06 세키스이가가쿠 고교가부시키가이샤 광 반도체용 열경화성 조성물, 광 반도체 소자용 다이본드재, 광 반도체 소자용 언더필재, 광 반도체 소자용밀봉제 및 광 반도체 소자
CN101432331A (zh) 2006-04-26 2009-05-13 积水化学工业株式会社 光半导体用热固化性组合物、光半导体元件用固晶材料、光半导体元件用底填材料、光半导体元件用密封剂及光半导体元件
US20100104879A1 (en) * 2007-06-26 2010-04-29 Satoshi Okano Clear hard coat film, anti-reflection film, polarizing plate and display device employing the same
JP5226326B2 (ja) * 2008-01-08 2013-07-03 帝人化成株式会社 芳香族ポリカーボネート樹脂組成物
US8044330B2 (en) 2008-01-17 2011-10-25 E.I. Du Pont De Nemours And Company Electrically conductive adhesive
US7943719B2 (en) 2008-02-28 2011-05-17 The Regents of the University of California; Encapsulation resins
JP5233325B2 (ja) * 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
WO2010000267A1 (en) 2008-06-30 2010-01-07 Hrtools A/S Method for organizing agreements between a subordinate and a superior
WO2010026714A1 (ja) 2008-09-03 2010-03-11 日本化薬株式会社 シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子
JP5558947B2 (ja) 2010-07-15 2014-07-23 キヤノン株式会社 画像形成装置
JP2012107096A (ja) 2010-11-16 2012-06-07 Kaneka Corp 熱伝導性硬化性樹脂組成物及び硬化性樹脂成形体
JP2012222202A (ja) * 2011-04-11 2012-11-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
CN103339751B (zh) 2011-11-15 2016-12-14 松下知识产权经营株式会社 发光模块以及使用该发光模块的灯
US20140353705A1 (en) * 2012-03-23 2014-12-04 Sharp Kabushiki Kaisha Semiconductor light emitting element, method of manufacturing semiconductor light emitting element, semiconductor light emitting device and substrate
US9437787B2 (en) * 2012-06-18 2016-09-06 Sharp Kabushiki Kaisha Semiconductor light emitting device
KR102183516B1 (ko) * 2012-07-05 2020-11-27 루미리즈 홀딩 비.브이. 투명한 스페이서에 의해 ｌｅｄ로부터 분리된 인광체
JP6003763B2 (ja) * 2012-10-30 2016-10-05 デクセリアルズ株式会社 熱硬化性樹脂組成物、光反射性異方性導電接着剤及び発光装置
KR20150099581A (ko) * 2012-12-26 2015-08-31 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 경화성 폴리오르가노실록산 조성물
WO2020100267A1 (ja) 2018-11-15 2020-05-22 ヤマハ発動機株式会社 鞍乗型車両走行データ処理装置および鞍乗型車両走行データ処理方法

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