JP2017517736A5 - - Google Patents
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- JP2017517736A5 JP2017517736A5 JP2016571693A JP2016571693A JP2017517736A5 JP 2017517736 A5 JP2017517736 A5 JP 2017517736A5 JP 2016571693 A JP2016571693 A JP 2016571693A JP 2016571693 A JP2016571693 A JP 2016571693A JP 2017517736 A5 JP2017517736 A5 JP 2017517736A5
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- current
- gate
- transistors
- source voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 12
- 230000005669 field effect Effects 0.000 claims 6
- 239000003990 capacitor Substances 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/300,110 | 2014-06-09 | ||
| US14/300,110 US9816872B2 (en) | 2014-06-09 | 2014-06-09 | Low power low cost temperature sensor |
| PCT/US2015/031430 WO2015191251A1 (en) | 2014-06-09 | 2015-05-18 | Low power low cost temperature sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017517736A JP2017517736A (ja) | 2017-06-29 |
| JP2017517736A5 true JP2017517736A5 (enExample) | 2018-01-25 |
| JP6374036B2 JP6374036B2 (ja) | 2018-08-15 |
Family
ID=53298609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016571693A Active JP6374036B2 (ja) | 2014-06-09 | 2015-05-18 | 低電力低コスト温度センサ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9816872B2 (enExample) |
| EP (1) | EP3152538B1 (enExample) |
| JP (1) | JP6374036B2 (enExample) |
| KR (1) | KR101908531B1 (enExample) |
| CN (1) | CN106461470B (enExample) |
| BR (1) | BR112016028619B1 (enExample) |
| WO (1) | WO2015191251A1 (enExample) |
Families Citing this family (30)
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| US10061331B2 (en) * | 2015-01-22 | 2018-08-28 | Qualcomm Incorporated | Systems and methods for detecting thermal runaway |
| CN107255529A (zh) * | 2017-06-19 | 2017-10-17 | 武汉科技大学 | 一种高精度温度传感器 |
| CN107356348B (zh) * | 2017-07-20 | 2019-07-05 | 京东方科技集团股份有限公司 | 一种温度传感器及其温度检测方法 |
| US20190025135A1 (en) * | 2017-07-24 | 2019-01-24 | Qualcomm Incorporated | Non-linearity correction technique for temperature sensor in digital power supply |
| US10578497B2 (en) * | 2017-09-17 | 2020-03-03 | Qualcomm Incorporated | Diode-based temperature sensor |
| US10539470B2 (en) | 2017-10-19 | 2020-01-21 | Qualcomm Incorporated | Sub-threshold-based semiconductor temperature sensor |
| JP6962795B2 (ja) * | 2017-11-22 | 2021-11-05 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体システム |
| US12282058B2 (en) | 2017-11-23 | 2025-04-22 | Proteantecs Ltd. | Integrated circuit pad failure detection |
| CN108061611B (zh) * | 2017-12-10 | 2019-08-09 | 北京工业大学 | 一种利用fpga嵌入式环形振荡器测量温度分布的装置和方法 |
| US20190229713A1 (en) * | 2018-01-25 | 2019-07-25 | Texas Instruments Incorporated | Temperature compensation circuit for a ring oscillator |
| TWI828676B (zh) | 2018-04-16 | 2024-01-11 | 以色列商普騰泰克斯有限公司 | 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品 |
| TWI796494B (zh) | 2018-06-19 | 2023-03-21 | 以色列商普騰泰克斯有限公司 | 高效積體電路模擬及測試 |
| US11209878B2 (en) * | 2018-07-31 | 2021-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Discrete time loop based thermal control |
| KR102623677B1 (ko) * | 2018-12-11 | 2024-01-11 | 삼성전자주식회사 | 피엠아이씨(pmic) 모델링 시스템 및 이의 구동 방법 |
| KR102100691B1 (ko) * | 2018-12-27 | 2020-04-14 | 연세대학교 산학협력단 | 캐스케이드 구조 기반의 바이어스 회로를 이용하는 전류 측정 장치 및 그 방법 |
| US11226671B2 (en) * | 2019-02-27 | 2022-01-18 | Micron Technology, Inc. | Power translator component |
| EP4004509B1 (en) * | 2019-07-29 | 2025-01-29 | Proteantecs Ltd. | On-die thermal sensing network for integrated circuits |
| US11698307B2 (en) * | 2019-12-31 | 2023-07-11 | Texas Instruments Incorporated | Methods and apparatus to trim temperature sensors |
| GB2590976B (en) | 2020-01-13 | 2022-04-20 | Nokia Technologies Oy | Semiconductor based temperature sensor |
| US12294357B2 (en) | 2020-05-25 | 2025-05-06 | Samsung Electronics Co., Ltd. | Temperature sensor circuits for integrated circuit devices |
| EP4176276A4 (en) | 2020-07-06 | 2024-08-07 | Proteantecs Ltd. | Integrated circuit margin measurement for structural testing |
| FR3116604B1 (fr) * | 2020-11-24 | 2022-10-14 | St Microelectronics Rousset | Procédé de calibrage d'un capteur de température à oscillateur en anneau |
| CN113008410B (zh) * | 2021-03-01 | 2023-02-28 | 南京邮电大学 | 用于集成电路的温度传感器 |
| TW202247610A (zh) | 2021-04-07 | 2022-12-01 | 以色列商普騰泰克斯有限公司 | 基於時脈循環時間測量的自適應頻率縮放 |
| CN115235649A (zh) * | 2021-04-25 | 2022-10-25 | 平头哥(上海)半导体技术有限公司 | 数字温度传感器 |
| CN113867468B (zh) * | 2021-10-14 | 2022-10-14 | 电子科技大学 | 一种基于mos管的低功耗、高电源抑制能力温度传感器 |
| EP4372342A1 (en) * | 2022-11-15 | 2024-05-22 | Tridonic GmbH & Co. KG | Temperature sensor calibration for electronic devices |
| US12123908B1 (en) | 2023-09-12 | 2024-10-22 | Proteantecs Ltd. | Loopback testing of integrated circuits |
| US12461143B2 (en) | 2024-01-24 | 2025-11-04 | Proteantecs Ltd. | Integrated circuit margin measurement |
| KR102689671B1 (ko) * | 2024-02-28 | 2024-07-30 | 국립한밭대학교 산학협력단 | 극저온에서 동작하는 온도 센서 |
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| JPS5816767B2 (ja) * | 1977-09-26 | 1983-04-02 | 株式会社日立製作所 | A/d変換器 |
| US4387349A (en) * | 1980-12-15 | 1983-06-07 | National Semiconductor Corporation | Low power CMOS crystal oscillator |
| GB2248151A (en) | 1990-09-24 | 1992-03-25 | Philips Electronic Associated | Temperature sensing and protection circuit. |
| US5336943A (en) | 1991-07-19 | 1994-08-09 | U.S. Philips Corporation | Temperature sensing circuit |
| US5902044A (en) * | 1997-06-27 | 1999-05-11 | International Business Machines Corporation | Integrated hot spot detector for design, analysis, and control |
| GB9716838D0 (en) | 1997-08-08 | 1997-10-15 | Philips Electronics Nv | Temperature sensing circuits |
| US5961215A (en) * | 1997-09-26 | 1999-10-05 | Advanced Micro Devices, Inc. | Temperature sensor integral with microprocessor and methods of using same |
| JPH11346143A (ja) | 1998-06-02 | 1999-12-14 | Nec Corp | リングオッシレータの制御回路及び制御方法 |
| JP3476363B2 (ja) * | 1998-06-05 | 2003-12-10 | 日本電気株式会社 | バンドギャップ型基準電圧発生回路 |
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| JP4363871B2 (ja) * | 2003-03-19 | 2009-11-11 | Okiセミコンダクタ株式会社 | 半導体装置 |
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| US7458041B2 (en) * | 2004-09-30 | 2008-11-25 | Magma Design Automation, Inc. | Circuit optimization with posynomial function F having an exponent of a first design parameter |
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| JP2007121244A (ja) * | 2005-10-31 | 2007-05-17 | Okayama Prefecture | 温度検出回路 |
| US7405552B2 (en) * | 2006-01-04 | 2008-07-29 | Micron Technology, Inc. | Semiconductor temperature sensor with high sensitivity |
| US7411436B2 (en) * | 2006-02-28 | 2008-08-12 | Cornell Research Foundation, Inc. | Self-timed thermally-aware circuits and methods of use thereof |
| JP5226248B2 (ja) * | 2006-08-02 | 2013-07-03 | ルネサスエレクトロニクス株式会社 | 温度検出回路及び半導体装置 |
| US7482858B2 (en) | 2006-12-13 | 2009-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Temperature-sensitive current source |
| JP5155717B2 (ja) | 2007-04-02 | 2013-03-06 | 高麗大学産学協力団 | 発振回路を利用した温度測定装置及び方法 |
| US7880533B2 (en) * | 2008-03-25 | 2011-02-01 | Analog Devices, Inc. | Bandgap voltage reference circuit |
| US7961033B2 (en) * | 2008-09-19 | 2011-06-14 | Cavium Networks, Inc. | DLL-based temperature sensor |
| US8502317B2 (en) * | 2009-02-06 | 2013-08-06 | Leendert Jan van den Berg | Level shifter circuits for integrated circuits |
| US7944271B2 (en) * | 2009-02-10 | 2011-05-17 | Standard Microsystems Corporation | Temperature and supply independent CMOS current source |
| US9004754B2 (en) | 2009-04-22 | 2015-04-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal sensors and methods of operating thereof |
| CN101943613B (zh) * | 2009-07-03 | 2014-07-23 | 飞思卡尔半导体公司 | 亚阈值cmos温度检测器 |
| US8275728B2 (en) * | 2009-11-05 | 2012-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Neuromorphic computer |
| TWI387736B (zh) | 2009-11-18 | 2013-03-01 | Univ Nat Changhua Education | 操作於次臨界區之低功率溫度感測器 |
| US20110169551A1 (en) * | 2010-01-08 | 2011-07-14 | Stanescu Cornel D | Temperature sensor and method |
| DE102012210263B4 (de) | 2011-11-18 | 2024-01-11 | Robert Bosch Gmbh | Batteriezelle mit einem im Batteriezellgehäuse integrierten Temperatursensor |
| US9234804B2 (en) * | 2011-12-29 | 2016-01-12 | Stmicroelectronics Asia Pacific Pte Ltd | Temperature sensor for image sensors |
| US9004756B2 (en) * | 2012-04-10 | 2015-04-14 | Freescale Semiconductor, Inc. | Temperature sensor |
| US20140061728A1 (en) * | 2012-08-29 | 2014-03-06 | Diagtronix Inc. | Gate Biasing Electrodes For FET Sensors |
| US9154079B2 (en) * | 2012-10-24 | 2015-10-06 | Qualcomm Incorporated | Threshold tracking bias voltage for mixers |
| WO2015012798A1 (en) * | 2013-07-22 | 2015-01-29 | Intel Corporation | Current-mode digital temperature sensor apparatus |
| US10033069B2 (en) | 2013-07-31 | 2018-07-24 | General Electric Company | Porous absorbent for sodium metal halide cells |
| US9939335B2 (en) * | 2014-12-17 | 2018-04-10 | Nxp Usa, Inc. | Over-temperature detector with test mode |
| US9970826B2 (en) * | 2015-03-04 | 2018-05-15 | Qualcomm Incorporated | Bipolar junction transistor voltage-drop-based temperature sensors |
| WO2017014336A1 (ko) * | 2015-07-21 | 2017-01-26 | 주식회사 실리콘웍스 | 비선형 성분이 보상된 온도 센서 회로 및 온도 센서 회로의 보상 방법 |
-
2014
- 2014-06-09 US US14/300,110 patent/US9816872B2/en active Active
-
2015
- 2015-05-18 CN CN201580030369.XA patent/CN106461470B/zh active Active
- 2015-05-18 BR BR112016028619-7A patent/BR112016028619B1/pt active IP Right Grant
- 2015-05-18 JP JP2016571693A patent/JP6374036B2/ja active Active
- 2015-05-18 WO PCT/US2015/031430 patent/WO2015191251A1/en not_active Ceased
- 2015-05-18 KR KR1020167034080A patent/KR101908531B1/ko active Active
- 2015-05-18 EP EP15727511.6A patent/EP3152538B1/en active Active
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