KR101908531B1 - 저전력 저비용 온도 센서 - Google Patents
저전력 저비용 온도 센서 Download PDFInfo
- Publication number
- KR101908531B1 KR101908531B1 KR1020167034080A KR20167034080A KR101908531B1 KR 101908531 B1 KR101908531 B1 KR 101908531B1 KR 1020167034080 A KR1020167034080 A KR 1020167034080A KR 20167034080 A KR20167034080 A KR 20167034080A KR 101908531 B1 KR101908531 B1 KR 101908531B1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
- G01K7/015—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions using microstructures, e.g. made of silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/005—Calibration
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/300,110 | 2014-06-09 | ||
| US14/300,110 US9816872B2 (en) | 2014-06-09 | 2014-06-09 | Low power low cost temperature sensor |
| PCT/US2015/031430 WO2015191251A1 (en) | 2014-06-09 | 2015-05-18 | Low power low cost temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170012293A KR20170012293A (ko) | 2017-02-02 |
| KR101908531B1 true KR101908531B1 (ko) | 2018-10-16 |
Family
ID=53298609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167034080A Active KR101908531B1 (ko) | 2014-06-09 | 2015-05-18 | 저전력 저비용 온도 센서 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9816872B2 (enExample) |
| EP (1) | EP3152538B1 (enExample) |
| JP (1) | JP6374036B2 (enExample) |
| KR (1) | KR101908531B1 (enExample) |
| CN (1) | CN106461470B (enExample) |
| BR (1) | BR112016028619B1 (enExample) |
| WO (1) | WO2015191251A1 (enExample) |
Families Citing this family (30)
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| US10061331B2 (en) * | 2015-01-22 | 2018-08-28 | Qualcomm Incorporated | Systems and methods for detecting thermal runaway |
| CN107255529A (zh) * | 2017-06-19 | 2017-10-17 | 武汉科技大学 | 一种高精度温度传感器 |
| CN107356348B (zh) * | 2017-07-20 | 2019-07-05 | 京东方科技集团股份有限公司 | 一种温度传感器及其温度检测方法 |
| US20190025135A1 (en) * | 2017-07-24 | 2019-01-24 | Qualcomm Incorporated | Non-linearity correction technique for temperature sensor in digital power supply |
| US10578497B2 (en) * | 2017-09-17 | 2020-03-03 | Qualcomm Incorporated | Diode-based temperature sensor |
| US10539470B2 (en) | 2017-10-19 | 2020-01-21 | Qualcomm Incorporated | Sub-threshold-based semiconductor temperature sensor |
| JP6962795B2 (ja) * | 2017-11-22 | 2021-11-05 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体システム |
| US12282058B2 (en) | 2017-11-23 | 2025-04-22 | Proteantecs Ltd. | Integrated circuit pad failure detection |
| CN108061611B (zh) * | 2017-12-10 | 2019-08-09 | 北京工业大学 | 一种利用fpga嵌入式环形振荡器测量温度分布的装置和方法 |
| US20190229713A1 (en) * | 2018-01-25 | 2019-07-25 | Texas Instruments Incorporated | Temperature compensation circuit for a ring oscillator |
| TWI828676B (zh) | 2018-04-16 | 2024-01-11 | 以色列商普騰泰克斯有限公司 | 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品 |
| US11132485B2 (en) | 2018-06-19 | 2021-09-28 | Proteantecs Ltd. | Efficient integrated circuit simulation and testing |
| US11209878B2 (en) * | 2018-07-31 | 2021-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Discrete time loop based thermal control |
| KR102623677B1 (ko) * | 2018-12-11 | 2024-01-11 | 삼성전자주식회사 | 피엠아이씨(pmic) 모델링 시스템 및 이의 구동 방법 |
| KR102100691B1 (ko) * | 2018-12-27 | 2020-04-14 | 연세대학교 산학협력단 | 캐스케이드 구조 기반의 바이어스 회로를 이용하는 전류 측정 장치 및 그 방법 |
| US11226671B2 (en) * | 2019-02-27 | 2022-01-18 | Micron Technology, Inc. | Power translator component |
| CN114430803A (zh) * | 2019-07-29 | 2022-05-03 | 普罗泰克斯公司 | 用于集成电路的管芯上热感测网络 |
| US11698307B2 (en) * | 2019-12-31 | 2023-07-11 | Texas Instruments Incorporated | Methods and apparatus to trim temperature sensors |
| GB2590976B (en) | 2020-01-13 | 2022-04-20 | Nokia Technologies Oy | Semiconductor based temperature sensor |
| US11515871B2 (en) | 2020-05-25 | 2022-11-29 | Mavagail Technology, LLC | Temperature sensor circuits for integrated circuit devices |
| KR20230029991A (ko) | 2020-07-06 | 2023-03-03 | 프로틴텍스 엘티디. | 구조 테스팅을 위한 집적 회로 마진 측정 |
| FR3116604B1 (fr) * | 2020-11-24 | 2022-10-14 | St Microelectronics Rousset | Procédé de calibrage d'un capteur de température à oscillateur en anneau |
| CN113008410B (zh) * | 2021-03-01 | 2023-02-28 | 南京邮电大学 | 用于集成电路的温度传感器 |
| CN117222960A (zh) | 2021-04-07 | 2023-12-12 | 普腾泰克斯有限公司 | 基于时钟循环时间测量的自适应频率缩放 |
| CN115235649A (zh) * | 2021-04-25 | 2022-10-25 | 平头哥(上海)半导体技术有限公司 | 数字温度传感器 |
| CN113867468B (zh) * | 2021-10-14 | 2022-10-14 | 电子科技大学 | 一种基于mos管的低功耗、高电源抑制能力温度传感器 |
| EP4372342A1 (en) * | 2022-11-15 | 2024-05-22 | Tridonic GmbH & Co. KG | Temperature sensor calibration for electronic devices |
| US12123908B1 (en) | 2023-09-12 | 2024-10-22 | Proteantecs Ltd. | Loopback testing of integrated circuits |
| US12461143B2 (en) | 2024-01-24 | 2025-11-04 | Proteantecs Ltd. | Integrated circuit margin measurement |
| KR102689671B1 (ko) * | 2024-02-28 | 2024-07-30 | 국립한밭대학교 산학협력단 | 극저온에서 동작하는 온도 센서 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121244A (ja) * | 2005-10-31 | 2007-05-17 | Okayama Prefecture | 温度検出回路 |
Family Cites Families (39)
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| JPS5816767B2 (ja) * | 1977-09-26 | 1983-04-02 | 株式会社日立製作所 | A/d変換器 |
| US4387349A (en) * | 1980-12-15 | 1983-06-07 | National Semiconductor Corporation | Low power CMOS crystal oscillator |
| GB2248151A (en) | 1990-09-24 | 1992-03-25 | Philips Electronic Associated | Temperature sensing and protection circuit. |
| US5336943A (en) | 1991-07-19 | 1994-08-09 | U.S. Philips Corporation | Temperature sensing circuit |
| US5902044A (en) * | 1997-06-27 | 1999-05-11 | International Business Machines Corporation | Integrated hot spot detector for design, analysis, and control |
| GB9716838D0 (en) | 1997-08-08 | 1997-10-15 | Philips Electronics Nv | Temperature sensing circuits |
| US5961215A (en) * | 1997-09-26 | 1999-10-05 | Advanced Micro Devices, Inc. | Temperature sensor integral with microprocessor and methods of using same |
| JPH11346143A (ja) | 1998-06-02 | 1999-12-14 | Nec Corp | リングオッシレータの制御回路及び制御方法 |
| JP3476363B2 (ja) * | 1998-06-05 | 2003-12-10 | 日本電気株式会社 | バンドギャップ型基準電圧発生回路 |
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| GB2393867B (en) | 2002-10-01 | 2006-09-20 | Wolfson Ltd | Temperature sensing apparatus and methods |
| JP4363871B2 (ja) * | 2003-03-19 | 2009-11-11 | Okiセミコンダクタ株式会社 | 半導体装置 |
| US7737871B2 (en) * | 2004-06-03 | 2010-06-15 | Silicon Laboratories Inc. | MCU with integrated voltage isolator to provide a galvanic isolation between input and output |
| US7458041B2 (en) * | 2004-09-30 | 2008-11-25 | Magma Design Automation, Inc. | Circuit optimization with posynomial function F having an exponent of a first design parameter |
| JP4768339B2 (ja) * | 2005-07-15 | 2011-09-07 | 株式会社リコー | 温度検出回路およびそれを用いた発振周波数補正装置 |
| US7405552B2 (en) * | 2006-01-04 | 2008-07-29 | Micron Technology, Inc. | Semiconductor temperature sensor with high sensitivity |
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| JP5226248B2 (ja) * | 2006-08-02 | 2013-07-03 | ルネサスエレクトロニクス株式会社 | 温度検出回路及び半導体装置 |
| US7482858B2 (en) | 2006-12-13 | 2009-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Temperature-sensitive current source |
| US7914204B2 (en) | 2007-04-02 | 2011-03-29 | Korea University Industrial & Academic Collaboration Foundation | Apparatus and method for measurement of temperature using oscillators |
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| US9234804B2 (en) * | 2011-12-29 | 2016-01-12 | Stmicroelectronics Asia Pacific Pte Ltd | Temperature sensor for image sensors |
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| US10033069B2 (en) | 2013-07-31 | 2018-07-24 | General Electric Company | Porous absorbent for sodium metal halide cells |
| US9939335B2 (en) * | 2014-12-17 | 2018-04-10 | Nxp Usa, Inc. | Over-temperature detector with test mode |
| US9970826B2 (en) * | 2015-03-04 | 2018-05-15 | Qualcomm Incorporated | Bipolar junction transistor voltage-drop-based temperature sensors |
| WO2017014336A1 (ko) * | 2015-07-21 | 2017-01-26 | 주식회사 실리콘웍스 | 비선형 성분이 보상된 온도 센서 회로 및 온도 센서 회로의 보상 방법 |
-
2014
- 2014-06-09 US US14/300,110 patent/US9816872B2/en active Active
-
2015
- 2015-05-18 KR KR1020167034080A patent/KR101908531B1/ko active Active
- 2015-05-18 WO PCT/US2015/031430 patent/WO2015191251A1/en not_active Ceased
- 2015-05-18 JP JP2016571693A patent/JP6374036B2/ja active Active
- 2015-05-18 CN CN201580030369.XA patent/CN106461470B/zh active Active
- 2015-05-18 BR BR112016028619-7A patent/BR112016028619B1/pt active IP Right Grant
- 2015-05-18 EP EP15727511.6A patent/EP3152538B1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121244A (ja) * | 2005-10-31 | 2007-05-17 | Okayama Prefecture | 温度検出回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106461470B (zh) | 2019-07-02 |
| JP2017517736A (ja) | 2017-06-29 |
| JP6374036B2 (ja) | 2018-08-15 |
| WO2015191251A1 (en) | 2015-12-17 |
| KR20170012293A (ko) | 2017-02-02 |
| BR112016028619A2 (pt) | 2017-08-22 |
| EP3152538A1 (en) | 2017-04-12 |
| CN106461470A (zh) | 2017-02-22 |
| US20150355033A1 (en) | 2015-12-10 |
| BR112016028619B1 (pt) | 2022-07-12 |
| EP3152538B1 (en) | 2019-10-16 |
| US9816872B2 (en) | 2017-11-14 |
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Patent event date: 20161205 Patent event code: PA01051R01D Comment text: International Patent Application |
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