JP2017509733A - 選択的に粘着性除去された接着剤を用いる品物、組成物、システム、及び方法 - Google Patents

選択的に粘着性除去された接着剤を用いる品物、組成物、システム、及び方法 Download PDF

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Publication number
JP2017509733A
JP2017509733A JP2016545838A JP2016545838A JP2017509733A JP 2017509733 A JP2017509733 A JP 2017509733A JP 2016545838 A JP2016545838 A JP 2016545838A JP 2016545838 A JP2016545838 A JP 2016545838A JP 2017509733 A JP2017509733 A JP 2017509733A
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JP
Japan
Prior art keywords
adhesive
radiant energy
laminate
label
layer
Prior art date
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Ceased
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JP2016545838A
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English (en)
Japanese (ja)
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JP2017509733A5 (enExample
Inventor
デ・ブル，ロベルト・ハー
ヘイコックス，ロナルド
ヤンコ，パベル
ホイットマン，デイビッド・ダブリュ
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Avery Dennison Corp
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Avery Dennison Corp
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Publication of JP2017509733A publication Critical patent/JP2017509733A/ja
Publication of JP2017509733A5 publication Critical patent/JP2017509733A5/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K5/00—Irradiation devices
    • G21K5/02—Irradiation devices having no beam-forming means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/334—Applications of adhesives in processes or use of adhesives in the form of films or foils as a label
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2016545838A 2014-01-08 2014-12-30 選択的に粘着性除去された接着剤を用いる品物、組成物、システム、及び方法 Ceased JP2017509733A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461924900P 2014-01-08 2014-01-08
US61/924,900 2014-01-08
US201462063131P 2014-10-13 2014-10-13
US62/063,131 2014-10-13
PCT/US2014/072640 WO2015105708A1 (en) 2014-01-08 2014-12-30 Articles, compositions, systems, and methods using selectively detackified adhesives

Publications (2)

Publication Number Publication Date
JP2017509733A true JP2017509733A (ja) 2017-04-06
JP2017509733A5 JP2017509733A5 (enExample) 2017-12-28

Family

ID=52347483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016545838A Ceased JP2017509733A (ja) 2014-01-08 2014-12-30 選択的に粘着性除去された接着剤を用いる品物、組成物、システム、及び方法

Country Status (9)

Country Link
US (6) US9458358B2 (enExample)
EP (1) EP3092279A1 (enExample)
JP (1) JP2017509733A (enExample)
KR (1) KR20160106675A (enExample)
CN (1) CN106103620A (enExample)
AU (2) AU2014376158B2 (enExample)
BR (1) BR112016015973A2 (enExample)
CA (1) CA2936181A1 (enExample)
WO (1) WO2015105708A1 (enExample)

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US8864708B1 (en) 2010-12-03 2014-10-21 Medical Device Engineering, LLC. Tamper indicating closure assembly
AU2014376158B2 (en) 2014-01-08 2018-05-31 Avery Dennison Corporation Articles, compositions, systems, and methods using selectively detackified adhesives
US10912898B1 (en) 2014-02-03 2021-02-09 Medical Device Engineering Llc Tamper evident cap for medical fitting
US10207099B1 (en) 2014-02-21 2019-02-19 Patrick Vitello Closure assembly for medical fitting
US10300263B1 (en) 2015-02-27 2019-05-28 Timothy Brandon Hunt Closure assembly for a medical connector
US10166343B1 (en) 2015-03-13 2019-01-01 Timothy Brandon Hunt Noise evident tamper cap
US10315024B1 (en) 2015-03-19 2019-06-11 Patick Vitello Torque limiting closure assembly
US11597856B2 (en) * 2015-12-29 2023-03-07 3M Innovative Properties Company Continuous additive manufacturing methods
JP6655406B2 (ja) * 2016-01-27 2020-02-26 藤森工業株式会社 ラベル、ラベルの製造方法、ラベルの使用方法
MX2018010175A (es) * 2016-02-22 2019-01-21 Avery Dennison Corp Etiqueta adhesiva de contenido extendido clara con adhesivo de adherencia selectivamente reducida.
US10307548B1 (en) * 2016-12-14 2019-06-04 Timothy Brandon Hunt Tracking system and method for medical devices
US11097071B1 (en) 2016-12-14 2021-08-24 International Medical Industries Inc. Tamper evident assembly
US10953162B1 (en) 2016-12-28 2021-03-23 Timothy Brandon Hunt Tamper evident closure assembly
US10758684B1 (en) 2017-03-03 2020-09-01 Jonathan J. Vitello Tamper evident assembly
US11040149B1 (en) 2017-03-30 2021-06-22 International Medical Industries Tamper evident closure assembly for a medical device
US10888672B1 (en) 2017-04-06 2021-01-12 International Medical Industries, Inc. Tamper evident closure assembly for a medical device
US10898659B1 (en) 2017-05-19 2021-01-26 International Medical Industries Inc. System for handling and dispensing a plurality of products
US10933202B1 (en) 2017-05-19 2021-03-02 International Medical Industries Inc. Indicator member of low strength resistance for a tamper evident closure
US11541180B1 (en) 2017-12-21 2023-01-03 Patrick Vitello Closure assembly having a snap-fit construction
US11278681B1 (en) 2018-02-20 2022-03-22 Robert Banik Tamper evident adaptor closure
US11413406B1 (en) 2018-03-05 2022-08-16 Jonathan J. Vitello Tamper evident assembly
US12151491B2 (en) 2018-06-26 2024-11-26 3M Innovative Properties Company Edge detackification and decoration of adhesive tape rolls
US11779520B1 (en) 2018-07-02 2023-10-10 Patrick Vitello Closure for a medical dispenser including a one-piece tip cap
US11857751B1 (en) 2018-07-02 2024-01-02 International Medical Industries Inc. Assembly for a medical connector
US11793987B1 (en) 2018-07-02 2023-10-24 Patrick Vitello Flex tec closure assembly for a medical dispenser
US11690994B1 (en) 2018-07-13 2023-07-04 Robert Banik Modular medical connector
US11426328B1 (en) 2018-08-31 2022-08-30 Alexander Ollmann Closure for a medical container
CN110938386B (zh) * 2018-09-25 2022-06-28 上海和辉光电股份有限公司 一种薄膜封装结构保护膜及其褪膜方法
USD948713S1 (en) 2019-09-03 2022-04-12 International Medical Industries, Inc. Asymmetrical self righting tip cap
US11471610B1 (en) 2018-10-18 2022-10-18 Robert Banik Asymmetrical closure for a medical device
USD903865S1 (en) 2018-11-19 2020-12-01 International Medical Industries, Inc. Self-righting tip cap
US11911339B1 (en) 2019-08-15 2024-02-27 Peter Lehel Universal additive port cap
US11697527B1 (en) 2019-09-11 2023-07-11 Logan Hendren Tamper evident closure assembly
US11357588B1 (en) 2019-11-25 2022-06-14 Patrick Vitello Needle packaging and disposal assembly
US11904149B1 (en) 2020-02-18 2024-02-20 Jonathan Vitello Oral tamper evident closure with retained indicator
US11523970B1 (en) 2020-08-28 2022-12-13 Jonathan Vitello Tamper evident shield
US12070591B1 (en) 2020-12-14 2024-08-27 Patrick Vitello Snap action tamper evident closure assembly
US11872187B1 (en) 2020-12-28 2024-01-16 Jonathan Vitello Tamper evident seal for a vial cover
US12172803B1 (en) 2021-10-04 2024-12-24 Patrick Vitello Tamper evident integrated closure
CN115233839B (zh) * 2022-06-09 2023-06-23 科顺防水科技股份有限公司 预铺防水卷材

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US20190010365A1 (en) 2019-01-10
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US9683136B2 (en) 2017-06-20
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US20150191633A1 (en) 2015-07-09
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