JP2017509500A5 - - Google Patents

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Publication number
JP2017509500A5
JP2017509500A5 JP2016558346A JP2016558346A JP2017509500A5 JP 2017509500 A5 JP2017509500 A5 JP 2017509500A5 JP 2016558346 A JP2016558346 A JP 2016558346A JP 2016558346 A JP2016558346 A JP 2016558346A JP 2017509500 A5 JP2017509500 A5 JP 2017509500A5
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JP
Japan
Prior art keywords
protrusions
cmp
elongated
front surface
conditioning segment
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JP2016558346A
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English (en)
Japanese (ja)
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JP6542793B2 (ja
JP2017509500A (ja
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Priority claimed from PCT/US2015/021679 external-priority patent/WO2015143278A1/en
Publication of JP2017509500A publication Critical patent/JP2017509500A/ja
Publication of JP2017509500A5 publication Critical patent/JP2017509500A5/ja
Application granted granted Critical
Publication of JP6542793B2 publication Critical patent/JP6542793B2/ja
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JP2016558346A 2014-03-21 2015-03-20 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ Active JP6542793B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21
PCT/US2015/021679 WO2015143278A1 (en) 2014-03-21 2015-03-20 Chemical mechanical planarization pad conditioner with elongated cutting edges

Publications (3)

Publication Number Publication Date
JP2017509500A JP2017509500A (ja) 2017-04-06
JP2017509500A5 true JP2017509500A5 (cg-RX-API-DMAC7.html) 2018-05-10
JP6542793B2 JP6542793B2 (ja) 2019-07-10

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ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016558346A Active JP6542793B2 (ja) 2014-03-21 2015-03-20 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ

Country Status (6)

Country Link
US (1) US10293463B2 (cg-RX-API-DMAC7.html)
JP (1) JP6542793B2 (cg-RX-API-DMAC7.html)
KR (1) KR102304574B1 (cg-RX-API-DMAC7.html)
CN (1) CN106463379B (cg-RX-API-DMAC7.html)
TW (1) TWI666091B (cg-RX-API-DMAC7.html)
WO (1) WO2015143278A1 (cg-RX-API-DMAC7.html)

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US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
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US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12208487B2 (en) 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
CN113439010B (zh) 2019-02-13 2024-08-27 3M创新有限公司 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法
JP7368492B2 (ja) * 2019-04-09 2023-10-24 インテグリス・インコーポレーテッド ディスクのセグメント設計
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner

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CN110328616A (zh) 2012-05-04 2019-10-15 恩特格里斯公司 具有超硬磨料增强的化学机械平坦化修整器衬垫
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