TWI666091B - 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 - Google Patents

化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 Download PDF

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Publication number
TWI666091B
TWI666091B TW104109176A TW104109176A TWI666091B TW I666091 B TWI666091 B TW I666091B TW 104109176 A TW104109176 A TW 104109176A TW 104109176 A TW104109176 A TW 104109176A TW I666091 B TWI666091 B TW I666091B
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TW
Taiwan
Prior art keywords
elongated
protrusions
elongated protrusions
chemical mechanical
substrate
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TW104109176A
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English (en)
Chinese (zh)
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TW201600241A (zh
Inventor
安德魯 葛平
丹尼爾 威爾斯
Original Assignee
美商恩特葛瑞斯股份有限公司
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Publication of TW201600241A publication Critical patent/TW201600241A/zh
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Publication of TWI666091B publication Critical patent/TWI666091B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW104109176A 2014-03-21 2015-03-23 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器 TWI666091B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461968846P 2014-03-21 2014-03-21
US61/968,846 2014-03-21

Publications (2)

Publication Number Publication Date
TW201600241A TW201600241A (zh) 2016-01-01
TWI666091B true TWI666091B (zh) 2019-07-21

Family

ID=54145367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104109176A TWI666091B (zh) 2014-03-21 2015-03-23 化學機械硏磨調節段及其製造方法，以及化學機械硏磨墊調節器

Country Status (6)

Country Link
US (1) US10293463B2 (cg-RX-API-DMAC7.html)
JP (1) JP6542793B2 (cg-RX-API-DMAC7.html)
KR (1) KR102304574B1 (cg-RX-API-DMAC7.html)
CN (1) CN106463379B (cg-RX-API-DMAC7.html)
TW (1) TWI666091B (cg-RX-API-DMAC7.html)
WO (1) WO2015143278A1 (cg-RX-API-DMAC7.html)

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US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
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US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
US12208487B2 (en) 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
CN113439010B (zh) 2019-02-13 2024-08-27 3M创新有限公司 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法
JP7368492B2 (ja) * 2019-04-09 2023-10-24 インテグリス・インコーポレーテッド ディスクのセグメント設計
US11524385B2 (en) * 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
US12370648B2 (en) * 2020-01-30 2025-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Surface clean system and method
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
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Also Published As

Publication number Publication date
CN106463379B (zh) 2019-08-06
CN106463379A (zh) 2017-02-22
JP6542793B2 (ja) 2019-07-10
US10293463B2 (en) 2019-05-21
KR20160136404A (ko) 2016-11-29
JP2017509500A (ja) 2017-04-06
US20170095903A1 (en) 2017-04-06
WO2015143278A1 (en) 2015-09-24
KR102304574B1 (ko) 2021-09-27
TW201600241A (zh) 2016-01-01

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