JP2014510645A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014510645A5 JP2014510645A5 JP2013557810A JP2013557810A JP2014510645A5 JP 2014510645 A5 JP2014510645 A5 JP 2014510645A5 JP 2013557810 A JP2013557810 A JP 2013557810A JP 2013557810 A JP2013557810 A JP 2013557810A JP 2014510645 A5 JP2014510645 A5 JP 2014510645A5
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- pad conditioner
- mechanical polishing
- chemical mechanical
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 15
- 239000000126 substance Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 12
- 239000011248 coating agent Substances 0.000 claims 5
- 238000000576 coating method Methods 0.000 claims 5
- 229910003460 diamond Inorganic materials 0.000 claims 4
- 239000010432 diamond Substances 0.000 claims 4
- 239000011148 porous material Substances 0.000 claims 4
- 230000005484 gravity Effects 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161449851P | 2011-03-07 | 2011-03-07 | |
| US61/449,851 | 2011-03-07 | ||
| US201161506483P | 2011-07-11 | 2011-07-11 | |
| US61/506,483 | 2011-07-11 | ||
| US201161513294P | 2011-07-29 | 2011-07-29 | |
| US61/513,294 | 2011-07-29 | ||
| PCT/US2012/027916 WO2012122186A2 (en) | 2011-03-07 | 2012-03-06 | Chemical mechanical planarization pad conditioner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014510645A JP2014510645A (ja) | 2014-05-01 |
| JP2014510645A5 true JP2014510645A5 (cg-RX-API-DMAC7.html) | 2015-04-23 |
| JP6133218B2 JP6133218B2 (ja) | 2017-05-24 |
Family
ID=46798753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557810A Active JP6133218B2 (ja) | 2011-03-07 | 2012-03-06 | 化学機械平坦化パッドコンディショナー |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9132526B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2684211B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6133218B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101916492B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103688343B (cg-RX-API-DMAC7.html) |
| SG (1) | SG193340A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI592258B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012122186A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
| SG193340A1 (en) * | 2011-03-07 | 2013-10-30 | Entegris Inc | Chemical mechanical planarization pad conditioner |
| KR101144981B1 (ko) * | 2011-05-17 | 2012-05-11 | 삼성전자주식회사 | Cmp 패드 컨디셔너 및 상기 cmp 패드 컨디셔너 제조방법 |
| KR101339722B1 (ko) * | 2011-07-18 | 2013-12-10 | 이화다이아몬드공업 주식회사 | Cmp 패드 컨디셔너 |
| WO2014022465A1 (en) * | 2012-08-02 | 2014-02-06 | 3M Innovative Properties Company | Abrasive articles with precisely shaped features and method of making thereof |
| USD743456S1 (en) | 2012-09-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| USD737873S1 (en) | 2012-09-26 | 2015-09-01 | Ebara Corporation | Dresser disk |
| TWD160526S (zh) | 2012-09-26 | 2014-05-11 | 荏原製作所股份有限公司 | 修整器碟片用修整塊 |
| KR101392401B1 (ko) * | 2012-11-30 | 2014-05-07 | 이화다이아몬드공업 주식회사 | 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법 |
| US20140295740A1 (en) * | 2013-03-26 | 2014-10-02 | HGST Netherlands B.V. | Ultra fine lapping substrate through use of hard coated material on lapping kinematics |
| USD743455S1 (en) | 2013-03-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| WO2015006742A1 (en) * | 2013-07-11 | 2015-01-15 | Entegris, Inc. | Coated cmp retaining ring |
| TWI580524B (zh) * | 2014-02-18 | 2017-05-01 | 中國砂輪企業股份有限公司 | 高性能化學機械研磨修整器及其製作方法 |
| JP6542793B2 (ja) * | 2014-03-21 | 2019-07-10 | インテグリス・インコーポレーテッド | 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ |
| TW201538276A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 非等高度之化學機械研磨修整器 |
| TW201538275A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 平坦化之化學機械研磨修整器 |
| TWI546159B (zh) * | 2014-04-11 | 2016-08-21 | 中國砂輪企業股份有限公司 | 可控制研磨深度之化學機械研磨修整器 |
| CN105364715A (zh) * | 2014-08-11 | 2016-03-02 | 兆远科技股份有限公司 | 抛光修整器 |
| DE102015220090B4 (de) * | 2015-01-14 | 2021-02-18 | Siltronic Ag | Verfahren zum Abrichten von Poliertüchern |
| JP6453666B2 (ja) * | 2015-02-20 | 2019-01-16 | 東芝メモリ株式会社 | 研磨パッドドレッサの作製方法 |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
| TWI595973B (zh) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
| TWI623382B (zh) * | 2015-10-27 | 2018-05-11 | 中國砂輪企業股份有限公司 | Hybrid chemical mechanical polishing dresser |
| WO2017146678A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| WO2017146677A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| JP2018032745A (ja) * | 2016-08-24 | 2018-03-01 | 東芝メモリ株式会社 | ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法 |
| KR102394462B1 (ko) * | 2016-09-06 | 2022-05-03 | 타츠타 전선 주식회사 | 전자파 실드 필름 |
| US10471567B2 (en) | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| AU201712278S (en) | 2016-10-21 | 2017-06-06 | 3M Innovative Properties Co | Trapezoidal structured abrasive article |
| US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
| TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
| CN111032284B (zh) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| US10269574B1 (en) | 2017-10-03 | 2019-04-23 | Mattson Technology, Inc. | Surface treatment of carbon containing films using organic radicals |
| US10857651B2 (en) * | 2017-11-20 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus of chemical mechanical polishing and operating method thereof |
| US10654150B2 (en) * | 2017-12-26 | 2020-05-19 | Industrial Technology Research Institute | Grinding disk and method of manufacturing the same |
| WO2019154630A1 (en) * | 2018-02-06 | 2019-08-15 | Asml Netherlands B.V. | System, device and method for reconditioning a substrate support |
| US20190351527A1 (en) * | 2018-05-17 | 2019-11-21 | Entegris, Inc. | Conditioner for chemical-mechanical-planarization pad and related methods |
| US11806833B2 (en) | 2018-08-31 | 2023-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical planarization system and a method of using the same |
| SG11202101908TA (en) * | 2018-08-31 | 2021-03-30 | Best Engineered Surface Technologies Llc | Hybrid cmp conditioning head |
| CN112313777B (zh) | 2018-10-15 | 2024-08-27 | 玛特森技术公司 | 用于使用臭氧选择性亲水表面处理的方法 |
| US10950416B2 (en) | 2018-11-16 | 2021-03-16 | Mattson Technology, Inc. | Chamber seasoning to improve etch uniformity by reducing chemistry |
| US10403492B1 (en) | 2018-12-11 | 2019-09-03 | Mattson Technology, Inc. | Integration of materials removal and surface treatment in semiconductor device fabrication |
| CN113439010B (zh) * | 2019-02-13 | 2024-08-27 | 3M创新有限公司 | 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法 |
| KR102156997B1 (ko) * | 2019-03-11 | 2020-09-16 | 한양대학교 에리카산학협력단 | Cmp 패드 컨디셔너 및 그 동작 방법 |
| JP7368492B2 (ja) * | 2019-04-09 | 2023-10-24 | インテグリス・インコーポレーテッド | ディスクのセグメント設計 |
| CN110722456A (zh) * | 2019-10-14 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种抛光垫修整设备和方法 |
| TWI859404B (zh) * | 2020-01-30 | 2024-10-21 | 台灣積體電路製造股份有限公司 | 可攜式清潔裝置 |
| TWI738304B (zh) | 2020-04-23 | 2021-09-01 | 台灣積體電路製造股份有限公司 | 半導體晶圓加工方法及清潔刷頭 |
| CN113050384B (zh) * | 2020-04-23 | 2025-02-18 | 台湾积体电路制造股份有限公司 | 半导体晶圆加工方法及清洁刷头 |
| WO2021262602A1 (en) * | 2020-06-26 | 2021-12-30 | Applied Materials, Inc. | Conditioner disk for use on soft or 3d printed pads during cmp |
| TWI768692B (zh) * | 2021-02-01 | 2022-06-21 | 中國砂輪企業股份有限公司 | 化學機械研磨拋光墊修整器及其製造方法 |
| CN113199400A (zh) * | 2021-05-25 | 2021-08-03 | 宁波江丰电子材料股份有限公司 | 一种化学机械研磨抛光垫整修器及其制备方法 |
| WO2023055649A1 (en) * | 2021-09-29 | 2023-04-06 | Entegris, Inc. | Double-sided pad conditioner |
| US20250050460A1 (en) * | 2021-12-31 | 2025-02-13 | 3M Innovative Properties Company | Pad conditioning brush |
| TWI845078B (zh) * | 2022-12-20 | 2024-06-11 | 宋健民 | 一種單晶金字塔鑽石碟 |
| KR102876400B1 (ko) * | 2023-04-24 | 2025-10-24 | 새솔다이아몬드공업 주식회사 | 패드 컨디셔너 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4706416A (en) * | 1987-01-12 | 1987-11-17 | Kottas Robert P | Tool for removing residues |
| US5186973A (en) | 1990-09-13 | 1993-02-16 | Diamonex, Incorporated | HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films |
| CA2081631A1 (en) | 1991-10-30 | 1993-05-01 | Cornelius Phaal | Tool insert |
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| US9199357B2 (en) * | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6054183A (en) | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
| JPH1158232A (ja) * | 1997-08-26 | 1999-03-02 | Toshiba Ceramics Co Ltd | ドレッシング工具及びその製造方法 |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| KR19990081117A (ko) * | 1998-04-25 | 1999-11-15 | 윤종용 | 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법 |
| KR100387954B1 (ko) * | 1999-10-12 | 2003-06-19 | (주) 휴네텍 | 연마패드용 컨디셔너와 이의 제조방법 |
| US6439986B1 (en) * | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
| US7201645B2 (en) * | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
| US6419553B2 (en) * | 2000-01-04 | 2002-07-16 | Rodel Holdings, Inc. | Methods for break-in and conditioning a fixed abrasive polishing pad |
| US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| US6632127B1 (en) | 2001-03-07 | 2003-10-14 | Jerry W. Zimmer | Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same |
| US20020182401A1 (en) | 2001-06-01 | 2002-12-05 | Lawing Andrew Scott | Pad conditioner with uniform particle height |
| JP2003053665A (ja) | 2001-08-10 | 2003-02-26 | Mitsubishi Materials Corp | ドレッサー |
| JP3744877B2 (ja) * | 2002-04-15 | 2006-02-15 | 株式会社ノリタケスーパーアブレーシブ | Cmp加工用ドレッサ |
| US6872127B2 (en) * | 2002-07-11 | 2005-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd | Polishing pad conditioning disks for chemical mechanical polisher |
| KR20050075280A (ko) | 2002-11-19 | 2005-07-20 | 가부시키가이샤 이시카와 세이사쿠쇼 | 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판 |
| JP4277553B2 (ja) * | 2003-01-15 | 2009-06-10 | 三菱マテリアル株式会社 | 軟質材加工用工具 |
| US20050025973A1 (en) | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| US7799375B2 (en) | 2004-06-30 | 2010-09-21 | Poco Graphite, Inc. | Process for the manufacturing of dense silicon carbide |
| KR100636793B1 (ko) | 2004-12-13 | 2006-10-23 | 이화다이아몬드공업 주식회사 | Cmp 패드용 컨디셔너 |
| US9138862B2 (en) * | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8678878B2 (en) * | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| KR100723436B1 (ko) | 2005-12-29 | 2007-05-30 | 삼성전자주식회사 | 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치 |
| US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
| CN101903131B (zh) * | 2007-11-13 | 2013-01-02 | 宋健民 | Cmp垫修整器 |
| CN102341215B (zh) * | 2009-03-24 | 2014-06-18 | 圣戈班磨料磨具有限公司 | 用作化学机械平坦化垫修整器的研磨工具 |
| SG176629A1 (en) * | 2009-06-02 | 2012-01-30 | Saint Gobain Abrasives Inc | Corrosion-resistant cmp conditioning tools and methods for making and using same |
| KR101091030B1 (ko) | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
| JP5871904B2 (ja) | 2010-04-12 | 2016-03-01 | イコニクス コーポレーションIkonics Corporation | アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 |
| TW201246342A (en) * | 2010-12-13 | 2012-11-16 | Saint Gobain Abrasives Inc | Chemical mechanical planarization (CMP) pad conditioner and method of making |
| US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
| SG193340A1 (en) * | 2011-03-07 | 2013-10-30 | Entegris Inc | Chemical mechanical planarization pad conditioner |
| CN103329253B (zh) * | 2011-05-23 | 2016-03-30 | 宋健民 | 具有平坦化尖端的化学机械研磨垫修整器 |
| CN110328616A (zh) | 2012-05-04 | 2019-10-15 | 恩特格里斯公司 | 具有超硬磨料增强的化学机械平坦化修整器衬垫 |
-
2012
- 2012-03-06 SG SG2013067152A patent/SG193340A1/en unknown
- 2012-03-06 CN CN201280022237.9A patent/CN103688343B/zh active Active
- 2012-03-06 EP EP12754519.2A patent/EP2684211B1/en active Active
- 2012-03-06 WO PCT/US2012/027916 patent/WO2012122186A2/en not_active Ceased
- 2012-03-06 US US14/004,152 patent/US9132526B2/en active Active
- 2012-03-06 JP JP2013557810A patent/JP6133218B2/ja active Active
- 2012-03-06 KR KR1020137025682A patent/KR101916492B1/ko active Active
- 2012-03-07 TW TW101107639A patent/TWI592258B/zh active
-
2015
- 2015-08-20 US US14/831,280 patent/US9616547B2/en active Active