SG11202101908TA - Hybrid cmp conditioning head - Google Patents

Hybrid cmp conditioning head

Info

Publication number
SG11202101908TA
SG11202101908TA SG11202101908TA SG11202101908TA SG11202101908TA SG 11202101908T A SG11202101908T A SG 11202101908TA SG 11202101908T A SG11202101908T A SG 11202101908TA SG 11202101908T A SG11202101908T A SG 11202101908TA SG 11202101908T A SG11202101908T A SG 11202101908TA
Authority
SG
Singapore
Prior art keywords
conditioning head
cmp conditioning
hybrid cmp
hybrid
head
Prior art date
Application number
SG11202101908TA
Inventor
Dave Slutz
Original Assignee
Best Engineered Surface Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Best Engineered Surface Technologies Llc filed Critical Best Engineered Surface Technologies Llc
Publication of SG11202101908TA publication Critical patent/SG11202101908TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11202101908TA 2018-08-31 2019-08-02 Hybrid cmp conditioning head SG11202101908TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862725578P 2018-08-31 2018-08-31
GB201816102 2018-10-02
PCT/GB2019/052175 WO2020044011A1 (en) 2018-08-31 2019-08-02 Hybrid cmp conditioning head

Publications (1)

Publication Number Publication Date
SG11202101908TA true SG11202101908TA (en) 2021-03-30

Family

ID=67551394

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202101908TA SG11202101908TA (en) 2018-08-31 2019-08-02 Hybrid cmp conditioning head

Country Status (6)

Country Link
US (1) US20210187696A1 (en)
EP (1) EP3843946A1 (en)
KR (1) KR20210075984A (en)
IL (1) IL281706A (en)
SG (1) SG11202101908TA (en)
WO (1) WO2020044011A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054183A (en) 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US20050025973A1 (en) * 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
WO2006043928A1 (en) * 2004-10-13 2006-04-27 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20080014845A1 (en) * 2006-07-11 2008-01-17 Alpay Yilmaz Conditioning disk having uniform structures
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
JP2011514848A (en) 2008-03-10 2011-05-12 モルガン アドバンスド セラミックス， インコーポレイテッド Non-planar CVD diamond coated CMP pad conditioner and method of manufacturing the same
WO2009152278A2 (en) 2008-06-11 2009-12-17 Advanced Diamond Technologies, Inc. Nano-fabricated structured diamond abrasive article and methods
EP2474025A2 (en) * 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
TWI564116B (en) * 2013-08-12 2017-01-01 Sapphire polishing pad dresser with multiple trimmed pellets

Also Published As

Publication number Publication date
IL281706A (en) 2021-05-31
EP3843946A1 (en) 2021-07-07
KR20210075984A (en) 2021-06-23
US20210187696A1 (en) 2021-06-24
WO2020044011A1 (en) 2020-03-05

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