JP2017508833A - ポリ（アミノ酸）を含む化学機械研磨（ｃｍｐ）組成物 - Google Patents

ポリ（アミノ酸）を含む化学機械研磨（ｃｍｐ）組成物 Download PDF

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Publication number
JP2017508833A
JP2017508833A JP2016549507A JP2016549507A JP2017508833A JP 2017508833 A JP2017508833 A JP 2017508833A JP 2016549507 A JP2016549507 A JP 2016549507A JP 2016549507 A JP2016549507 A JP 2016549507A JP 2017508833 A JP2017508833 A JP 2017508833A
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Prior art keywords
poly
cmp
cmp composition
composition according
particles
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Japanese (ja)
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JP2017508833A5 (enExample
Inventor
ラウター，ミヒャエル
ランゲ，ローラント
マルテン ノラー，バスティアン
マルテン ノラー，バスティアン
ジーベルト，マクス
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BASF SE
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BASF SE
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Publication of JP2017508833A publication Critical patent/JP2017508833A/ja
Publication of JP2017508833A5 publication Critical patent/JP2017508833A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/18—Other polishing compositions based on non-waxy substances on other substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016549507A 2014-01-31 2015-01-21 ポリ（アミノ酸）を含む化学機械研磨（ｃｍｐ）組成物 Pending JP2017508833A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14153454.5 2014-01-31
EP14153454 2014-01-31
PCT/IB2015/050454 WO2015114489A1 (en) 2014-01-31 2015-01-21 A chemical mechanical polishing (cmp) composition comprising a poly(aminoacid)

Publications (2)

Publication Number Publication Date
JP2017508833A true JP2017508833A (ja) 2017-03-30
JP2017508833A5 JP2017508833A5 (enExample) 2018-03-01

Family

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JP2016549507A Pending JP2017508833A (ja) 2014-01-31 2015-01-21 ポリ（アミノ酸）を含む化学機械研磨（ｃｍｐ）組成物

Country Status (9)

Country Link
US (1) US20170166778A1 (enExample)
EP (1) EP3099756A4 (enExample)
JP (1) JP2017508833A (enExample)
KR (1) KR20160114709A (enExample)
CN (1) CN105934487B (enExample)
IL (1) IL246916A0 (enExample)
SG (1) SG11201606157VA (enExample)
TW (1) TW201538700A (enExample)
WO (1) WO2015114489A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017014354A (ja) * 2015-06-30 2017-01-19 日立化成株式会社 研磨液
JP2018059054A (ja) * 2016-09-29 2018-04-12 花王株式会社 研磨液組成物
JP2019099590A (ja) * 2017-11-28 2019-06-24 花王株式会社 研磨液組成物
JP2022552895A (ja) * 2019-10-22 2022-12-20 シーエムシー マテリアルズ，インコーポレイティド 誘電体ｃｍｐのための組成物及び方法
JP7784996B2 (ja) 2019-10-22 2025-12-12 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー 誘電体ｃｍｐのための組成物及び方法

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SG11201807364VA (en) * 2016-03-22 2018-10-30 Basf Se Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or cobalt alloy comprising substrates
US12473457B2 (en) 2017-09-15 2025-11-18 Cmc Materials Llc Composition for tungsten CMP
US10711158B2 (en) * 2017-09-28 2020-07-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them
CN109971357B (zh) * 2017-12-27 2021-12-07 安集微电子（上海）有限公司 一种化学机械抛光液
CN108913038A (zh) * 2018-06-27 2018-11-30 东莞市金林自动化机械科技有限公司 一种用于金的抛光液及其制备方法
JP2022553346A (ja) * 2019-10-22 2022-12-22 シーエムシー マテリアルズ，インコーポレイティド 酸化ケイ素及び炭素ドープ酸化ケイ素ｃｍｐのための組成物並びに方法
WO2021141741A1 (en) * 2020-01-07 2021-07-15 Cmc Materials, Inc. Derivatized polyamino acids
KR102866377B1 (ko) * 2022-01-28 2025-09-29 삼성에스디아이 주식회사 구리 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법

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JP2000109810A (ja) * 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2000109807A (ja) * 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2007503521A (ja) * 2003-05-22 2007-02-22 ハンファ ケミカル コーポレイション 化学機械研磨用セリア微粒子濃縮液およびその製造方法
WO2013035034A1 (en) * 2011-09-07 2013-03-14 Basf Se A chemical mechanical polishing (cmp) composition comprising a glycoside
JP2013541609A (ja) * 2010-09-08 2013-11-14 ビーエーエスエフ ソシエタス・ヨーロピア 電気機器や機械機器・光学機器用の基板の化学機械研磨用の水性研磨組成物と方法

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JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
US7279119B2 (en) * 2001-06-14 2007-10-09 Ppg Industries Ohio, Inc. Silica and silica-based slurry
US20030211747A1 (en) * 2001-09-13 2003-11-13 Nyacol Nano Technologies, Inc Shallow trench isolation polishing using mixed abrasive slurries
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JPWO2009119485A1 (ja) * 2008-03-28 2011-07-21 日立化成工業株式会社 金属用研磨液及びこの研磨液を用いた研磨方法
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Publication number Priority date Publication date Assignee Title
JP2000109810A (ja) * 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2000109807A (ja) * 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2007503521A (ja) * 2003-05-22 2007-02-22 ハンファ ケミカル コーポレイション 化学機械研磨用セリア微粒子濃縮液およびその製造方法
JP2013541609A (ja) * 2010-09-08 2013-11-14 ビーエーエスエフ ソシエタス・ヨーロピア 電気機器や機械機器・光学機器用の基板の化学機械研磨用の水性研磨組成物と方法
WO2013035034A1 (en) * 2011-09-07 2013-03-14 Basf Se A chemical mechanical polishing (cmp) composition comprising a glycoside

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017014354A (ja) * 2015-06-30 2017-01-19 日立化成株式会社 研磨液
JP2018059054A (ja) * 2016-09-29 2018-04-12 花王株式会社 研磨液組成物
JP2019099590A (ja) * 2017-11-28 2019-06-24 花王株式会社 研磨液組成物
JP7045171B2 (ja) 2017-11-28 2022-03-31 花王株式会社 研磨液組成物
JP2022552895A (ja) * 2019-10-22 2022-12-20 シーエムシー マテリアルズ，インコーポレイティド 誘電体ｃｍｐのための組成物及び方法
JP2022553334A (ja) * 2019-10-22 2022-12-22 シーエムシー マテリアルズ，インコーポレイティド 誘電体ｃｍｐのための組成物及び方法
JP7757279B2 (ja) 2019-10-22 2025-10-21 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー 誘電体ｃｍｐのための組成物及び方法
JP7784996B2 (ja) 2019-10-22 2025-12-12 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー 誘電体ｃｍｐのための組成物及び方法

Also Published As

Publication number Publication date
CN105934487A (zh) 2016-09-07
SG11201606157VA (en) 2016-08-30
CN105934487B (zh) 2018-10-26
TW201538700A (zh) 2015-10-16
KR20160114709A (ko) 2016-10-05
IL246916A0 (en) 2016-09-29
EP3099756A4 (en) 2017-08-02
EP3099756A1 (en) 2016-12-07
US20170166778A1 (en) 2017-06-15
WO2015114489A1 (en) 2015-08-06

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