CN105934487B - 包含聚氨基酸的化学机械抛光(cmp)组合物 - Google Patents

包含聚氨基酸的化学机械抛光(cmp)组合物 Download PDF

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Publication number
CN105934487B
CN105934487B CN201580005687.0A CN201580005687A CN105934487B CN 105934487 B CN105934487 B CN 105934487B CN 201580005687 A CN201580005687 A CN 201580005687A CN 105934487 B CN105934487 B CN 105934487B
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China
Prior art keywords
acid
cmp
composition
cmp composition
particles
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Expired - Fee Related
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CN201580005687.0A
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English (en)
Chinese (zh)
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CN105934487A (zh
Inventor
M·劳特尔
R·朗格
B·M·诺勒
M·希伯特
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BASF SE
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BASF SE
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/18—Other polishing compositions based on non-waxy substances on other substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H10P95/064—Planarisation of inorganic insulating materials involving a dielectric removal step the removal being chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
CN201580005687.0A 2014-01-31 2015-01-21 包含聚氨基酸的化学机械抛光(cmp)组合物 Expired - Fee Related CN105934487B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14153454.5 2014-01-31
EP14153454 2014-01-31
PCT/IB2015/050454 WO2015114489A1 (en) 2014-01-31 2015-01-21 A chemical mechanical polishing (cmp) composition comprising a poly(aminoacid)

Publications (2)

Publication Number Publication Date
CN105934487A CN105934487A (zh) 2016-09-07
CN105934487B true CN105934487B (zh) 2018-10-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580005687.0A Expired - Fee Related CN105934487B (zh) 2014-01-31 2015-01-21 包含聚氨基酸的化学机械抛光(cmp)组合物

Country Status (9)

Country Link
US (1) US20170166778A1 (enExample)
EP (1) EP3099756A4 (enExample)
JP (1) JP2017508833A (enExample)
KR (1) KR20160114709A (enExample)
CN (1) CN105934487B (enExample)
IL (1) IL246916A0 (enExample)
SG (1) SG11201606157VA (enExample)
TW (1) TW201538700A (enExample)
WO (1) WO2015114489A1 (enExample)

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JP6627283B2 (ja) * 2015-06-30 2020-01-08 日立化成株式会社 研磨液及び研磨方法
CN108779367B (zh) * 2016-03-22 2021-02-02 巴斯夫欧洲公司 化学机械抛光(cmp)组合物在抛光包含钴和/或钴合金的基材中的用途
JP6957265B2 (ja) * 2016-09-29 2021-11-02 花王株式会社 研磨液組成物
WO2019055749A1 (en) 2017-09-15 2019-03-21 Cabot Microelectronics Corporation COMPOSITION FOR THE CHEMICAL MECHANICAL POLISHING (CMP) OF TUNGSTEN
US10711158B2 (en) * 2017-09-28 2020-07-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them
JP7045171B2 (ja) * 2017-11-28 2022-03-31 花王株式会社 研磨液組成物
CN109971357B (zh) * 2017-12-27 2021-12-07 安集微电子（上海）有限公司 一种化学机械抛光液
CN108913038A (zh) * 2018-06-27 2018-11-30 东莞市金林自动化机械科技有限公司 一种用于金的抛光液及其制备方法
TWI764338B (zh) * 2019-10-22 2022-05-11 美商Ｃｍｃ材料股份有限公司 用於氧化矽和碳摻雜之氧化矽化學機械拋光的組合物及方法
CN114599751A (zh) * 2019-10-22 2022-06-07 Cmc材料股份有限公司 用于介电质化学机械抛光的组合物及方法
KR102859110B1 (ko) * 2020-01-07 2025-09-12 씨엠씨 머티리얼즈 엘엘씨 유도체화된 폴리아미노산
KR102866377B1 (ko) * 2022-01-28 2025-09-29 삼성에스디아이 주식회사 구리 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법

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WO2006001558A1 (en) * 2004-06-25 2006-01-05 Cheil Industires Inc. High selectivity cmp slurry composition for sti process in semiconductor manufacture
CN101463227A (zh) * 2007-12-21 2009-06-24 安集微电子（上海）有限公司 一种用于阻挡层抛光的化学机械抛光液
WO2013035034A1 (en) * 2011-09-07 2013-03-14 Basf Se A chemical mechanical polishing (cmp) composition comprising a glycoside
CN103155112A (zh) * 2010-12-24 2013-06-12 日立化成株式会社 研磨液及使用该研磨液的基板的研磨方法

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JP4744656B2 (ja) * 1998-10-08 2011-08-10 日立化成工業株式会社 Ｃｍｐ研磨剤及び基板の研磨方法
US6319096B1 (en) * 1999-11-15 2001-11-20 Cabot Corporation Composition and method for planarizing surfaces
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
US7279119B2 (en) * 2001-06-14 2007-10-09 Ppg Industries Ohio, Inc. Silica and silica-based slurry
US20030211747A1 (en) * 2001-09-13 2003-11-13 Nyacol Nano Technologies, Inc Shallow trench isolation polishing using mixed abrasive slurries
KR100511943B1 (ko) * 2003-05-22 2005-09-01 한화석유화학 주식회사 화학·기계 연마용 산화세륨 초미립자 농축액 및 이의제조방법
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TWI546373B (zh) * 2008-04-23 2016-08-21 日立化成股份有限公司 研磨劑及其製造方法、基板研磨方法以及研磨劑套組及其製造方法
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CN102268224B (zh) * 2010-06-01 2013-12-04 中国科学院上海微系统与信息技术研究所 可控氧化硅去除速率的化学机械抛光液
JP5965907B2 (ja) * 2010-09-08 2016-08-10 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 電気機器や機械機器・光学機器用の基板の化学機械研磨用の水性研磨組成物と方法

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WO2006001558A1 (en) * 2004-06-25 2006-01-05 Cheil Industires Inc. High selectivity cmp slurry composition for sti process in semiconductor manufacture
CN101463227A (zh) * 2007-12-21 2009-06-24 安集微电子（上海）有限公司 一种用于阻挡层抛光的化学机械抛光液
CN103155112A (zh) * 2010-12-24 2013-06-12 日立化成株式会社 研磨液及使用该研磨液的基板的研磨方法
WO2013035034A1 (en) * 2011-09-07 2013-03-14 Basf Se A chemical mechanical polishing (cmp) composition comprising a glycoside

Also Published As

Publication number Publication date
EP3099756A4 (en) 2017-08-02
SG11201606157VA (en) 2016-08-30
CN105934487A (zh) 2016-09-07
JP2017508833A (ja) 2017-03-30
US20170166778A1 (en) 2017-06-15
EP3099756A1 (en) 2016-12-07
KR20160114709A (ko) 2016-10-05
IL246916A0 (en) 2016-09-29
WO2015114489A1 (en) 2015-08-06
TW201538700A (zh) 2015-10-16

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Granted publication date: 20181026

Termination date: 20200121