JP2017508303A5 - - Google Patents

Download PDF

Info

Publication number
JP2017508303A5
JP2017508303A5 JP2016561588A JP2016561588A JP2017508303A5 JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5 JP 2016561588 A JP2016561588 A JP 2016561588A JP 2016561588 A JP2016561588 A JP 2016561588A JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5
Authority
JP
Japan
Prior art keywords
coating
region
thickness
tapered
support ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016561588A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017508303A (ja
JP6408606B2 (ja
Filing date
Publication date
Priority claimed from US14/218,597 external-priority patent/US9330955B2/en
Application filed filed Critical
Publication of JP2017508303A publication Critical patent/JP2017508303A/ja
Publication of JP2017508303A5 publication Critical patent/JP2017508303A5/ja
Application granted granted Critical
Publication of JP6408606B2 publication Critical patent/JP6408606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016561588A 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング Active JP6408606B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361922451P 2013-12-31 2013-12-31
US61/922,451 2013-12-31
US14/218,597 2014-03-18
US14/218,597 US9330955B2 (en) 2013-12-31 2014-03-18 Support ring with masked edge
PCT/US2014/067367 WO2015102781A1 (en) 2013-12-31 2014-11-25 Support ring with masked edge

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018176528A Division JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Publications (3)

Publication Number Publication Date
JP2017508303A JP2017508303A (ja) 2017-03-23
JP2017508303A5 true JP2017508303A5 (OSRAM) 2018-01-18
JP6408606B2 JP6408606B2 (ja) 2018-10-17

Family

ID=53482656

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016561588A Active JP6408606B2 (ja) 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Country Status (6)

Country Link
US (4) US9330955B2 (OSRAM)
JP (2) JP6408606B2 (OSRAM)
KR (3) KR102279150B1 (OSRAM)
CN (2) CN110223949B (OSRAM)
TW (3) TWI594361B (OSRAM)
WO (1) WO2015102781A1 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103649158B (zh) * 2011-05-13 2016-04-06 陶氏环球技术有限责任公司 绝缘制剂
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
JP2020516770A (ja) 2017-04-07 2020-06-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板端部上のプラズマ密度制御
CN107121892B (zh) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 一种基板曝边设备
CN111819679A (zh) * 2018-03-13 2020-10-23 应用材料公司 具有等离子体喷涂涂层的支撑环
CN110920254B (zh) 2018-09-19 2021-03-16 精工爱普生株式会社 打印头控制电路及液体喷出装置
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
US20250305141A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217561A (ja) * 1985-03-25 1986-09-27 Sumitomo Metal Ind Ltd Ｎｉ基合金の製造方法
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5848889A (en) * 1996-07-24 1998-12-15 Applied Materials Inc. Semiconductor wafer support with graded thermal mass
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6530994B1 (en) 1997-08-15 2003-03-11 Micro C Technologies, Inc. Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
DE69813014T2 (de) 1997-11-03 2004-02-12 Asm America Inc., Phoenix Verbesserte kleinmassige waferhaleeinrichtung
US6200388B1 (en) * 1998-02-11 2001-03-13 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
US6280183B1 (en) * 1998-04-01 2001-08-28 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
US6383931B1 (en) * 2000-02-11 2002-05-07 Lam Research Corporation Convertible hot edge ring to improve low-K dielectric etch
KR20010087542A (ko) 2000-03-07 2001-09-21 윤종용 반도체 확산 공정용 석영 보트의 웨이퍼 지지장치
KR20020073814A (ko) * 2001-03-16 2002-09-28 삼성전자 주식회사 웨이퍼 열처리 장치
JP4323764B2 (ja) * 2002-07-16 2009-09-02 大日本スクリーン製造株式会社 熱処理装置
JP4067858B2 (ja) * 2002-04-16 2008-03-26 東京エレクトロン株式会社 Ａｌｄ成膜装置およびａｌｄ成膜方法
US7734439B2 (en) 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7704327B2 (en) 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US7241345B2 (en) 2003-06-16 2007-07-10 Applied Materials, Inc. Cylinder for thermal processing chamber
EP1654752B1 (en) * 2003-08-01 2011-06-29 SGL Carbon SE Holder for supporting wafers during semiconductor manufacture
JPWO2005017988A1 (ja) * 2003-08-15 2006-10-12 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
US6888104B1 (en) * 2004-02-05 2005-05-03 Applied Materials, Inc. Thermally matched support ring for substrate processing chamber
US7648579B2 (en) * 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
KR100733269B1 (ko) * 2005-08-18 2007-06-28 피에스케이 주식회사 반도체 식각 장비의 척 조립체
WO2007139141A1 (ja) * 2006-05-31 2007-12-06 Tokyo Electron Limited 絶縁膜の形成方法および半導体装置の製造方法
WO2008038788A1 (en) * 2006-09-29 2008-04-03 Tokyo Electron Limited Method for forming silicon oxide film, plasma processing apparatus and storage medium
JP5238688B2 (ja) * 2007-03-28 2013-07-17 東京エレクトロン株式会社 Ｃｖｄ成膜装置
KR100856019B1 (ko) * 2008-02-22 2008-09-02 (주)타이닉스 플라즈마 처리장치의 기판 홀더
JP2010114190A (ja) 2008-11-05 2010-05-20 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法および光電変換装置
KR100940544B1 (ko) 2009-07-01 2010-02-10 (주)앤피에스 기판 지지 유닛
DE202010015933U1 (de) * 2009-12-01 2011-03-31 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Eine Randringanordnung für Plasmaätzkammern
US8744250B2 (en) * 2011-02-23 2014-06-03 Applied Materials, Inc. Edge ring for a thermal processing chamber
US8979087B2 (en) 2011-07-29 2015-03-17 Applied Materials, Inc. Substrate supporting edge ring with coating for improved soak performance
PT2891174T (pt) * 2012-08-31 2019-11-20 Semiconductor Tech & Instruments Pte Ltd Sistema e método para correcção automática do desalinhamento rotational de pastilhas em molduras de filme
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Similar Documents

Publication Publication Date Title
JP2017508303A5 (OSRAM)
JP2016530705A5 (OSRAM)
SG10201810390TA (en) Thermal processing susceptor
TW201612974A (en) Proximity contact cover ring for plasma dicing
JP2016207806A5 (OSRAM)
SG11202006623YA (en) Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features
JP2016530730A5 (OSRAM)
WO2019099171A3 (en) Fabrication methods
JP1704964S (ja) プラズマ処理装置用サセプタリング
JP6408606B2 (ja) マスキングされたエッジを有する支持リング
MY177495A (en) Wafer thinning method
TW201614728A (en) Substrate processing method
JP2016534558A5 (OSRAM)
CA2992804C (en) Method for manufacturing a membrane assembly
PH12020551137A1 (en) Deposition ring for processing reduced size substrates
MY179205A (en) Wafer and method of processing wafer
JP2014175535A5 (OSRAM)
JP2016109176A5 (OSRAM)
TWD186396S (zh) 電漿處理裝置用環
WO2015126575A8 (en) Silicon carbide semiconductor device, and methods for manufacturing thereof
TW201613009A (en) Semiconductor manufacturing device and method for manufacturing semiconductor device
JP2016004983A5 (OSRAM)
EP3078762A3 (en) Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer
EP3521264A4 (en) SILICON CARBIDE ELEMENT FOR PLASMA TREATMENT APPARATUS, AND MANUFACTURING METHOD THEREOF
JP2016527398A5 (ja) フレキシブル基板処理装置の処理チャンバの洗浄方法及び洗浄を実施するための装置及びそこで使用するためのロール